JPH0412727B2 - - Google Patents

Info

Publication number
JPH0412727B2
JPH0412727B2 JP60164430A JP16443085A JPH0412727B2 JP H0412727 B2 JPH0412727 B2 JP H0412727B2 JP 60164430 A JP60164430 A JP 60164430A JP 16443085 A JP16443085 A JP 16443085A JP H0412727 B2 JPH0412727 B2 JP H0412727B2
Authority
JP
Japan
Prior art keywords
molecular weight
imide
components
bis
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60164430A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6225126A (ja
Inventor
Atsuhiro Nakamoto
Yoshihisa Sugawa
Kenji Ogasawara
Masahiro Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP16443085A priority Critical patent/JPS6225126A/ja
Publication of JPS6225126A publication Critical patent/JPS6225126A/ja
Publication of JPH0412727B2 publication Critical patent/JPH0412727B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP16443085A 1985-07-25 1985-07-25 付加型イミド樹脂積層板 Granted JPS6225126A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16443085A JPS6225126A (ja) 1985-07-25 1985-07-25 付加型イミド樹脂積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16443085A JPS6225126A (ja) 1985-07-25 1985-07-25 付加型イミド樹脂積層板

Publications (2)

Publication Number Publication Date
JPS6225126A JPS6225126A (ja) 1987-02-03
JPH0412727B2 true JPH0412727B2 (enrdf_load_stackoverflow) 1992-03-05

Family

ID=15793004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16443085A Granted JPS6225126A (ja) 1985-07-25 1985-07-25 付加型イミド樹脂積層板

Country Status (1)

Country Link
JP (1) JPS6225126A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0012115A1 (de) * 1978-12-04 1980-06-11 Ciba-Geigy Ag Pharmazeutische Präparate zur topischen Behandlung von Virusinfektionen
JPH0791380B2 (ja) * 1988-03-19 1995-10-04 松下電工株式会社 付加型イミド樹脂プレポリマー組成物の製造方法
JPH0791381B2 (ja) * 1988-03-22 1995-10-04 松下電工株式会社 付加型イミド樹脂プレポリマー組成物の製造方法
JPH0791382B2 (ja) * 1988-03-26 1995-10-04 松下電工株式会社 付加型イミド樹脂プレポリマー組成物の製造方法
JP5549329B2 (ja) * 2010-04-02 2014-07-16 住友ベークライト株式会社 回路基板用熱硬化性組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952557B2 (ja) * 1981-09-29 1984-12-20 日立化成工業株式会社 印刷配線板の製造法
JPS604600A (ja) * 1983-06-23 1985-01-11 サンスタ−株式会社 メント−ル石けん
JPS60112684A (ja) * 1983-11-18 1985-06-19 日立造船株式会社 生汚泥の堆肥化処理方法
JPS61163938A (ja) * 1985-01-15 1986-07-24 Matsushita Electric Works Ltd 付加型イミド樹脂プリプレグ
JPS61271327A (ja) * 1985-05-25 1986-12-01 Matsushita Electric Works Ltd 付加型イミド樹脂プリプレグ

Also Published As

Publication number Publication date
JPS6225126A (ja) 1987-02-03

Similar Documents

Publication Publication Date Title
JPH0359105B2 (enrdf_load_stackoverflow)
CN107325285B (zh) 聚酰亚胺、聚酰亚胺类胶粘剂、胶粘材料、胶粘层、胶粘片、层叠板、布线板及其制造方法
JP5232386B2 (ja) 熱硬化性樹脂組成物およびその利用
KR20060065610A (ko) 폴리이미드 레진 및 캐스트-온-코퍼 라미네이트
JP5019874B2 (ja) 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板
JP4426774B2 (ja) 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板
JPH0412727B2 (enrdf_load_stackoverflow)
EP1667501A1 (en) Substrate for flexible printed wiring board and method for manufacturing same
JP4999318B2 (ja) ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物
JP7726754B2 (ja) ポリイミド樹脂、該ポリイミド樹脂を含有する樹脂組成物及びその硬化物
JPH041786B2 (enrdf_load_stackoverflow)
JPS6336619B2 (enrdf_load_stackoverflow)
JPH0359106B2 (enrdf_load_stackoverflow)
JPH0230333B2 (enrdf_load_stackoverflow)
JP2003192891A (ja) 耐熱性ポリイミド重合物及びその銅被覆積層板
JP7621112B2 (ja) 金属張積層板及びその製造方法
JPS63312321A (ja) 硬化性樹脂組成物
JPH0791380B2 (ja) 付加型イミド樹脂プレポリマー組成物の製造方法
JPS62143931A (ja) 付加型イミド樹脂プレポリマ−
JPH0791381B2 (ja) 付加型イミド樹脂プレポリマー組成物の製造方法
JPH0791382B2 (ja) 付加型イミド樹脂プレポリマー組成物の製造方法
JPH10139852A (ja) 変性エポキシ樹脂の製造法、変性エポキシ樹脂組成物、接着剤及び接着フィルム
KR20240085772A (ko) 폴리이미드 소재 접합용 열경화형 변성 폴리이미드 필름 및 이의 제조 방법
JPH02289620A (ja) 付加型イミド樹脂プレポリマー生成用反応触媒
JPH07258623A (ja) 耐熱性接着剤組成物

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term