JPH04133456U - Infrared image sensor and infrared detector - Google Patents
Infrared image sensor and infrared detectorInfo
- Publication number
- JPH04133456U JPH04133456U JP4871591U JP4871591U JPH04133456U JP H04133456 U JPH04133456 U JP H04133456U JP 4871591 U JP4871591 U JP 4871591U JP 4871591 U JP4871591 U JP 4871591U JP H04133456 U JPH04133456 U JP H04133456U
- Authority
- JP
- Japan
- Prior art keywords
- infrared
- substrate
- refractive index
- image sensor
- infrared image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000002344 surface layer Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 abstract description 9
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
(57)【要約】
【目的】 赤外線イメージセンサの感度を向上させる。
【構成】 赤外線イメージセンサ10の受光部1を形成
するGdTe基板の表層部2の屈折率を深層部3の屈折
率より大きく構成する。図示A方向から受光部1の画素
の隙間に入射した赤外光101は、GdTe基板の表層
部2で大きく曲げられ、PN接合部5に到達する。PN
接合部5で光電変換された電荷は、ハイブリッド結合部
6を経由して、読み出し部7で読み出される。
(57) [Summary] [Purpose] To improve the sensitivity of infrared image sensors. [Structure] The refractive index of the surface layer 2 of the GdTe substrate forming the light receiving section 1 of the infrared image sensor 10 is larger than the refractive index of the deep layer 3. Infrared light 101 that enters the gap between the pixels of the light receiving section 1 from the direction A in the figure is largely bent by the surface layer 2 of the GdTe substrate and reaches the PN junction 5 . P.N.
The charges photoelectrically converted at the junction 5 are read out by the readout section 7 via the hybrid coupling section 6 .
Description
【0001】0001
本考案は赤外線イメージセンサおよび赤外線検知器に関し、特にハイブリッド 型赤外線イメージセンサ等に関する。 The present invention relates to infrared image sensors and infrared detectors, especially hybrid Related to type infrared image sensors, etc.
【0002】0002
赤外線検知器は、例えば、ハイブリッド型赤外線イメージセンサ等に応用され ている。 従来のハイブリッド型赤外線イメージセンサは入射赤外光の乱反射を防止する ために、受光部の基板(サブストレート)表面を鏡面処理している。 また、従来のハイブリッド型赤外線イメージセンサにおいては、隣接する画素 とのクロストークを防ぐために、画素間に隙間を形成し、それぞれの画素が、一 画素サイズ以上のピッチ間隔で二次元的に配置されている。 Infrared detectors are applied, for example, to hybrid infrared image sensors. ing. Conventional hybrid infrared image sensors prevent diffuse reflection of incident infrared light Therefore, the surface of the substrate of the light receiving section is mirror-finished. In addition, in conventional hybrid infrared image sensors, adjacent pixels In order to prevent crosstalk with the They are arranged two-dimensionally at pitch intervals equal to or larger than the pixel size.
【0003】0003
しかしながら、上述した従来のハイブリッド型赤外線イメージセンサは、画素 間に隙間を形成しているため、画素間に隙間に入射してくる赤外光がサブストレ ートをそのまま通過してしまう。したがって、この画素間に隙間に入射してくる 赤外光は光電変換されず、映像には全く寄与しないため感度の低下をきたすとい う問題があった。 However, in the conventional hybrid infrared image sensor mentioned above, the pixel Since a gap is formed between the pixels, infrared light that enters the gap between the pixels is The vehicle will pass through the route as it is. Therefore, the incident light enters the gap between these pixels. Infrared light is not photoelectrically converted and does not contribute to the image at all, so it may cause a decrease in sensitivity. There was a problem.
【0004】 本考案は上述した問題点にかんがみてなされたもので、画素間に隙間に入射し てくる赤外光を光電変換に利用することができ、したがって感度の向上を図るこ とのできる赤外線イメージセンサおよび赤外線検知器の提供を目的とする。0004 This invention was devised in view of the above-mentioned problem. It is possible to use the infrared light that comes in for photoelectric conversion, thus improving sensitivity. The objective is to provide an infrared image sensor and an infrared detector that can
【0005】[0005]
上記目的を達成するために本考案の赤外線検知器は、受光部で受光した光をハ イブリッド接合部で光電変換し、読み出し部で読み出す赤外線検知器において、 受光部における基板表層部の屈折率と基板深表層部の屈折率とを異なるものとし た構成としてあり、また、本考案の赤外線イメージセンサは、上記赤外線検知器 を二次元的に配列し画像を検知できるようにしてある。 In order to achieve the above purpose, the infrared detector of the present invention detects the light received by the light receiving part. In an infrared detector that performs photoelectric conversion at the hybrid junction and reads out at the readout section, The refractive index of the surface layer of the substrate and the refractive index of the deep surface layer of the substrate in the light receiving section are different. In addition, the infrared image sensor of the present invention has the above-mentioned infrared detector. are arranged two-dimensionally so that images can be detected.
【0006】[0006]
以下、本考案の一実施例について図面を参照して説明する。 図1は本考案の赤外線検知器の一応用例に係る赤外線イメージセンサを示す部 分切欠斜視図であり、図2は同じく断面図である。 An embodiment of the present invention will be described below with reference to the drawings. Figure 1 shows a part of an infrared image sensor according to an application example of the infrared detector of the present invention. It is a partially cutaway perspective view, and FIG. 2 is a sectional view as well.
【0007】 これらの図面において、赤外線イメージセンサ10は、受光部1、ハイブリッ ド接合部6、および読み出し部7等で構成されている。 受光部1はGdTe(結晶)基板で形成してある。受光部1のGdTe基板は 、基板表層部2の屈折率が基板深層部3の屈折率より大きくなるように構成して ある。この屈折率の変化は不連続的に変化する場合、および連続的に変化する場 合のいずれの場合も含まれる。屈折率の変化の大きさは受光した赤外光が後述す るPN接合部6に集光するように適宜選択される。 受光部1のGdTe基板の裏面(基板深層部3側の面)には、エピタキシャル 層4が形成されている。エピタキシャル層4はHgGdTeをGdTe基板上に 成長させて形成してある。エピタキシャル層4にはPN接合部5が形成してあり 、このPN接合部5は光電変換を行なう。 ハイブリッド結合部6は、上記PN接合部5と読み出し部7を結合している。[0007] In these drawings, the infrared image sensor 10 includes a light receiving section 1, a hybrid It is composed of a code junction section 6, a readout section 7, and the like. The light receiving section 1 is formed of a GdTe (crystal) substrate. The GdTe substrate of the light receiving part 1 is , the refractive index of the substrate surface layer 2 is larger than the refractive index of the substrate deep layer 3. be. This change in refractive index occurs when it changes discontinuously and when it changes continuously. This includes both cases. The magnitude of the change in refractive index is determined by the received infrared light, which will be explained later. The light is appropriately selected so that the light is focused on the PN junction 6. Epitaxial Layer 4 is formed. Epitaxial layer 4 is made of HgGdTe on a GdTe substrate. It is grown and formed. A PN junction 5 is formed in the epitaxial layer 4. , this PN junction 5 performs photoelectric conversion. The hybrid coupling section 6 couples the PN junction section 5 and the reading section 7 together.
【0008】 次に、上記構成からなる赤外線イメージセンサ10の作用について説明する。 図示A方向から受光部1に入射した赤外光100は、GdTe基板の表層部2 及び深層部3を透過する。この際GdTe基板の表層部2の屈折率が深層部3の 屈折率より大きくなるように構成してあるので、図示A方向から入射した赤外光 100のうち、画素間の隙間を通過しようとする赤外光101は、GdTe基板 の表層部2で大きく光路を曲げられ、PN接合部5に到達する。そして、このP N接合部5で光電変換されて発生した電荷が、ハイブリッド結合部6を経由して 読み出し部7に到達し、読み出し部7で読み出される。[0008] Next, the operation of the infrared image sensor 10 having the above configuration will be explained. The infrared light 100 incident on the light receiving section 1 from the direction A in the figure is transmitted to the surface layer 2 of the GdTe substrate. and penetrates the deep layer 3. At this time, the refractive index of the surface layer 2 of the GdTe substrate is different from that of the deep layer 3. Since the structure is configured so that the refractive index is larger than the refractive index, infrared light incident from direction A in the figure Among 100, infrared light 101 that tries to pass through the gap between pixels is transmitted through the GdTe substrate. The optical path is greatly bent at the surface layer 2 and reaches the PN junction 5. And this P The charge generated by photoelectric conversion at the N junction 5 is transferred via the hybrid junction 6. The data reaches the reading unit 7 and is read out by the reading unit 7.
【0009】 なお、本考案は上記赤外線イメージセンサの実施例に限定されるものではない 。 例えば、本考案は赤外線センサ等の赤外線検知器においても同様に適用される 。[0009] Note that the present invention is not limited to the embodiment of the infrared image sensor described above. . For example, the present invention can be similarly applied to infrared detectors such as infrared sensors. .
【0010】0010
以上説明したように本考案の赤外線イメージセンサおよび赤外線検知器は、受 光部の基板表層部の屈折率を基板深層部の屈折率に対して変化させているので、 従来、画素間の隙間を通過して光電変換に利用されなかった赤外光を光電変換に 利用でき、したがって、赤外線イメージセンサおよび赤外線検知器の感度を向上 させることができる。 As explained above, the infrared image sensor and infrared detector of the present invention are capable of receiving Since the refractive index of the surface layer of the substrate in the optical part is changed relative to the refractive index of the deep layer of the substrate, Infrared light, which previously passed through the gaps between pixels and was not used for photoelectric conversion, can now be used for photoelectric conversion. available, thus increasing the sensitivity of infrared image sensors and infrared detectors can be done.
【図1】本考案の赤外線検知器の一応用例に係る赤外線
イメージセンサを示す部分切欠斜視図である。FIG. 1 is a partially cutaway perspective view showing an infrared image sensor according to an application example of the infrared detector of the present invention.
【図2】図1の断面図である。FIG. 2 is a cross-sectional view of FIG. 1;
1…受光部 2…基板表層部 3…基板深層部 4…エピタキシャル層 5…PN接合部 5…ハイブリッド結合部 7…読み出し部 10…赤外線イメージセンサ 100…赤外線 1... Light receiving section 2...Substrate surface layer 3...Deep part of the board 4...Epitaxial layer 5...PN junction 5...Hybrid joint part 7...Reading section 10...Infrared image sensor 100...Infrared rays
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 G01J 5/48 D 8909−2G ──────────────────────────────────────────────── ─── Continued from front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location G01J 5/48 D 8909-2G
Claims (2)
部で光電変換し、読み出し部で読み出す赤外線検知器に
おいて、受光部における基板表層部の屈折率と基板深表
層部の屈折率とを異なるものとしたことを特徴とする赤
外線検知器。Claim 1: An infrared detector that photoelectrically converts light received by a light receiving part at a hybrid junction part and reading it out at a readout part, in which the refractive index of the surface layer of the substrate and the refractive index of the deep surface layer of the substrate in the light receiving part are different. An infrared detector characterized by the following.
に配列し画像を検知できるようにしたことを特徴とする
赤外線イメージセンサ。2. An infrared image sensor characterized in that the infrared detectors according to claim 1 are arranged two-dimensionally to detect an image.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4871591U JPH04133456U (en) | 1991-05-31 | 1991-05-31 | Infrared image sensor and infrared detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4871591U JPH04133456U (en) | 1991-05-31 | 1991-05-31 | Infrared image sensor and infrared detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04133456U true JPH04133456U (en) | 1992-12-11 |
Family
ID=31927013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4871591U Pending JPH04133456U (en) | 1991-05-31 | 1991-05-31 | Infrared image sensor and infrared detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04133456U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63291466A (en) * | 1987-05-25 | 1988-11-29 | Nippon Sheet Glass Co Ltd | Solid-state image sensing device |
JPH0391960A (en) * | 1989-09-04 | 1991-04-17 | Fujitsu Ltd | Manufacture of infrared detector |
-
1991
- 1991-05-31 JP JP4871591U patent/JPH04133456U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63291466A (en) * | 1987-05-25 | 1988-11-29 | Nippon Sheet Glass Co Ltd | Solid-state image sensing device |
JPH0391960A (en) * | 1989-09-04 | 1991-04-17 | Fujitsu Ltd | Manufacture of infrared detector |
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