JPH04131951U - Power semiconductor module - Google Patents

Abstract

(57) [Summary] [Purpose] To facilitate the connection between electrode members and external wiring in the configuration of a power semiconductor module. [Structure] In a semiconductor module, a long hole 11 is formed inside a plate-shaped electrode member 5 that is electrically connected to a semiconductor chip 1 and whose upper part is drawn out to connect with external wiring, and the upper bent part is made thinner. Made bending easier.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to power semiconductor modules, and in particular to electrode members for external wiring connections. It is something to do.

0002

[Conventional technology]

Conventional power semiconductors such as thyristors, transistors, diodes, and IGBTs The chip is soldered to a metal substrate such as Cu or Fe through an insulating plate such as ceramics. In power semiconductor modules that are A plate-shaped electrode material such as Cu is used to connect the electrode mounted on the plate to the outside of the module. This electrode member is bent at the top of the module case top cover. , External connections are wired.

0003 In order to make this external connection wiring possible, there is a hole for inserting a nut in the top cover of the case. A nut is inserted into the hole. Correspondingly, Fig. 3 shows At the bent portion 23 of the electrode member 21 that is bent at the top of the case top lid, Also, a hole 22 with the same diameter as this nut insertion hole is provided, and the electrode member 21 is connected to the outside. The connection wiring is fixed in this hole with a screw.

0004

[Problem that the idea aims to solve]

In this way, in the conventional power semiconductor module, the electrode member 21 as shown in FIG. It is bent and the bent part 23 is attached to the case top lid. During the installation process, the hole 22 made in the bent part was deformed, making it difficult to insert the screw. The problem is that it may not be possible to insert the There was also a problem.

[0005] In order to avoid deformation of the hole during installation, the bent part of the electrode member should be It is possible to increase the length of the module, but this will make the module itself larger. There is also the issue of having to do so.

[0006]

[Means to solve the problem]

This idea was made in view of the above problems, and was developed using a plate-shaped electrode member. A rectangular or oval long hole is provided in the length direction on the inside except for the bent part at the bottom. It's huge.

[0007]

[Effect]

In this way, by having long holes along the length inside the plate-shaped electrode member, The electrode member can be easily bent, and the hole will not be deformed during the bending process. Therefore, connection between this electrode member and external wiring can be easily performed.

[0008]

【Example】

This invention will be explained below with reference to FIGS. 1 and 2 showing one embodiment thereof. In Figure 1 As shown, power semiconductors such as thyristors, transistors, diodes, and IGBTs A conductor chip 1 is soldered 15 to an insulating plate 2 made of ceramic or the like, and this insulating plate 2 is soldered 16 to a metal substrate 3 made of Fe, Cu or the like.

[0009] Lead wires 4 are bonded from the semiconductor chip 1 to the electrode portions on the metal substrate 3. ing. Further, the plate-shaped electrode member 5 is soldered to the insulating plate 2 at its lower end bent piece 10. A synthetic resin case 6 is bonded to the metal substrate 3. This plate electrode As shown in FIG. A rectangular (or oval-shaped) long hole 11 is formed by punching.

0010 Next, the semiconductor chip 1 and the plate-shaped electrode member 5 are placed in the case 6 as described above. Gel-like silicone rubber 7 is injected, heated and cured, and then epoxy resin is added. 8, place the case top cover 9 on, heat harden the epoxy resin, and remove the semiconductor chip. Seal 1.

[0011] In addition, the portion of the case upper cover 9 that the upper bent piece 18 of the electrode member 5 comes into contact with is thick. A nut insertion hole 13 is provided in this thick part, and a nut 14 is inserted into the hole 13. After that, bend the electrode member 5 from the bending part 12 and insert the bent piece 18 into the case. solder to the base top cover 9. This allows the external connection wiring to be connected to the electrode member 5 with screws. It can be fixed easily.

0012

[Effect of the idea]

As explained above, this idea provides a plate-shaped electrode member with long holes in its length direction. , since the bent part of the upper folded piece is narrow, it is difficult to attach the part to the case top cover. Easy to bend, no deformation of the long hole, and a nut inserted into the top cover The electrode member and the external connection wiring can be easily fixed with screws.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway side sectional view of a power semiconductor module of the present invention.

FIG. 2 is a perspective view of an electrode member used in this invention.

FIG. 3 is a perspective view of an electrode member used in a conventional power semiconductor module.

[Explanation of symbols]

1 Semiconductor chip 2 Insulating board 3 Metal substrate 5 Plate electrode member 11 long hole

Claims (1)

[Scope of utility model registration request] 1. A power semiconductor chip is mounted on a metal substrate, a plate-shaped electrode member electrically connected to the semiconductor chip is pulled out, and the semiconductor chip is sealed with silicone rubber and epoxy resin. A power semiconductor module characterized in that the plate-shaped electrode member has a rectangular or oval long hole on the inside except for the bent piece at the lower end.