JPH04133469U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH04133469U JPH04133469U JP4824891U JP4824891U JPH04133469U JP H04133469 U JPH04133469 U JP H04133469U JP 4824891 U JP4824891 U JP 4824891U JP 4824891 U JP4824891 U JP 4824891U JP H04133469 U JPH04133469 U JP H04133469U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- pattern
- patterns
- resist
- foil patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- 230000008439 repair process Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 プリント基板の銅箔で形成されたパターンは
多数の銅箔パターンが配置され実験をしたり、修理した
りする際、銅箔パターンの目うつりを防止する。
【構成】 本考案は隣接する銅箔パターンに対して一本
おきに銅箔パターンのレジスト処理を一部分実施しない
様にパターンに沿って設けて、隣接する銅箔パターンと
区別出来る紋様とする。
(57) [Summary] [Purpose] To prevent the copper foil patterns from becoming distorted when a large number of copper foil patterns are arranged on a printed circuit board and experiments or repairs are performed. [Structure] In the present invention, resist treatment is applied to every other adjacent copper foil pattern along the pattern so that a portion of the copper foil pattern is not applied, thereby creating a pattern that can be distinguished from the adjacent copper foil patterns.
Description
【0001】0001
本考案は、電子機器に使用するプリント基板に関するものである。 The present invention relates to a printed circuit board used in electronic equipment.
【0002】0002
部品のハンダ付けされる部分や、検査治具を使用する為に、銅箔パターンと電 気的に接続される部分以外は、全てレジスト処理をしてあり表面は同一色である 。 Copper foil patterns and electric wires are used for soldering parts and inspection jigs. Except for the parts that are electrically connected, all surfaces are resist-treated and have the same color. .
【0003】0003
同一色の銅箔パターンが平行して配置されている為銅箔パターンを目でおいか けていくと、いつのまにか他のパターンに視線が移ってしまい修理や検査がむず かしい欠点があった。 The copper foil patterns of the same color are arranged in parallel, so you can visually follow the copper foil patterns. As you progress, your eyes will shift to other patterns before you know it, making repairs and inspections difficult. It had some serious flaws.
【0004】0004
本考案はプリント基板の銅箔パターンの半田レジストパターンを一本おき又は 数本おきに、レジスト処理を実施しない部分をもうけるようにし紋様としてパタ ーン群の区別ができるようにする。 In this invention, every other solder resist pattern of the copper foil pattern of the printed circuit board or Every few lines, there is a part where no resist processing is performed, and the pattern is created as a pattern. To be able to distinguish between groups of sounds.
【0005】[0005]
レジスト処理をしない部分はもしプリント基板全体をハンダ付け処理をしなけ れば銅箔そのものの色となり、もしハンダ付け処理をすればハンダの色となる。 そして、パターンを目でおいかける場合、パターンの隣接パターンは一部がレジ スト処理をしていない為、パターンを見失う恐れが軽減される。またパターンを 目でおいかける際、隣接パターンは全てレジスト処理をしてある為同様に現在お いかけているパターンを見失う恐れが軽減される。 又それぞれのパターンに異なる文様と成すことにより半田付け部を群として区 別することができる。 If you have to solder the entire printed circuit board in areas that are not treated with resist, If it is, it will be the color of the copper foil itself, and if it is soldered, it will be the color of the solder. When placing patterns by eye, some of the adjacent patterns may be registered. Since no pattern processing is performed, the risk of losing track of the pattern is reduced. Another pattern When tracing by eye, all adjacent patterns have been subjected to resist processing, so it is similar to the current one. This reduces the fear of losing track of the pattern you are trying to follow. Also, by forming each pattern with a different pattern, the soldered parts can be distinguished as a group. Can be separated.
【0006】[0006]
図1は本考案の実施例を示す図で、図2及び図3はその拡大図である。基板1 には銅箔パターン2a〜nを設け非レジスト処理部3a〜nを有するレジスト処 理部4を設ける。非レジスト処理部3a〜nは銅箔パターン2a〜nの1本おき 又は2本おきに非レジスト処理部が紋様となるように設ける。この場合半田付部 5bから6bまで銅箔パターン2bを目で追っていく場合、隣接するパターン2 a,2cは図の様に一部分レジスト処理がしていない銅箔パターンの為区別がつ く、銅箔パターン2cを目でおっていく場合は隣接する銅箔パターンは全てレジ スト処理されている為、区別することができ基板の修理や検査時に便利である。 又途中の半田付け部7a〜nを見分ける ことも容易になる。 FIG. 1 is a diagram showing an embodiment of the present invention, and FIGS. 2 and 3 are enlarged views thereof. Board 1 Copper foil patterns 2a-n are provided in the resist-treated area having non-resist-treated areas 3a-n. Science Department 4 will be established. Non-resist treated areas 3a to 3n are located at every other copper foil pattern 2a to 2n. Alternatively, a non-resist treated portion is provided every two lines so as to form a pattern. In this case the soldering part When visually following the copper foil pattern 2b from 5b to 6b, the adjacent pattern 2 As shown in the figure, a and 2c are copper foil patterns that are partially untreated with resist, so it is difficult to tell them apart. When tracing copper foil pattern 2c by eye, all adjacent copper foil patterns are registered. Because they have been treated with paint, they can be distinguished and are useful when repairing or inspecting boards. Also, identify the soldering parts 7a to n in the middle. It also becomes easier.
【0007】[0007]
本考案によると銅箔パターンのレジスト処理を実施しない部分を半田付部の他 に各パターンを区別する紋様として銅箔上に非レジスト処理部分を設けたので修 理や検査時パターンの行先を見分けることができる。 According to the present invention, the parts of the copper foil pattern that are not subjected to resist treatment are Since a non-resist treated area was provided on the copper foil as a pattern to distinguish each pattern, it was easy to repair. It is possible to discern the destination of patterns during inspection.
【図1】本考案の一実施例を示す図。FIG. 1 is a diagram showing an embodiment of the present invention.
【図2】本考案の実施例を示す拡大図。FIG. 2 is an enlarged view showing an embodiment of the present invention.
【図3】本考案の実施例を示す拡大図。FIG. 3 is an enlarged view showing an embodiment of the present invention.
1 基板 2a〜n 銅箔パターン 3a〜n 非レジスト部 4 レジスト部 5,6,7 半田付部 1 board 2a~n Copper foil pattern 3a~n Non-resist area 4 Registration section 5, 6, 7 Soldering part
Claims (1)
パターン相隣接する3本の銅箔パターンのうち左右の銅
箔パターンのレジストを一定間隔毎に一定幅レジスト処
理をしない部分をパターンに沿って設け紋様によって銅
箔パターンの区別をするようにしたことを特徴とするプ
リント基板。[Claim 1] The resist of the left and right copper foil patterns of the three adjacent copper foil patterns of the printed circuit board that has been subjected to resist treatment is applied at regular intervals along the portions that are not subjected to resist treatment. A printed circuit board characterized in that copper foil patterns are distinguished by patterns provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4824891U JPH04133469U (en) | 1991-05-30 | 1991-05-30 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4824891U JPH04133469U (en) | 1991-05-30 | 1991-05-30 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04133469U true JPH04133469U (en) | 1992-12-11 |
Family
ID=31926817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4824891U Withdrawn JPH04133469U (en) | 1991-05-30 | 1991-05-30 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04133469U (en) |
-
1991
- 1991-05-30 JP JP4824891U patent/JPH04133469U/en not_active Withdrawn
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19950810 |