JPH04139866A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPH04139866A
JPH04139866A JP26412790A JP26412790A JPH04139866A JP H04139866 A JPH04139866 A JP H04139866A JP 26412790 A JP26412790 A JP 26412790A JP 26412790 A JP26412790 A JP 26412790A JP H04139866 A JPH04139866 A JP H04139866A
Authority
JP
Japan
Prior art keywords
leads
integrated circuit
inner leads
semiconductor integrated
inner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26412790A
Inventor
Isamu Kaminaga
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP26412790A priority Critical patent/JPH04139866A/en
Publication of JPH04139866A publication Critical patent/JPH04139866A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To shorten the delivery time, reduce the cost, and stabilize rear potential of a semiconductor chip through common use of inner leads by previously manufacturing inner leads in a reticulated shape and removing unnecessary parts from the leads.
CONSTITUTION: A required inner lead shape is obtained by removing unnecessary parts from previously formed reticulated inner leads 1 and a semiconductor chip 2 is connected with outer lead pins 3 with the inner leads thus formed. The inner leads 1 thus formed are connected to rear leads 5 for stabilizing rear potential with the pins 3 in between. Therefore, the cost of semiconductor integrated circuit devices can be reduced and the rear potential of semiconductor chips can be stabilized, because the reticulated inner leads 1 can be used commonly to various kinds of semiconductor integrated circuit devices and the manufacture of a specific inner lead to each semiconductor integrated circuit device becomes unnecessary.
COPYRIGHT: (C)1992,JPO&Japio
JP26412790A 1990-10-01 1990-10-01 Semiconductor integrated circuit device Pending JPH04139866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26412790A JPH04139866A (en) 1990-10-01 1990-10-01 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26412790A JPH04139866A (en) 1990-10-01 1990-10-01 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPH04139866A true JPH04139866A (en) 1992-05-13

Family

ID=17398848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26412790A Pending JPH04139866A (en) 1990-10-01 1990-10-01 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPH04139866A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5606199A (en) * 1994-10-06 1997-02-25 Nec Corporation Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame
US5696029A (en) * 1993-08-31 1997-12-09 Texas Instruments Incorporated Process for manufacturing a lead frame
US6303985B1 (en) * 1998-11-12 2001-10-16 Micron Technology, Inc. Semiconductor lead frame and package with stiffened mounting paddle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696029A (en) * 1993-08-31 1997-12-09 Texas Instruments Incorporated Process for manufacturing a lead frame
US5606199A (en) * 1994-10-06 1997-02-25 Nec Corporation Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame
US6303985B1 (en) * 1998-11-12 2001-10-16 Micron Technology, Inc. Semiconductor lead frame and package with stiffened mounting paddle

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