JPH04123372U - electronic parts storage case - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose is to obtain an electronic component storage case that can be sealed without damaging electronic components and is easy to automate. [Structure] A convex portion 7 is formed on either the outer periphery of the case 8 or the cover 5, and the convex portion 7 is pushed down with a heated iron 9 to weld and join the case 8 and the cover 5.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This idea consists of a case that houses electronic components and is sealed with a cover. This is related to the delivery case.

0002

[Conventional technology]

FIG. 5 is a plan view of the Hall effect sensor device, where 1 is a frame and 2 is a frame. The first case consists of terebutylene terephthalate (PBT) formed on 1 , 3 is the second case formed on the frame 1, 4 is the inside of the first case 2 and the second case formed on the frame 1. Hall IC sensor as an electronic component made of semiconductor housed in case 3 of 2 , 5 are covers for sealing the first case 2 and the second case 3.

0003 6 is a side sectional view of the first case 2, FIG. 7 is a plan view of FIG. 6, and 6 is a side sectional view of the first case 2. This is an adhesive for sealing the base 2 and the second case 3 with the cover 5.

0004 A power distribution device incorporating the above Hall effect type sensor device is used to clamp the internal combustion engine. The rotation of the drive shaft rotates a drive shaft (not shown), and the vane is fixed to this drive shaft. (not shown) is the gap (not shown) between the magnet (not shown) and the Hall IC sensor 4 (not shown). (not shown), the magnetic flux passing from the magnet toward the Hall IC sensor 4 is The magnetic flux is applied to the Hall IC sensor 4 as a change in magnetic flux according to the rotation of the drive shaft. It will be done. This Hall IC sensor 4 converts the change in magnetic flux into an electrical signal, and converts this signal into The ignition timing of the internal combustion engine is controlled.

[0005]

[Problem that the idea aims to solve]

In the above Hall effect sensor device, the first case 2 and the second case 3 are After placing the cover 5, pour the adhesive 6 into the gap between the cases 2 and 3 and the cover 5. , since the cases 2 and 3 are sealed with the cover 5 after drying in the drying oven, the Hall effect The manufacturing process for shaped sensor devices requires a drying process using batch processing, which requires automation. The problem was that it was difficult. Also, adhesive 6 must be prepared, and it However, there was a problem in that the manufacturing cost was high. There is also an ultrasonic welding method for sealing the cases 2 and 3 with the cover 5. However, in this case, noise becomes a problem, and the Hall IC sensor 4 is damaged due to minute vibrations. The problem was that it could cause damage to the In addition, high frequency welding is also available as another means of sealing the cases 2 and 3 with the cover 5. In this case, the high magnetic field damages the Hall IC sensor 4 and also damages the metal. There was a problem that parts of the product would generate heat, causing the solder parts, for example, to melt.

[0006] This idea was made to solve the problems mentioned above, and it To obtain an electronic component storage case that is sealed without causing damage and that is easy to automate. The purpose is to

[0007]

[Means to solve the problem]

The electronic component storage case according to this invention has both the outer periphery of the case and the cover. Form a convex part in the crab, then push the convex part down with a heated iron to attach the case and cover. It is constructed by welding and joining.

[0008]

[Effect]

In this invention, the convex part is collapsed by pressing the convex part with a heated iron. The case and cover are welded together.

[0009]

【Example】

Example 1 Hereinafter, embodiments of this invention will be described with reference to the drawings. Figure 1 shows an example of this idea. The same or equivalent parts as in FIGS. The explanation of is omitted.

0010 In the figure, 7 is a convex portion formed on the outer periphery of the case 8, and 9 is an R-shaped tip. It's a trowel.

[0011] In the above electronic component storage case, cover 5 is placed on case 8 and heated to approximately 230°C. Using a heated iron 9, press the convex part 7 so that the convex part 7 falls inward, and the convex part 7 and It is joined to the cover 5 (see FIGS. 2 and 3). At this time, as shown in Figure 4, The outer periphery of the base 8 has a wall thickness of dimension D, and has sufficient sealing strength.

0012 Example 2 In the above embodiment, the protrusion 7 was formed on the case 8 side, but the protrusion 7 was formed on the cover 5 side. may be formed. In addition, when the Hall IC sensor 4 is housed in the case 8, Although it is explained above, it is not limited to this, and it can be used to store other electronic components. Of course you can.

[0013]

[Effect of the idea]

As explained above, according to the electronic component storage case of this invention, the outer periphery of the case Form a convex part on either the part or the cover, and then knock down this convex part with a heated iron. However, the case and cover are welded together, which may damage electronic components. It can be sealed with a cover inside the case without any need for adhesive, and it also eliminates the need for adhesives that were previously required. There is an effect that there is no need to use it, and manufacturing costs can be reduced. Also, It also has the effect of reducing the conventional drying process and making it easier to automate.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing an embodiment of this invention.

FIG. 2 is a side cross-sectional view showing a state in which the case and cover of FIG. 1 are welded together.

FIG. 3 is a side cross-sectional view after the case and cover of FIG. 1 are welded together.

FIG. 4 is an enlarged view of the main part of FIG. 3;

FIG. 5 is a plan view showing an example of a Hall effect sensor device.

6 is a side sectional view of the electronic component storage case of FIG. 5. FIG.

FIG. 7 is a plan view of FIG. 6;

[Explanation of symbols]

4 Hall IC sensor 5 Cover 7 Convex part 8 cases 9 Trowel

Claims (1)

[Scope of utility model registration request] 1. An electronic component storage case in which a case housing electronic components is sealed with a cover, wherein a convex portion is formed on either the outer periphery of the case or the cover,
An electronic component storage case characterized in that the convex portion is brought down with a heated iron and the case and the cover are welded and joined.