JPH04134862U - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] [Purpose] To obtain a hybrid integrated circuit device that can prevent incorrect mounting of hybrid integrated circuit boards with different circuit specifications. [Structure] The main structure is a hybrid integrated circuit board 5 that is mounted at the same location on the base fin 1 made of a metal plate, and an insulating area of this board is formed as a space for mounting a post for ground connection on the base fin 1. It has a hole 15 or a cutout 16 (see FIG. 4), and the position of the hole 15 or cutout is different depending on the circuit function of the board.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to hybrid integrated circuit devices, also called hybrid ICs, and is particularly resistant to environmental conditions. For example, hybrid integrated circuits that are incorporated as electrical components for automobiles that require strict performance. This relates to road equipment.

0002

[Conventional technology]

Figure 6 shows the internal structure of a conventional hybrid integrated circuit device (hereinafter abbreviated as hybrid IC device). FIG. 7 is a schematic cross-sectional view taken along the line A-A shown in FIG. be. Figures 6 and 7 show hybrid ICs used as igniters, etc. A power transistor for current control and a hybrid integrated circuit board (hereinafter referred to as hybrid I) to control the power transistor. This figure shows the schematic configuration of the electrical components mainly composed of the C board. It is.

0003 In both figures, 1 is a base fin made of a nickel-plated metal plate. , on which a substrate 3 made of alumina on which a power transistor chip 2 is mounted is mounted. The connections are made by reflow heating using a paste-like solder 4. this As shown, the nickel-plated metal base fin 1 serves as the source of the power transistor 2. Heat conduction is mainly used to dissipate heat efficiently and to enable soldering. This is due to consideration of properties and adhesion.

0004 A control hybrid IC board 5 is located adjacent to the power transistor chip 2. Placed. Alumina is generally used as this substrate material due to its heat resistance. It is used. Bonding with base fin 1 is expected to have a buffering effect against thermal stress. A silicone resin adhesive 12 that can be used is used. The board 3 and the hybrid IC board 5 are electrically connected by ultrasonic bonding of aluminum wire 6. .

[0005] Terminal 8 is a connection terminal for an external circuit (not shown) that performs input/output for this hybrid IC. The hybrid IC board 5 and the four terminals 8 integrally formed on the side wall of the case 7 are At the relay point of the same number of lead frames 9 provided on the integrated IC board 5, each Connected by soldering.

[0006] The input and output terminals of power transistor chip 2 are each made of aluminum wire. The aluminum post 13 on the hybrid IC board 5 is connected to the aluminum post 13 via the layer 6. a Luminium post 13 is for collector (C), base (B), emitter (E) There are four for use and ground (G). Among them, the electric current flowing through the emitter (E) terminal The flow path includes a power transistor chip 2 and an external ignition coil (not shown). A diagram of the inside of the circuit of the hybrid IC board 5 provided to prevent it from being destroyed by excessive current. A current is passed from aluminum post (G) 13 on the board through a current detection resistor not shown. Aluminum wire 6 is relayed to the aluminum point provided on the base fin 1. A connection method is adopted in which it is dropped to the ground connected to the striker 14.

[0007] As a finishing touch, after filling the inner space of the case 7 with silicone gel 10, A hybrid IC device is constructed by attaching and fixing the cover 11. In addition, this hybrid IC The explanation of the operation as an igniter is omitted because it is well known.

[0008] However, recently, the functions and specifications of igniters have become more diverse. There are requests for a current limiting function to prevent burnout of ignition coils, etc., and the purpose is Currently, the current limit value is changed depending on the application. This cornerstone In response to the demand, the hybrid IC board 5 is suitable for high-mix, low-volume production using the same equipment. Therefore, there may be cases where the outer diameter and shape are the same but the circuit is divided into various types. The sea urchin is turning.

[0009]

[Problem that the idea aims to solve]

In conventional hybrid IC devices such as those mentioned above, even if the circuit specifications are different, the external dimensions and Since the mounting shape of the IC board is the same, even if the circuit is not used for the intended purpose, it will not be possible to mix it up. Since it is possible to mount a built-in IC board, it has been difficult to completely eliminate erroneous mounting. Also, If incorrect assembly occurs due to this incorrect loading, it will not be known until the later inspection process, and the yield will be reduced. This was the cause of the decline.

0010 This invention was devised to solve the above-mentioned problems. The same manufacturing equipment can be used without changing the case structure such as changing the external dimensions or shape of the We are developing a hybrid IC device that can prevent incorrect mounting of hybrid IC boards with different circuit specifications. The purpose is to provide

[0011]

[Means to solve the problem]

The hybrid IC device according to the present invention is installed at the same location on the base fin made of a metal plate. The main structure is a hybrid IC board that can be attached, and a base plate is attached to the insulating part of this hybrid IC board. Hole or hole formed as post mounting space for ground connection on has a notch, and the location of this hole or notch differs depending on the circuit function of the hybrid IC board. It was formed as follows.

0012

[Effect]

In this invention, the ground connection on the base fin is connected to the insulating part of the hybrid IC board. Provide a hole or notch as a post mounting space for the Since the locations are different for each circuit function, once the post is installed, the same circuit No hybrid IC board other than a high-performance hybrid IC board can be mounted on a hybrid IC device. This is the base fin The position of the metal post for ground connection provided on the top allows the different circuit functions of the hybrid IC board. Therefore, the hybrid IC board may be incorrectly installed. Not done.

[0013]

【Example】

1 and 2 are plan views of essential parts of a hybrid IC device showing two embodiments of the present invention. It is. Further, FIG. 3 is a partially enlarged sectional view taken along line B-B shown in FIG. 2, for example. . In addition, in the above 3 figures, 1 to 14 are the partial codes shown in the conventional example of FIGS. 6 and 7. These are the same or corresponding parts, and their explanation will be omitted.

[0014] In FIGS. 1, 2 and 3, aluminum holes are placed in the insulating area of the hybrid IC substrate 5. A hole 15 is provided that can accommodate the strikes 14a and 14b, and the surface of the base fin 1 is opened at that position. Aluminum posts 14a, 14b are bonded by reflow heating using solder 4. Directly join.

[0015] This aluminum post 14a or 14b is provided on the hybrid IC board 5. The aluminum post (G) 13a or 13b on the substrate Connection is made by ultrasonic bonding (well known technique) with minium wire 6. This is it Aluminum post 1 with ground point G of hybrid IC board 5 provided on base fin 1 It can be grounded via 4a or 14b.

[0016] In the above explanation, FIGS. 1 and 2 show the same external dimensions for different types of circuit functional products. , aluminum posts 14a and 14, respectively, for the hybrid IC board 5 having the shape of This figure shows an example in which the mounting space and the mounting position of b are changed. Aluminum on the board as close as possible to the position of the hole 15 for mounting the post 14a, etc. It is set by moving the aluminum post 13a, etc. However, this setting is limited to For example, in FIG. 1, the hole 15 is located at the emitter ( E) near the terminal, but Figure 2 shows the case where it is set near the collector (C) terminal. It is something.

[0017] In this way, the relative positions of the holes 15 on the hybrid IC board 5 are changed with respect to each other. By doing so, the hybrid IC board 5 of the above two embodiments is compatible with hybrid IC devices. This eliminates incorrect device or incorrect assembly of boards with different circuit functions, and improves safety. This enables reliable board mounting. Note that the position of the hole 15 is limited to the above embodiment. Needless to say, this is not determined.

[0018] 4 and 5 are schematic plan views of main parts showing two aspects of other embodiments of the present invention. . In both embodiments, a predetermined part of the outer periphery of the hybrid IC board 5 is cut out. This portion is formed as a mounting space for the aluminum post 14. For example, in FIG. 4, the notch 16 is set on the side facing the power transistor chip 2. Figure 5 shows the facing direction and the facing side. It is something that

[0019] As shown in FIGS. 4 and 5, the configuration includes an aluminum post 14c or 14 on the side of the hybrid IC board 5 so that a part of d occupies the outer peripheral area of the hybrid IC board 5. A notch 16 is provided. Aluminum post 13c on board or 13d is attached to the nearest part of aluminum post 14c or 14d as shown. The settings are the same as in the embodiments of FIGS. 1 and 2. With this configuration Also, the same effects as in the embodiments shown in FIGS. 1 and 2 can be obtained.

[0020]

[Effect of the idea]

As described above, according to the present invention, although the hybrid IC substrates have the same external dimensions and shape, Aluminum post for grounding installed on metal base fin according to different circuit functions Change the mounting position of the IC board and use it as mounting space on the hybrid IC board depending on the position. Since holes or notches are provided, it is possible to connect hybrid IC boards with different circuit functions. Since the mounting position is not shared, there is no possibility of the device being installed incorrectly.

[0021] In addition, even if the number of circuit functions increases to two or more, the installation of aluminum posts If you change the position to another location and design the circuit, all of them will be made of aluminum. The mounting position is shared except for the hybrid IC board where the post position is the same. There's nothing wrong with that.

[0022] From the above, it is clear that not only automatic mounting but also assembly by manual mounting, there is no possibility of incorrect assembly. You can expect it to be nothing. This allows cost reduction by improving yield. At the same time, it also prevents market complaints due to the leakage of products equipped with different circuit functions. It becomes possible.

[Brief explanation of drawings]

FIG. 1 is a plan view of essential parts of a hybrid IC device showing one aspect of an embodiment of the present invention.

FIG. 2 is a plan view of main parts showing another aspect of the embodiment of the present invention.

FIG. 3 is a partially enlarged sectional view taken along line BB shown in FIG. 2;

FIG. 4 is a plan view of essential parts showing one aspect of another embodiment of the present invention.

FIG. 5 is a plan view of main parts showing another aspect of another embodiment of the present invention.

FIG. 6 is a schematic plan view showing an example of the internal structure of a conventional hybrid IC device.

7 is a cross-sectional view taken along the line AA shown in FIG. 6. FIG.

[Explanation of symbols]

1 Base fin 2 Power transistor chip 5 Hybrid IC board 6 Aluminum wire 12 Adhesive 13, 13a, 13b, 13c, 13d Aluminum post on board 14, 14a, 14b, 14c, 14d Aluminum post 15 Hole 16 Notch

──────────────────────────────────────────────── ─── Continued from front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location H01R 9/09 Z 6901-5E H05K 1/05 Z 8727-4E

Claims (1)

[Scope of utility model registration request] 1. A hybrid integrated circuit device comprising a hybrid integrated circuit board mounted at the same location on a base fin made of a metal plate, wherein a ground on the base fin is provided in an insulating area of the hybrid integrated circuit board. It has a hole or notch formed for the purpose of mounting a connection post, and the hole or notch is provided in a different position depending on the circuit function of the hybrid integrated circuit board. A hybrid integrated circuit device characterized by: