JPH04124868A - Method of forming module of chip design - Google Patents

Abstract

PURPOSE:To straighten a power source lead-in line to be led-in a power terminal as much as possible and to shorten it by interconnecting cells via signal wiring, leading the signal wiring from the cell to a module frame to form a module, reducing a wiring region in the module by the compaction by a computer, and providing a framelike power supply wiring around the module. CONSTITUTION:Cells 121-129 are disposed, signal wiring among cells 121-129 are coupled, and signal wirings 14 necessary to input and output a module 10C is led from the cells 121-129 to a module frame 24A. Then, the wiring region in the module 10C is reduced by compaction of a computer as a module 10D. Thereafter, framelike power supply wiring 26, 28 are wired around the module 10D, and a Vcc terminal 16 in the module 10D, a Vss terminal 18, and the wiring 26, 28 out of the module 10D are connected will each other by power source lead-in wiring 32, 30.

Description

[Detailed description of the invention] 【overview】

Regarding the module creation method in chip design, the aim is to make the power supply line drawn from the module frame to the power supply terminal of the cell in the module as straight and short as possible, by arranging the cells and connecting the cells with signal lines. The first step is to draw a signal line from the cell to the module frame to create a module, and the module is compacted by a computer to reduce the wiring area within the module. a second step of reducing the size of the module, and a third step of wiring a frame-shaped power supply line around the module and connecting the power terminal of the cell and the frame-shaped power supply line to each other with a power lead-in line. It is configured with and.

[Industrial application field]

The present invention relates to a module creation method in chip design.

[Conventional technology]

BACKGROUND ART Semiconductor integrated circuits have become highly integrated due to the miniaturization of circuit elements, and as the circuit scale has increased, hierarchical design has become essential. In a hierarchical design, power supply wiring is also performed for modules. A module is created as follows. That is, as shown in FIG. 4, cells 121 to 129 necessary for the module 10A are arranged. Next, cells 121~
129 with a signal line, and pull out the signal line necessary for cell output from cells 121 to 129 to above the module frame 24A, and then connect the cell's Vc from above the module frame 24A.
c (5'i/) terminal 16, Vss (ground) terminal 18
Pull the power supply lead wires 20 and 22 up to the point. Next, the size of the module 10Δ is reduced by applying compaction using a computer to reduce the wiring area within the module 10A. As a result, the module 10A
Ei? A module 10B as shown in I is obtained.

[Problem to be solved by the invention]

However, in the wiring between modules in the hierarchy above this module 10B, 10 is viewed as a black box, so the position of the power supply line 20.22 on the module frame 24B with respect to the reference point P of the module 10B is changed. I can't. Therefore, due to the compaction described above, the power supply lead-in line 20
．． 22 is folded and stretched. If the power lead-in wire 20.22 becomes longer, the module 10B
This increases the size of the wiring, which impedes high integration.Furthermore, due to the miniaturization of wiring, resistance to electromigration, which causes wiring constriction, becomes weaker. In view of these problems, an object of the present invention is to provide a method for creating a module in chip design, in which the power supply line drawn from the module frame to the power supply terminal of the cell in the module can be made as straight and short as possible. Our goal is to provide the following.

[Means for Solving the Problems] The method for creating a module in chip design according to the present invention is shown in the 11th embodiment drawing! This will be explained with reference to FIG. 1 and FIG. This method consists of the following three steps (1) to (3):
It is equipped with (1) In the first step, as shown in FIG.
21 to 129 are arranged, and the cells are connected with the signal line 14,
A signal line is drawn out from the cell to the modular frame 24A to create a module 10C. (2) In the second step, the module 10C as shown in FIG. 1 is subjected to computer compaction to reduce the wiring area within the module 10C.
The module 10 as shown in FIG.
D and reduce its size. (3) In the third step, the frame-shaped power supply line 26.28 is wired around the module 10D, and the frame-shaped power supply line 28.28 is connected to the cell power terminal 16.18 inside the module 10D and the frame-shaped power supply line 28.26 outside the module 10D. and are connected to each other with power supply lead-in wires 32 and 30. [Operation] If the module 10D is created in this way, compaction will not be applied to the power supply lead-in lines 30 and 32, and
Since the frame-shaped power supply lines 26 and 28 surround the module 10D, the module 10D is connected from above the module frame 24B.
The power supply lead-in lines 30.32 leading to the power supply terminals 18.16 of the inner cells can be made as straight and short as possible.

【Example】

Hereinafter, one embodiment of the present invention will be described based on the drawings. The module creation procedure shown in FIG. 3 will be explained with reference to FIGS. 1 and 2. (50) First, as in FIG. 4, cells 121 to 129 necessary for the module 10C are arranged. (52) Next, as in FIG. 4, connect the signal lines between the cells 121 to 129, and also pull out the signal line 14 necessary for input/output of the module 10C from the cells 121 to 129 to above the module frame 24A. . At this wiring stage, unlike in FIG. 4, cells 121 to 12
Do not wire the power lead-in wires to the Vcc terminal 16 and Vs5 terminal 18 of 9. (54) Next, apply compaction using a computer,
By reducing the wiring area within module 1CIc, the size of module 10C is reduced. As a result, the module 10C becomes the module 1 as shown in FIG.
It becomes 0D. (56) Next, the frame-shaped power supply line 26 is wired around the module 10D, and the frame-shaped power supply line 28 is further wired around the frame-shaped power supply line 26. The width of the rod-shaped power supply lines 26 and 28 is determined depending on the maximum current value used by the module 10D. Next, V of the cell in module 10D
. C terminal 16, V55 terminal 18 and module 10D
The inner rod-shaped power supply lines 28 and 26 are connected to each other by power supply lead-in lines 32 and 30, respectively. For example, the width of the power lead-in line 30.32 is about 4 μm, and the width of the frame-shaped power supply line 26.28 is about 30 μm. By creating the module in this way, the power supply line 30.32 can be drawn straight into the module 10D and connected to the VCC terminal 16 and V5s terminal 18 of the cell. Can be shortened. Note that the frame-shaped power supply lines 26 and 28 are connected to a frame-shaped power supply line (not shown) along the edge of the chip for guiding power from the outside to the frame-shaped power supply lines 26 and 28.

【Effect of the invention】

As explained above, according to the module creation method in chip design according to the present invention, compaction is not applied to the power supply line drawn into the module, and the frame-shaped power supply line outside the module surrounds the module. This power supply lead-in line can be made as straight and short as possible, which greatly contributes to higher integration of semiconductor integrated circuits and increased resistance to electromigration.

[Brief explanation of the drawing]

1 to 3 relate to an embodiment of the module creation method in chip design according to the present invention, in which FIG. 1 is a diagram of the module before compaction of wiring, FIG. 2 is a diagram of the module after compaction, and FIG. is a flowchart showing the module creation procedure. 4 and 5 relate to a conventional example, where FIG. 4 is a module diagram before compaction, and FIG. 5 is a module diagram after compaction. In the figure, 10A, 10B, 10C, 10D are module 121, cell 14 is signal line 16, V CC terminal 18 is V5S terminal 20, 22, 30, 32 is power supply lead line 24A, 24B is module frame 26, 28 is frame shaped. Power supply line lie module creation procedure Figure 3

Claims (1)

[Claims] Cells (121 to 129) are arranged, and a signal line (1
4), the first step (50, 52) is to connect the signal line (14) from the cell to the module frame (24A) to create a module (10C), and the module is subjected to compaction using a computer. By reducing the wiring area within the module,
A second step (54) of reducing the size of the module
), Next, frame-shaped power supply lines (26, 28) are wired around the module (10D), and the power supply terminals (16, 1) of the cell are wired.
8) and the frame-shaped power supply line to the power supply lead-in line (30, 32)
A method for creating a module in chip design, comprising: a third step (56) of connecting wires to each other;