JPH04142753A - Film carrier - Google Patents

Abstract

PURPOSE:To enable a lead to be protected against deformation and improved in yield by a method wherein a deformation absorbing opening is provided to both the lengthwise sides of a tape adjacent to the IC chip mounting opening of the tape. CONSTITUTION:Slit-shaped deformation absorbing rectangular openings 32 are provided to a film carrier 31. Two openings 32 are provided to each IC chip mounting opening 18 and disposed between the side edges of a tape 17 and the opening 18. The deformation absorbing openings 32 are located outside outer leads 22 extending nearly parallel to two IC chip mounting openings 18 along the lengthwise direction of the tape 17. The deformation absorbing opening 32 is set slightly larger than the opposed one of the IC chip mounting openings 18 in length. Every two deformation absorbing openings 32 correspondent to the IC chip mounting openings 18 are set parallel and opposed to each other.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Field of Application) The present invention is characterized by forming a wiring pattern on a cine film-like tape body, for example, using TAB (Tape Auto
The present invention relates to a film carrier used in the manufacture of bonded parts.

(Prior Art) In general, an inner lead bonding apparatus as shown in FIG. 4 is known. In FIG. 4, 1 is a feed-out reel that feeds out the film carrier 2, and 3 is a take-up reel that winds up the film carrier 2.

Further, reference numeral 4 denotes a film carrier conveyance path between the feed reel and the take-up reel, and a bonding section 5 is disposed on this film carrier conveyance path 4.

A tape guide 6 for a film carrier is disposed in the bonding section 5, a bonding tool 7 is disposed above the tape guide 6, and a mounting table 9 for an IC chip 8 is disposed below.

Further, a feed reel 1 is disposed on the film carrier conveyance path 4.
A pair of fixed rollers 10a, 1 are provided between the tape guide 6 and the tape guide 6.
0b, a tension roller 11 and a feeding sprocket 12 are respectively arranged, and a take-up reel 3
A pair of fixed rollers 13a are provided between the tape guide 6 and the tape guide 6.
13b, a tension roller 14, and a feeding sprocket 15 are respectively provided.

In this case, the feeding sprocket 15 is connected to a pulse motor via a speed reduction mechanism, and is rotationally driven by the pulse motor. Further, perforations 16 formed on both sides of the film carrier 2 are engaged with the teeth of the feeding sprocket 15, and the film carrier 2 is driven to feed as the feeding sprocket rotates.

Further, the structure of the film carrier 2 is as follows.

As part of the film carrier 2 is shown in FIG. 5, the film carrier 2 is composed of a long cine film-like tape body 17 made of polyimide, for example. The film carrier 2 has rectangular IC chip mounting openings 18 located at the center of the tape body 17 in the width direction and arranged at approximately equal intervals in the longitudinal direction.
···have. Furthermore, the film carrier 2 is
It has punching openings 19 arranged along the four sides of each IC chip mounting opening 18.

Further, the film carrier 2 has a wiring pattern made of a plurality of copper foil leads 20 on the tape body 17, and the leads 20 are arranged around each IC chip mounting opening 18. They are arranged radially. The film carrier 2 has leads 20 extending in four directions, and the leads 20 are arranged parallel to each other in each direction.

The film carrier 2 has one end of each lead 20 set as an inner lead part 21 that protrudes inside the IC chip mounting opening 18, and the other end that extends across the punching opening 19. Outer lead portion 22 extending in...
is set to .

Then, the film carrier 2 sequentially stops the IC chip mounting opening 18 at the bonding section 5. moreover,
The film carrier 2 uses the bonding tool 7 to attach the inner lead portions 21 to the ICs supplied on the mounting table 9.
The IC chip 8 is pressed and crimped against the electrodes of the chip 8.
is attached to the IC chip attachment opening 18. The film carrier 2 has fixed rollers 10a, 10b, 13
a.

13b, etc., the IC chips 8 are fed by the feeding sprocket 1215 and run, and the mounted IC chips 8 are conveyed to the take-up reel 3 side.

(Problem to be Solved by the Invention) By the way, the rigidity of the tape body 17 and the leads 20...
The rigidity is smaller than that of the C-chip 8. Then, the film carrier 2 is loaded with various reels 1.3 and various rollers (10a, 10
b, 13a, 13b, etc.) and feed sprocket 1
2. When the tape body 17 and the lead 20 are bent in contact with
It is conceivable that the corner edges of the C chip 8 come into contact with the leads, causing a short circuit failure.

Since the IC chip 8 is held on the tape body 17 only through the leads 20...
When the IC chip 8 is deformed, the IC chip 8 is easily displaced, and the corner edges come into contact with the leads 2o.

Therefore, various reels 1.3 and various rollers (10a,
10b, 13a, 13b, etc.) and the feed sprocket 12.15, etc., by setting the diameter dimensions as large as possible.
Deformation of the tape body 17 and leads 20 is suppressed to a small level.

However, with the increase in the number of pins of IC components, IC chips having a size of 1Q mm square or more are sometimes used. In this case, various reels 1.3 and various rollers (10a, 10b) are used depending on the size of the IC chip.

13a, 13b, etc.) and a feed sprocket 12.
If the diameter size of the film carrier 2 is set large, the device for conveying the film carrier 2 will become larger.

Furthermore, if the leads 20 are deformed, the leads 20 will need to be molded in the next step after the inner lead bonding process, that is, the botting process in which the IC chip 8 is covered with resin or the like to protect it. , the number of manufacturing processes for semiconductor devices will increase.

The purpose of the present invention is to prevent lead deformation,
An object of the present invention is to provide a film carrier that can improve yield.

[Structure of the Invention (Means and Effects for Solving the Problems) In order to achieve the above object, the present invention provides a film-like tape body with a plurality of openings for mounting IC chips along the longitudinal direction of the tape body. A plurality of leads are arranged on the tape body to form a wiring pattern, one end of the plurality of leads are made to protrude, and one end of the plurality of leads are respectively connected to the electrodes of the IC chip.
In a film carrier that transports chips with chips attached to IC chip mounting openings, deformation absorbing openings are provided on both sides of the tape body in the longitudinal direction near each IC chip mounting opening of the tape body. .

By doing so, the present invention is capable of preventing lead deformation and improving yield.

(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 to 3. Components that are the same as those described in the prior art section are given the same numerals and their explanations will be omitted.

FIG. 1 shows an embodiment of the present invention, and numeral 31 in the figure indicates a film carrier. The film carrier 31 includes a cine film-like tape body 17 made of polyimide or the like and having perforations 16 arranged in parallel on both side edges thereof. Furthermore, film carrier 2
has rectangular IC chip mounting openings 18, which are arranged at approximately equal intervals along the longitudinal direction of the tape body 17.

Further, the film carrier 31 includes a plurality of leads 20 made of copper foil on one side of the tape body 17, and each IC
It has a wiring pattern formed for each chip mounting opening 18. Furthermore, the film carrier 31 is
Leads 20 are connected to each IC chip mounting opening 18.
They are arranged radially around the area. The film carrier 31 extends the leads 20 in four directions substantially orthogonal to each of the IC chip mounting openings 18, and is arranged parallel to each other in each direction.

Further, the film carrier 31 has one end side of each lead 20 set as an inner lead part 21 that protrudes inside the IC chip mounting opening 18, and the other end side is set as an inner lead part 21 that projects inside the IC chip mounting opening 18.
The outer lead portions 22 are set to extend outward from the chip mounting opening 18.

Further, the film carrier 31 is provided with a rectangular slit-shaped deformation absorbing opening 32 . Two deformation absorbing openings 32 are provided for each IC chip mounting opening 18, and two deformation absorbing openings 32 are provided for each IC chip mounting opening 18.
7 and the IC chip mounting opening 18. The deformation absorbing openings 32... are located outside the outer lead portions 22..., and the I
It extends substantially parallel to the two pieces of the C-chip mounting opening 18 and along the longitudinal direction of the tape body 17 .

Further, the longitudinal dimension of the deformation absorbing openings 32 is set to be somewhat larger than, for example, the dimension of the opposing piece of each month of the IC chip mounting opening 18. 2 corresponding to each IC chip mounting opening 18.
The deformation absorbing openings 32 face each other substantially parallel to each other.

That is, the above-described film carrier 31 is attached to, for example, an inner lead bonding device while being wound around a feeding reel, and is fed out from the feeding reel and wound onto a take-up reel. Furthermore, the film carrier 31 is
The film carrier comes into contact with various rollers and sprockets on the conveyance path, and is fed by various rollers and feeding sprockets.

Then, the film carrier 31 is supplied with the IC chip 8 at the bonding part, and the inner lead parts 21 are crimped onto, for example, gold-plated electrodes of the IC chip 8.
Attach the C chips 8 in order.

Further, when the part of the film carrier 31 on which the IC chip 8 is mounted comes into contact with various rollers, sprockets, etc., this part receives a bending force of a value corresponding to the curvature of the various rollers, feeding sprockets, etc.

However, the deformation absorbing openings 32, 32 absorb the bending force, and as shown in FIGS.・Various rollers, feeding sprockets, etc. (
In FIGS. 2 and 3, it is inserted into a concave portion 33 formed on the outer periphery of the feed sprocket (°15).

Then, the IC chip mounting opening 18 of the tape body 17
This prevents bending force from being applied to the parts around the IC chip mounting opening 18 and the leads 2o, and keeps the parts around the IC chip mounting opening 18 and the leads 2o horizontal.

Therefore, it is possible to prevent the leads 2o from being deformed by receiving bending forces from various rollers, feeding sprockets, reels, etc. And tape body 1. It is possible to prevent short-circuit defects caused by contact between the corner edges of the IC chip 8 and the leads due to the -7 curvature, thereby improving yield.

For example, even when mounting a large IC chip 8 exceeding 10 mm in size, deformation of the leads can be prevented without increasing the curvature of various rollers, feeding sprockets, reels, etc. can.

Furthermore, deformation of the leads can be prevented without modifying the device for running the film carrier 31.

In this embodiment, the shape of the deformation absorbing opening 32 is a rectangular slit, but the present invention is not limited to this, and the shape of the deformation absorbing opening 32 is, for example, a sewing machine. It can also be used in the form of eyes.

Further, as shown in FIG. 4, a plurality of types of IC chips 41.
When the present invention is applied to a multi-chip type film carrier 45 in which 42, 43, 44 can be attached to one wiring pattern, each component 41, 42, 43, 44 is connected to a lead (not shown). (not included) can be totally protected by deformation-absorbing openings 46.46.

Furthermore, by extending the deformation absorbing openings 46, 46 in the longitudinal direction of the tape body 17 and arranging them so as not to cross between the parts 41 to 44, it is possible to punch out the TAB parts from the tape body 17, and to punch out the TAB parts from the tape body 17. It is easy to pick up and handle the removed TAB parts.

[Effects of the Invention] As explained above, the present invention provides a film-like tape body with a plurality of IC chip mounting openings arranged in parallel along the longitudinal direction of the tape body, and a plurality of leads arranged on the tape body. to form a wiring pattern, protrude one end of the
In a film carrier in which one end of a plurality of leads is connected to the electrodes of the chip, a 1c chip is mounted in an opening for mounting an IC chip, and transported.
Deformation absorbing openings are provided on both longitudinal sides of the tape body in the vicinity of the chip mounting opening.

Therefore, the present invention has the effect of preventing lead deformation and improving yield.

[Brief explanation of drawings]

Figures 1 to 3 show one embodiment of the present invention.
The figure is a perspective view schematically showing the curved part, Figure 12 is a schematic diagram of the curved part cut in the width direction, and Figure 3 is a schematic diagram of the curved part cut in the longitudinal direction. Figure 4 is a plan view showing a modified example, Figures 5 to 7 are
The figures show a conventional example: Fig. 5 is a schematic configuration diagram showing an inner lead bonding device, Fig. 6 is a plan view showing the main parts of the film carrier, and Fig. 7 shows the curved part of the film carrier in the longitudinal direction. FIG. 1...Feeding reel, 3...Take-up reel, 8...I
C chip, 17... Tape body, 18... Opening for IC chip attachment, 20... Lead, 31... Film carrier, 32... Opening for deformation absorption.

Claims (1)

[Claims] A plurality of IC chip mounting openings are arranged in a film-like tape body along the longitudinal direction of the tape body, and a plurality of leads are arranged on the tape body to form a wiring pattern,
A film carrier in which one end portion of the plurality of leads is made to protrude, one end portion of the plurality of leads is connected to an electrode of an IC chip, and the IC chip is mounted in the opening for mounting the IC chip and transported. A film carrier characterized in that deformation absorbing openings are provided on both longitudinal sides of the tape body in the vicinity of each IC chip mounting opening of the tape body.