JPH04130695A - Chiplike electronic component and mounting method thereof - Google Patents
Chiplike electronic component and mounting method thereofInfo
- Publication number
- JPH04130695A JPH04130695A JP25365490A JP25365490A JPH04130695A JP H04130695 A JPH04130695 A JP H04130695A JP 25365490 A JP25365490 A JP 25365490A JP 25365490 A JP25365490 A JP 25365490A JP H04130695 A JPH04130695 A JP H04130695A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- circuit board
- shaped electronic
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 10
- 229920001971 elastomer Polymers 0.000 claims abstract description 19
- 239000005060 rubber Substances 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000012360 testing method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明はチップ状電子部品およびその取り付け方法に
関し、特に、回路基板に適合する部品を捜して取り付け
られる、チップ状電子部品およびその取り付け方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a chip-shaped electronic component and a method for attaching the same, and particularly relates to a chip-shaped electronic component and a method for attaching the same to a circuit board by searching for a component that is compatible with the circuit board. .
（従来技術）
従来、チップ状電子部品が回路基板の特性に適合するか
どうかを調べるには、まずチップ状電子部品が回路１板
の配線導体にはんだ付けされる。(Prior Art) Conventionally, in order to check whether a chip-shaped electronic component is compatible with the characteristics of a circuit board, the chip-shaped electronic component is first soldered to a wiring conductor of a circuit board.
そして、特性を検査後、検査結果が良好でなければ、そ
のチップ状電子部品のはんだがをりはすされ、別のチッ
プ状電子部品が回路基板にはんだ付けされる。この操作
を繰り返して、その回路基板に適したチップ状電子部品
が選ばれる。After testing the characteristics, if the test results are not good, the solder of the chip-shaped electronic component is removed, and another chip-shaped electronic component is soldered to the circuit board. By repeating this operation, a chip-shaped electronic component suitable for the circuit board is selected.
（発明が解決しようとする課題）
しかしながら、従来のチップ状電子部品では、回路基板
の配線導体に取り付ける度に、はんだ付けをしなければ
ならなかった。また、特性が良好でない場合、回路基板
からチップ状電子部品を取りはずす度に、はんだを取り
はずす必要があった。(Problems to be Solved by the Invention) However, conventional chip-shaped electronic components require soldering each time they are attached to a wiring conductor on a circuit board. Furthermore, if the characteristics were not good, it was necessary to remove the solder every time the chip-shaped electronic component was removed from the circuit board.
そのため、チップ状電子部品の付け替えに、かなりの手
間を要した。また、はんだ付けおよび取りはずしの際に
、チップ状電子部品に不要な熱が加えられるため、チッ
プ状電子部品の信頼性が損なわれる場合があった。Therefore, it took a considerable amount of effort to replace the chip-shaped electronic components. Furthermore, unnecessary heat is applied to the chip-shaped electronic component during soldering and removal, which may impair the reliability of the chip-shaped electronic component.
それゆえに、この発明の主たる目的は、回路基板に適合
するかどうかを簡単に検査することができ、取り付け後
の信頼性の高い、チップ状電子部品およびその取り付け
方法を提供することである。Therefore, the main object of the present invention is to provide a chip-shaped electronic component that can be easily inspected for compatibility with a circuit board and has high reliability after mounting, and a method for mounting the same.
（課題を解決するための手段）
この発明は、電極を有する電子素子と、電極に取り付け
られる導電ゴムとを含む、チップ状電子部品である。(Means for Solving the Problems) The present invention is a chip-shaped electronic component including an electronic element having an electrode and a conductive rubber attached to the electrode.
また、この発明の方法は、電極を有する電子素子と、電
極に取り付けられる導電ゴムとを含むチップ状電子部品
を準備するステップと、回路基板を準備するステップと
、回路基板の配線導体にチップ状電子部品の導電ゴムを
押し付けるステップと、回路基板の特性を測定するステ
ップと、回路基板の特性に適合するチップ状電子部品が
見つかったときに、電極と回路基板の配線導体とをはん
だ付けするステップとを含む、チップ状電子部品の取り
付け方法である。The method of the present invention also includes the steps of preparing a chip-shaped electronic component including an electronic element having an electrode and a conductive rubber attached to the electrode, preparing a circuit board, and attaching the chip-shaped electronic component to a wiring conductor of the circuit board. A step of pressing the conductive rubber of the electronic component, a step of measuring the characteristics of the circuit board, and a step of soldering the electrode and the wiring conductor of the circuit board when a chip-shaped electronic component that matches the characteristics of the circuit board is found. A method for attaching a chip-shaped electronic component, including:
（作用）
チップ状電子部品の電極に、それぞれ導電ゴムが装着さ
れる。そして、そのチップ状電子部品を回路基板の上に
置き、押し付けることによって、電極と導電ゴムと回路
基板の配線導体との間の導通が強くなる。(Function) Conductive rubber is attached to each electrode of the chip-shaped electronic component. Then, by placing and pressing the chip-shaped electronic component onto the circuit board, the conduction between the electrode, the conductive rubber, and the wiring conductor of the circuit board is strengthened.
（発明の効果）
この発明によれば、回路基板に取り付けられるチップ状
電子部品を検査する度に、回路基板にはんだ付けをする
必要がない。(Effects of the Invention) According to the present invention, there is no need to solder the chip-shaped electronic component to the circuit board every time a chip-shaped electronic component attached to the circuit board is inspected.
また、この発明の方法によれば、チップ状電子部品の取
り替えが簡単にでき、従来の方法の約１／１０の時間で
チップ状電子部品が回路基板に適合するかどうかの検査
ができる。また、チップ状電子部品に不要な熱などが加
えられないため、取り付け後のチップ状電子部品の信頼
性が約２０％向上する。Furthermore, according to the method of the present invention, it is possible to easily replace chip-shaped electronic components, and it is possible to inspect whether the chip-shaped electronic components are compatible with a circuit board in about 1/10 of the time required by conventional methods. Furthermore, since unnecessary heat is not applied to the chip-shaped electronic component, the reliability of the chip-shaped electronic component after attachment is improved by approximately 20%.
この発明の上述の目的、その他の目的、特徴および利点
は、図面を参照して行う以下の実施例の詳細な説明から
一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
（実施例）
第１図はこの発明の一実施例を示す斜視図であり、第２
Ａ図はその正面図であり、第２Ｂ図はその平面図である
。(Embodiment) FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG.
Figure A is its front view, and Figure 2B is its plan view.
チップ状電子部品ＩＯは、電子素子１２を含む。The chip-shaped electronic component IO includes an electronic element 12.
電子素子１２には、コの字形の４つの電極１４ａ１４
ｂ、 １４ ｃ、 １４ ｄが形成される。これら
４つの電極１４ａ、１４ｂ、１４ｃ、１４ｄは、互いに
間隔を隔てて形成される。The electronic element 12 has four U-shaped electrodes 14a14.
b, 14c, and 14d are formed. These four electrodes 14a, 14b, 14c, and 14d are formed at intervals from each other.
これらの４つの電極１４ ａ、 １４ ｂ、 １４
ｃ。These four electrodes 14 a, 14 b, 14
c.
１４ｄには、それぞれ導電ゴム１６ａ、１６ｂ。Conductive rubbers 16a and 16b are provided at 14d, respectively.
１６Ｃ，１６ｄが取り付けられる。16C and 16d are attached.
第３図に示すように、このチップ状電子部品ｌＯは、回
路基板１８の配線導体１９ａ、１９ｂ （１９ｃ、１９
ｄは図示せず）上にセットされる。As shown in FIG.
(d is not shown).
そして、その先端に粘性ゴム２０を取り付けた棒２２に
よって、チップ状電子部品１０が、矢印Ａに示すように
回路基板１日に押し付けられる。Then, the chip-shaped electronic component 10 is pressed against the circuit board 1 as shown by arrow A by a rod 22 having a viscous rubber 20 attached to its tip.
チップ状電子部品１０を回路基板１８に押し付けると、
電極１４ａ、１４ｂ、１４ｃ、１４ｄと導電ゴム１６ａ
、１６ｂ、１６ｃ、１６ｄと回路基板１８の配線導体１
９ａ、１９ｂ、１９ｃ、１９ｄとの間の導通を強（する
ことができる。このようにして、このチップ状電子部品
１０を取り付けた回路基板１８の特性が検査される。When the chip-shaped electronic component 10 is pressed against the circuit board 18,
Electrodes 14a, 14b, 14c, 14d and conductive rubber 16a
, 16b, 16c, 16d and the wiring conductor 1 of the circuit board 18
9a, 19b, 19c, and 19d can be strengthened. In this way, the characteristics of the circuit board 18 to which this chip-shaped electronic component 10 is attached are tested.
検査の結果が良好でない場合、第４図の矢印Ｂに示すよ
うに、チップ状電子部品ＩＯが取りはずされる。そして
、チップ状電子部品１０を順番に検査していき、適合す
るチップ状電子部品１０が選ばれる。そして、選ばれた
チップ状電子部品ｌＯが、回路基板１８へはんだ付けさ
れる。If the test result is not favorable, the chip-shaped electronic component IO is removed as shown by arrow B in FIG. Then, the chip-shaped electronic components 10 are inspected in order, and a suitable chip-shaped electronic component 10 is selected. Then, the selected chip-shaped electronic component IO is soldered to the circuit board 18.
第５図はこのチップ状電子部品１０の、回路基板１８へ
のはんだ付け方法の一例を示す図解図である。第５図に
示すように、チップ状電子部品ＩＯから、導電ゴム１６
ａ、１６ｂ、１６ｃ、１６ｄを除いて、はんだ２４によ
り、回路基板１８へはんだ付けすればよい。また、第６
図に示すように、チップ状電子部品１０を、導電ゴム１
６ａ。FIG. 5 is an illustrative view showing an example of a method of soldering this chip-shaped electronic component 10 to the circuit board 18. As shown in FIG. 5, from the chip-shaped electronic component IO, the conductive rubber 16
Except for a, 16b, 16c, and 16d, they may be soldered to the circuit board 18 using solder 24. Also, the 6th
As shown in the figure, a chip-shaped electronic component 10 is attached to a conductive rubber 1
6a.
１６ｂ、１６ｃ、１６ｄを付けたまま、回路基板１８へ
はんだ付けしてもよい。16b, 16c, and 16d may be soldered to the circuit board 18 while being attached.
この発明によれば、チップ状電子部品１０が回路基板１
８に適合するかどうかの検査の時に、チップ状電子部品
１０を回路基板１８にはんだ付けする必要がなく、チッ
プ状電子部品１０の取り替えが簡単にできる。According to this invention, the chip-shaped electronic component 10 is attached to the circuit board 1.
8, there is no need to solder the chip-shaped electronic component 10 to the circuit board 18, and the chip-shaped electronic component 10 can be easily replaced.
したがって、適合するかどうかの検査に要する時間は、
従来のチップ状電子部品を使った場合に比べて、約１／
１０となる。また、はんだ付けは最終的に行えばよく、
チップ状電子部品に不要な熱などが加えられない。その
ため、取り付け後のチップ状電子部品の信顛性が従来の
ものに比べて約２０％向上する。Therefore, the time required to check whether or not it is compatible is
Approximately 1/10% lower than when using conventional chip-shaped electronic components.
It becomes 10. Also, soldering only needs to be done at the end.
Unnecessary heat is not applied to chip-shaped electronic components. Therefore, the reliability of the chip-shaped electronic component after attachment is improved by about 20% compared to the conventional one.
第１図はこの発明の一実施例を示す斜視図であり、第２
Ａ図はその正面図であり、第２Ｂ図はその平面図である
。
第３図はチップ状電子部品を回路基板にセットした状態
を示す図解図である。
第４図はチップ状電子部品を回路基板からはずす状態を
示す図解図である。
第５図はチップ状電子部品の回路基板へのはんだ付け方
法の一例を示す図解図である。
第６図はチップ状電子部品の回路基板へのはんだ付け方
法の他の例を示す図解図である。
図において、ＩＯはチップ状電子部品、１２は電子素子
、１４ａ、１４ｂ、１４ｃおよび１４ｄは電極、１６ａ
、１６ｂ、１６ｃおよび１６ｄは導電ゴム、１８は回路
基板、２０は粘性ゴム、２２は棒、２４ははんだを示す
。
特許出願人 株式会社 村田製作所
代理人 弁理士 岡 １） 全 啓
第２Ａ図
第
図
第
図FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG.
Figure A is its front view, and Figure 2B is its plan view. FIG. 3 is an illustrative view showing a state in which chip-shaped electronic components are set on a circuit board. FIG. 4 is an illustrative view showing the state in which the chip-shaped electronic component is removed from the circuit board. FIG. 5 is an illustrative diagram showing an example of a method of soldering a chip-shaped electronic component to a circuit board. FIG. 6 is an illustrative view showing another example of a method for soldering a chip-shaped electronic component to a circuit board. In the figure, IO is a chip-shaped electronic component, 12 is an electronic element, 14a, 14b, 14c and 14d are electrodes, and 16a
, 16b, 16c and 16d are conductive rubbers, 18 is a circuit board, 20 is a viscous rubber, 22 is a rod, and 24 is solder. Patent Applicant Murata Manufacturing Co., Ltd. Representative Patent Attorney Oka 1) Kei Zen Figure 2A Figure Figure
Claims (1)
る導電ゴムとを含む、チップ状電子部品。 ２ 電極を有する電子素子と、前記電極に取り付けられ
る導電ゴムとを含むチップ状電子部品を準備するステッ
プ、 回路基板を準備するステップ、 前記回路基板の配線導体に前記チップ状電子部品の前記
導電ゴムを押し付けるステップ、 前記回路基板の特性を測定するステップ、および 前記回路基板の特性に適合する前記チップ状電子部品が
見つかったときに、前記電極と前記回路基板の配線導体
とをはんだ付けするステップを含む、チップ状電子部品
の取り付け方法。[Scope of Claims] 1. A chip-shaped electronic component including an electronic element having an electrode and a conductive rubber attached to the electrode. 2. preparing a chip-shaped electronic component including an electronic element having an electrode and a conductive rubber attached to the electrode; preparing a circuit board; attaching the conductive rubber of the chip-shaped electronic component to a wiring conductor of the circuit board; a step of pressing the circuit board, a step of measuring the characteristics of the circuit board, and a step of soldering the electrode and the wiring conductor of the circuit board when the chip-shaped electronic component matching the characteristics of the circuit board is found. How to attach chip-like electronic components, including:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25365490A JPH04130695A (en) | 1990-09-20 | 1990-09-20 | Chiplike electronic component and mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25365490A JPH04130695A (en) | 1990-09-20 | 1990-09-20 | Chiplike electronic component and mounting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04130695A true JPH04130695A (en) | 1992-05-01 |
Family
ID=17254332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25365490A Pending JPH04130695A (en) | 1990-09-20 | 1990-09-20 | Chiplike electronic component and mounting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04130695A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8268917B2 (en) | 2010-03-16 | 2012-09-18 | Fuji Xerox Co., Ltd. | Resin composition, molded product and method for producing molded product |
-
1990
- 1990-09-20 JP JP25365490A patent/JPH04130695A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8268917B2 (en) | 2010-03-16 | 2012-09-18 | Fuji Xerox Co., Ltd. | Resin composition, molded product and method for producing molded product |
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