JPH04139866A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To shorten the delivery time, reduce the cost, and stabilize rear potential of a semiconductor chip through common use of inner leads by previously manufacturing inner leads in a reticulated shape and removing unnecessary parts from the leads. CONSTITUTION:A required inner lead shape is obtained by removing unnecessary parts from previously formed reticulated inner leads 1 and a semiconductor chip 2 is connected with outer lead pins 3 with the inner leads thus formed. The inner leads 1 thus formed are connected to rear leads 5 for stabilizing rear potential with the pins 3 in between. Therefore, the cost of semiconductor integrated circuit devices can be reduced and the rear potential of semiconductor chips can be stabilized, because the reticulated inner leads 1 can be used commonly to various kinds of semiconductor integrated circuit devices and the manufacture of a specific inner lead to each semiconductor integrated circuit device becomes unnecessary.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the assembly of semiconductor integrated circuit devices.

[Prior Art] Figure 6 shows a semiconductor integrated circuit device assembled using conventional inner leads, where (1) is an inner lead, (2) is a semiconductor chip, and (3) is an assembled semiconductor integrated circuit device. The external lead pin (4) is a sealing resin.0 Figure 7 shows the inner lead (
t) is an enlarged partial enlarged view of f.

Next, the operation will be explained. In FIG.

Connect the semiconductor chip (2) to the inner lead fl),
Fix the semiconductor chip (2). Inner lead (11)
is connected to an external lead bin (3) and sealed with a sealing resin (4).

The semiconductor chip (2) has an inner lead (1) and an outer lead.
It is connected to an external circuit C (not shown) by a dobbin (3) and processes signals. The size of the semiconductor chip (2) is determined by the circuit that processes the signal, the position of the signal extraction PAD changes variously, and the external lead pin (3) also changes depending on the number of signals processed. Due to 3), it is necessary to manufacture each inner lead (1) exclusively.

[Problem to be solved by the invention]

Conventional semiconductor integrated circuit devices have grooves as described above.1 Therefore, it is necessary to combine the semiconductor chip and external lead pins and create a special inner lead, which takes two hours and takes two hours to manufacture. However, it is difficult to use in semiconductor integrated circuit devices that require short delivery times, and manufacturing costs are high because each device is manufactured specifically for each device, and there is a lot of waste in semiconductor integrated circuit devices that are produced in small quantities. It is necessary to consider sharing the inner lead in consideration of delivery time and cost, and there are problems such as the need to stabilize the backside potential of the T-hole where the backside of the semiconductor chip is not connected to anything. Kaatsu fko.

This invention has been painstakingly accomplished to solve the above-mentioned problems, and provides a semiconductor integrated circuit that can shorten delivery time and reduce costs by sharing inner leads, as well as stabilizing the backside potential of a semiconductor chip. The purpose is to obtain equipment.

[First Means for Solving the Problems] The semiconductor integrated circuit device according to the present invention has a mesh-like inner lead manufactured in advance and an unnecessary portion thereof removed to form the inner lead. ,
The semiconductor chip is connected by sandwiching the inner lead to the back surface lead that is electrically connected to the back surface of the chip (this makes it possible to share the inner lead and to secure the back surface potential of the semiconductor chip and make it redundant).

[Effect]

In the semiconductor integrated circuit device of the present invention, a desired shape of the inner lead is formed by removing unnecessary portions of the inner lead, which is previously formed into a mesh shape, and the semiconductor chip and external lead pins are connected to each other.

By sandwiching and connecting this formed inner lead with a back surface lead that stabilizes the potential on the back surface of the chip, the potential on the back surface of the chip is taken and stabilized.

The back leads are formed and also serve to strengthen the inner leads.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a cross-sectional view showing the assembled state of a semiconductor integrated circuit device that is an embodiment of the present invention. In the figure, (1) is an inner lead, (2) is a semiconductor chip, (3) is an external lead pin, and (4) is an inner lead. is a sealing resin, and (5) is a back surface lead for back surface potential.

FIG. 2 is a partially enlarged view of the inner lead C1l in FIG. 1 (here, (1) is the inner lead and (2) is the semiconductor chip.

Figure 3 is an explanatory diagram showing a state in which unnecessary parts of the inner lead have been removed. In the figure, 11) is the inner lead,
(2) is a semiconductor chip, and (3) is an external lead pin.

c211 are semiconductor chips of different sizes.

FIG. 4 is a plan view of the back surface lead (5) that takes the back surface potential.

Next, the operation (I will explain the details. In Fig. 1, the inner lead (1) & semiconductor chip (2) are connected and the semiconductor chip (2) is fixed. The inner lead f11 is connected to the external lead pin (3). Also, connect the back surface potential lead (5) to the back surface of the semiconductor chip (2), and connect the external lead pin (3) with the same potential as the back surface potential.Finally, seal this with sealing resin (4). Inner lead (1)
Initially, it has a mesh shape as shown in Figure 2. This inner lead [1] is determined by the location of the connection point on the semiconductor chip (2), the size of the semiconductor chip (2), and the size of the semiconductor chip (2).
2) Determine the desired lead shape based on the connection between the upper connection point and the external lead pin (3), and then cut off unnecessary parts to determine the shape of the inner lead. Inner lead (1
) is decided and connected, and the γ component is shown in Figure 3, and the size of the semiconductor chip (2) can be set freely within a certain range, and
In addition, the external lead pins (3) and the semiconductor chip (2) can be freely connected, and the inner leads Fll can be shared.

The back surface potential node (5) can stabilize the back surface potential of the semiconductor chip (2), and also serves to reinforce the inner leads +11.

that's all? This makes it possible to share the inner lead, reduce costs, and further stabilize the back surface potential.

In the above embodiment, the inner lead +i) is on the upper side of the semiconductor chip (2), and the back lead +i) is on the lower side, but the reverse may be used.

However, the back leads (5) may extend outside the sealing resin as shown in FIG. However, there is no need for back leads.

In the above embodiment, the back surface lead (5) was used to stabilize the potential on the back surface of the semiconductor chip (2), but in order to reduce the lead inductance, which may cause malfunction, T, in other words, P was used. When using a board, the back side potential of this semiconductor is GND potential (this is the case, but the back side lead is connected to the GND pin of the external lead pin (all these are connected to make the surface ff of the GND pin sharper, and this is used to reduce lead inductance. You may.

〔Effect of the invention〕

As described above (according to the present invention, the inner leads can be shared, there is no need to create a dedicated one for each semiconductor integrated circuit device, and the cost can be reduced (the backside potential of the semiconductor chip can be reduced). It has effects such as stabilization.

[Brief explanation of drawings]

FIG. 1 is an assembled cross-sectional view of a semiconductor integrated circuit device according to an embodiment of the present invention, FIG. FIG. 4 is an enlarged plan view of the rear lead (5) shown in FIG. 1;
FIG. 5 is an assembled sectional view of a semiconductor integrated circuit device showing another embodiment of the present invention, and FIG. 6 is an assembled sectional view of a conventional semiconductor integrated circuit device. FIG. 7 is a partially enlarged view of the inner lead in FIG. 6. (In this figure, (1) shows the inner lead, (2) shows the semiconductor chip, (3) shows the external lead pin, (4) shows the sealing resin, and (5) shows the back side lead that takes the back side potential. Inside, the same reference numerals indicate the same parts, and squares indicate corresponding parts.

Claims (1)

[Claims] The shape of the inner lead is made into a mesh shape in advance, and unnecessary parts are removed according to the specifications of the semiconductor chip to be connected and the specifications of the external lead pins.The shape of the inner lead is determined, and the back side lead conducts with the back side of the semiconductor chip. A semiconductor integrated circuit device characterized by sandwiching, connecting and assembling semiconductor chips.