JPH04145693A - Slurry manufacture of multilayer wiring board - Google Patents
Slurry manufacture of multilayer wiring boardInfo
- Publication number
- JPH04145693A JPH04145693A JP2269783A JP26978390A JPH04145693A JP H04145693 A JPH04145693 A JP H04145693A JP 2269783 A JP2269783 A JP 2269783A JP 26978390 A JP26978390 A JP 26978390A JP H04145693 A JPH04145693 A JP H04145693A
- Authority
- JP
- Japan
- Prior art keywords
- binder
- inorganic powder
- solution
- slurry
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002002 slurry Substances 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000011230 binding agent Substances 0.000 claims abstract description 33
- 239000006185 dispersion Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 238000004898 kneading Methods 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 abstract description 6
- 239000003960 organic solvent Substances 0.000 abstract description 5
- 239000010419 fine particle Substances 0.000 abstract 5
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Preparation Of Clay, And Manufacture Of Mixtures Containing Clay Or Cement (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、複数のグリーンシートを積層したのちに一括
焼成するグリーンシート多層配線基板の製造方法に関し
、特にスラリーを製造する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a green sheet multilayer wiring board in which a plurality of green sheets are laminated and then fired all at once, and particularly relates to a method for manufacturing a slurry.
従来、この種の多層配線基板のスラリー製造方法は第２
図のフローチャートで示すように、まず原料の無機粉末
に溶剤を加え混合をおこなって、溶剤中に無機粉末を十
分分散させた後、バインダーを加え、さらに混合機によ
ってバインダーが溶剤に完全に溶けた状態になるように
混合・混線を行なっていた。Conventionally, the slurry manufacturing method for this type of multilayer wiring board is the second method.
As shown in the flowchart in the figure, first, a solvent is added to the raw inorganic powder and mixed. After the inorganic powder is sufficiently dispersed in the solvent, a binder is added, and a mixer is used to completely dissolve the binder in the solvent. They were mixing and cross-talking to achieve the desired condition.
溶剤中に無機粉末を分散させると分散溶液は不透明な乳
白色となる。また、バインダーが完全に溶剤に溶解する
と溶液は透明となる。つまり、バインダーが溶解したか
どうか溶液の透明度によって判断することができる。When an inorganic powder is dispersed in a solvent, the dispersion becomes opaque and milky white. Furthermore, when the binder is completely dissolved in the solvent, the solution becomes transparent. In other words, whether the binder has dissolved or not can be determined based on the transparency of the solution.
上述した従来のスラリー製造方法によれば、無機粉末を
分散させた不透明な溶剤中にバインダー／ぐ
を加え溶解させるため、Ｉインダーが完全溶解したかど
うか判断する事が困難である。また、バインダーを溶解
させるために長時間に渡って混合・混線を行うため無機
粉末の凝集が起こり初期の粉末特性、特に粒度分布が変
化してしまいグリーンシートと作成が困難になる等の問
題点があった。According to the conventional slurry manufacturing method described above, since the binder/glue is added and dissolved in an opaque solvent in which inorganic powder is dispersed, it is difficult to judge whether or not the I-inder is completely dissolved. In addition, since mixing and cross-fertilization are carried out for a long time to dissolve the binder, the inorganic powder aggregates, which changes the initial powder properties, especially the particle size distribution, making it difficult to create green sheets. was there.
本発明の多層配線基板のスラリー製造方法は、複数のグ
リーンシートを積層したのちに一括焼成するグリーンシ
ート多層配線基板のスラリー製造工程に於て、バインダ
ーを溶剤に溶解させバインダー溶液を作る第１の工程と
、無機粉末と溶剤を混合し無機粉末分散液を製造する第
２の工程と、前記バインダー溶液と無機粉末分散液を混
合・混練する第３の工程とを有している。The slurry manufacturing method for a multilayer wiring board according to the present invention includes a step of manufacturing slurry for a green sheet multilayer wiring board in which a plurality of green sheets are laminated and then fired all at once, in which a binder is dissolved in a solvent to form a binder solution. a second step of mixing an inorganic powder and a solvent to produce an inorganic powder dispersion, and a third step of mixing and kneading the binder solution and the inorganic powder dispersion.
次に、本発明について図面を参照して説明する６
第１図は本発明の一実施例を示すフローチャートである
。Next, the present invention will be explained with reference to the drawings.6 Figure 1 is a flowchart showing one embodiment of the present invention.
まず、混合機であるホモジナイザーにバインダー１００
ｇに対して４００ｍ１の有機溶剤（本実施例ではエチル
セルソルブを使用した）を加え、８０００ｒｐｍで３０
分間混合し完全にバインダーが溶解したのを確認しバイ
ンダー溶液を得た。First, add 100 binders to a homogenizer, which is a mixer.
Add 400 ml of an organic solvent (ethyl cellosolve was used in this example) per g, and stir at 8000 rpm for 30
After mixing for a minute and confirming that the binder was completely dissolved, a binder solution was obtained.
次に、他のホー４イザーに無機粉末９００ｇに対して有
機溶剤５００ｍ１を加え１５０００ｒｐｍで２１０分間
混合・分散させ無機粉末分散溶液を得た。次に、バイン
ダー溶液と無機粉末分散溶液を混合しさらにホモジナイ
ザーにて８０００ｒｐｍで３０分間混合・混練をおこな
ってスラリーをえた。Next, 500 ml of an organic solvent was added to 900 g of the inorganic powder in another hose, and the mixture was mixed and dispersed at 15,000 rpm for 210 minutes to obtain an inorganic powder dispersion solution. Next, the binder solution and the inorganic powder dispersion solution were mixed and further mixed and kneaded using a homogenizer at 8000 rpm for 30 minutes to obtain a slurry.
本スラリーは完全にバインダーが溶解しており無機粉末
の分散状態の良好なスラリーであり、グリーンシートを
作成しても膜厚が均一で良好なシートを得ることが出来
た。In this slurry, the binder was completely dissolved and the inorganic powder was well dispersed, and even when a green sheet was made, it was possible to obtain a good sheet with a uniform thickness.
次に、従来のスラリー製造方法である第２図に示す従来
のフローチャートによって行った実験の結果を記す。Next, the results of experiments conducted using the conventional flowchart shown in FIG. 2, which is a conventional slurry manufacturing method, will be described.
まず、混合機であるホモジナイザーに無機粉末９００ｇ
に対して有機溶剤を９００ｍ１を加え１５０００ｒｐｍ
で２１０分間混合・分散を行った。そしてバインダー１
００ｇを加え、さらに８０００ｒｐｍで６０分間混合・
混練を行いスラリーを得た。バインダー溶解を調査する
ために本スラリーを顕微鏡によって調べたところ微小な
未溶バインダー粒を確認する事ができた。そして、バイ
ンダーが完全に溶解するまでさらに１２０分間の混合・
混練が必要であった。こうして合計１８０分間と混合・
混練を行ってバインダーが完全に溶解したスラリーを得
ることが出来たが、本スラリーは粉末の凝集による影響
と思われる粘度低下が発生し、グリーンシートを作成し
た際に良好なシートを得る事が困難であった。First, add 900 g of inorganic powder to a homogenizer, which is a mixer.
Add 900ml of organic solvent to the
Mixing and dispersion were performed for 210 minutes. and binder 1
00g and mix for 60 minutes at 8000rpm.
Kneading was performed to obtain a slurry. When this slurry was examined under a microscope to investigate binder dissolution, minute undissolved binder grains were confirmed. Mix for an additional 120 minutes until the binder is completely dissolved.
Kneading was necessary. In this way, for a total of 180 minutes, mixing and
Although we were able to obtain a slurry in which the binder was completely dissolved by kneading, the viscosity of this slurry decreased, probably due to the agglomeration of the powder, and it was difficult to obtain a good green sheet when making it. It was difficult.
以上説明したように本発明は、多層配線基板のスラリー
製造工程をバインダーを溶剤に溶解させバインダーを製
造する第１の工程、無機粉末と溶剤を混合し無機粉末分
散液を製造する第２の工程、前記バインダー溶液と無機
粉末分散を混合・混練する第３の工程、以上３つの工程
から構成する事によってバインダーが溶剤に完全に溶け
て且つ無機粉末が均一に分散したスラリーを得ることが
できる。As explained above, the present invention includes a slurry production process for a multilayer wiring board, including a first process of dissolving a binder in a solvent to produce a binder, and a second process of mixing an inorganic powder and a solvent to produce an inorganic powder dispersion. and a third step of mixing and kneading the binder solution and the inorganic powder dispersion.By comprising the above three steps, it is possible to obtain a slurry in which the binder is completely dissolved in the solvent and the inorganic powder is uniformly dispersed.
第１図は本発明の一実施例を示すフローチャートである
。第２図は従来の多層配線基板のスラリー製造方法を示
すフローチャートである。FIG. 1 is a flowchart showing one embodiment of the present invention. FIG. 2 is a flowchart showing a conventional slurry manufacturing method for a multilayer wiring board.
Claims (1)
グリーンシート多層配線基板のスラリー製造工程に於て
、バインダーを溶剤に溶解させバインダー溶液を作る第
１の工程と、無機粉末と溶剤を混合し無機粉末分散液を
製造する第２の工程と、前記バインダー溶液と無機粉末
分散液を混合・混練する第３の工程とを含むことを特徴
とする多層配線基板のスラリー製造方法。In the slurry manufacturing process for green sheet multilayer wiring boards, in which multiple green sheets are laminated and then fired all at once, the first step is to dissolve the binder in a solvent to create a binder solution, and the second step is to mix inorganic powder and a solvent to create an inorganic powder. A method for producing slurry for a multilayer wiring board, comprising a second step of producing a dispersion, and a third step of mixing and kneading the binder solution and the inorganic powder dispersion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2269783A JPH04145693A (en) | 1990-10-08 | 1990-10-08 | Slurry manufacture of multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2269783A JPH04145693A (en) | 1990-10-08 | 1990-10-08 | Slurry manufacture of multilayer wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04145693A true JPH04145693A (en) | 1992-05-19 |
Family
ID=17477097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2269783A Pending JPH04145693A (en) | 1990-10-08 | 1990-10-08 | Slurry manufacture of multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04145693A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007137741A (en) * | 2005-11-22 | 2007-06-07 | Matsushita Electric Ind Co Ltd | Manufacturing method of ceramic slurry |
| WO2010113628A1 (en) * | 2009-03-31 | 2010-10-07 | 積水化学工業株式会社 | Method for producing slurry composition |
| WO2012043273A1 (en) * | 2010-09-29 | 2012-04-05 | 積水化学工業株式会社 | Method for producing slurry composition |
| JP2012072057A (en) * | 2010-09-01 | 2012-04-12 | Sekisui Chem Co Ltd | Method for producing slurry composition |
| JP2012072056A (en) * | 2010-08-31 | 2012-04-12 | Sekisui Chem Co Ltd | Method for producing slurry composition |
| JP2012092002A (en) * | 2010-09-29 | 2012-05-17 | Sekisui Chem Co Ltd | Method for manufacturing slurry composition |
-
1990
- 1990-10-08 JP JP2269783A patent/JPH04145693A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007137741A (en) * | 2005-11-22 | 2007-06-07 | Matsushita Electric Ind Co Ltd | Manufacturing method of ceramic slurry |
| EP2415731A4 (en) * | 2009-03-31 | 2012-07-25 | Sekisui Chemical Co Ltd | Method for producing slurry composition |
| EP2415731A1 (en) * | 2009-03-31 | 2012-02-08 | Sekisui Chemical Co., Ltd. | Method for producing slurry composition |
| CN102361835A (en) * | 2009-03-31 | 2012-02-22 | 积水化学工业株式会社 | Method for producing slurry composition |
| JP4909435B2 (en) * | 2009-03-31 | 2012-04-04 | 積水化学工業株式会社 | Method for producing slurry composition |
| WO2010113628A1 (en) * | 2009-03-31 | 2010-10-07 | 積水化学工業株式会社 | Method for producing slurry composition |
| US9056801B2 (en) | 2009-03-31 | 2015-06-16 | Sekisui Chemical Co., Ltd. | Method for producing slurry composition |
| TWI496831B (en) * | 2009-03-31 | 2015-08-21 | Sekisui Chemical Co Ltd | A method for producing a slurry composition |
| JP2012072056A (en) * | 2010-08-31 | 2012-04-12 | Sekisui Chem Co Ltd | Method for producing slurry composition |
| JP2012072057A (en) * | 2010-09-01 | 2012-04-12 | Sekisui Chem Co Ltd | Method for producing slurry composition |
| WO2012043273A1 (en) * | 2010-09-29 | 2012-04-05 | 積水化学工業株式会社 | Method for producing slurry composition |
| JP2012092002A (en) * | 2010-09-29 | 2012-05-17 | Sekisui Chem Co Ltd | Method for manufacturing slurry composition |
| US9023930B2 (en) | 2010-09-29 | 2015-05-05 | Sekisui Chemical Co., Ltd. | Method for producing slurry composition |
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