JPH04127459A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the bend of outer leads even in a characteristic checking process by forming a resin layer for supporting the outer leads. CONSTITUTION:A package 7 is formed by sealing an island and semiconductor chip 3 with a resin after the chip 3 is mounted on the island of a lead frame which is coupled by means of the first tiebar 4A near the island and second tiebar 4B far from the island and connected to a frame 1. At the time of forming the package, a resin layer 2 is also formed between the first tiebar 4A and package 7. Then a resin layer 5 for supporting outer leads is formed in the area surrounded by the second tiebar 4B, outer leads 6, and frame 1. Since the outer leads 6 are connected with each other by means of the resin layer 5 after the leads 6 are separated from the frame and first and second tiebars 4A and 4B, the leads seldom bend even when a load is applied to the leads 6 at checking time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor device, and particularly to a method for manufacturing a resin-sealed semiconductor device.

[Conventional technology]

Generally, in the manufacturing process of resin-sealed semiconductor devices,
), a semiconductor chip 3 was mounted on an island of a lead frame having external leads 6 connected by tie bars 4 around the island, and then the semiconductor chip 3 was sealed with resin to form a package 7. At this time, the resin layer was formed between the outer cord 6 and the tie bar 4. After this, due to the necessity of checking the characteristics, the external lead 6 and the frame 1 were separated as shown in FIG. 2(b).

[Problem to be solved by the invention]

However, in the manufacturing process of the semiconductor device described above, in the step of checking the characteristics after cutting the external leads, a load is applied to the external leads from the outside by a contact bottle or the like without being supported.
It had the disadvantage that the external lead 6 was bent. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor device that eliminates the above drawbacks and prevents external leads from bending even under load.

[Means to solve the problem]

A method for manufacturing a semiconductor device of the present invention includes mounting a semiconductor chip on an island of a lead frame that has an external lead connected to the frame and connected by a first tie bar close to the island and a second tie bar remote from the island. and a step of forming a resin layer for supporting external leads in a portion surrounded by the second tie bar, external leads, and frame after forming a package by sealing the island and the semiconductor chip with resin. Be refined.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1(a) to 1(c) are top views of a lead frame and a package illustrating an embodiment of the present invention.

As shown in Figure 1(a), an island (not shown)
The first tie bar 4A is close to the island and the second tie bar is far from the island.
A semiconductor chip 3 is mounted on an island of a lead frame connected by tie bars 4B and connected to the frame 1, and then the island and the semiconductor chip 3 are sealed with resin to form a package 7. At this time, the resin layer 2 is also formed between the first tie bar 4A and the package 7. Next, an external lead supporting resin layer 5 is formed in a portion surrounded by the second tie bar 4B, the external lead 6, and the frame 1.

Next, as shown in FIG. 1(b), the resin layer 2, the first tie bar 4A, and the second tie bar 4B are removed by a known cutting method.

Next, as shown in FIG. 1C, the external lead supporting resin layer 5 is cut while remaining between the external leads 6.

According to this embodiment, even after the external leads 6 are separated from the frame 1 and the first and second tie bars 4A and 4B, the external leads 6 are still connected to each other by the external lead supporting resin layer 5. Because of this, there is almost no bending even if a load is applied during a check.

〔Effect of the invention〕

As explained above, the present invention has the advantage that by forming a resin layer for supporting the external leads, a semiconductor device with less bending of the external leads can be obtained even in the characteristic checking process.

[Brief explanation of the drawing]

1(a) to (c) are top views of a lead frame and a package for explaining one embodiment of the present invention, and FIG. 2(a>
, (b) are top views of a lead frame and a package for explaining a conventional example. DESCRIPTION OF SYMBOLS 1... Frame, 2... Resin layer, 3... Semiconductor chip, 4... Tie bar 4A... First tie bar
4B... Second tie bar, 5... Resin layer for supporting external leads, 6... External leads, 7... Package.

Claims (1)

[Claims] A step of mounting a semiconductor chip on an island of a lead frame having an external lead connected to the frame by a first tie bar close to the island and a second tie bar remote from the island, and mounting the island and the semiconductor chip. A method of manufacturing a semiconductor device, comprising the step of forming a resin layer for supporting external leads in a portion surrounded by the second tie bar, external leads, and frame after forming a package by resin sealing.