KR960001209Y1 - Receipt case of electrical products - Google Patents

Receipt case of electrical products Download PDF

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Publication number
KR960001209Y1
KR960001209Y1 KR92004941U KR920004941U KR960001209Y1 KR 960001209 Y1 KR960001209 Y1 KR 960001209Y1 KR 92004941 U KR92004941 U KR 92004941U KR 920004941 U KR920004941 U KR 920004941U KR 960001209 Y1 KR960001209 Y1 KR 960001209Y1
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KR
South Korea
Prior art keywords
case
cover
electronic component
hall
protrusion
Prior art date
Application number
KR92004941U
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Korean (ko)
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KR920020534U (en
Inventor
히로히사 에노키다
Original Assignee
시키 모리야
미쯔비시덴키가부시키가이샤
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Publication of KR920020534U publication Critical patent/KR920020534U/en
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Publication of KR960001209Y1 publication Critical patent/KR960001209Y1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00Details of instruments
    • G01P1/02Housings
    • G01P1/026Housings for speed measuring devices, e.g. pulse generator
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00Hall-effect devices
    • H10N52/80Constructional details

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Casings For Electric Apparatus (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)

Abstract

내용 없음.No content.

Description

전자부품 수납케이스Electronic component storage case

제 1 도는 이 고안의 한 실시예를 표시하는 측단면도1 is a side cross-sectional view showing an embodiment of this invention.

제 2 도는 제 1 도의 케이스와 커버가 용착접합되는 과정을 표시하는 측단면도2 is a cross-sectional side view showing the process of welding the case and cover of FIG.

제 3 도는 제 1 도의 케이스와 커버가 용착접합된 후의 측단면도3 is a cross-sectional side view of the case and cover of FIG. 1 after welding.

제 4 도는 제 3 도의 요부확대도4 is an enlarged view of the main part of FIG.

제 5 도는 홀(hole)효과형 센서장치의 일예를 표시하는 평면도5 is a plan view showing an example of a hole effect sensor device

제 6 도는 제 5 도의 전자부품 수납케이스의 측단면도6 is a side cross-sectional view of the electronic component storage case of FIG.

제 7 도는 제 6 도의 평면도7 is a plan view of FIG.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

4 : 홀(hole) IC센서 5 : 커버4 hole IC sensor 5 cover

7 : 돌출부 8 : 케이스7: protrusion 8: case

9 : 인두9: iron

이 고안은 전자부품을 수납한 케이스가 커버로 봉해져 있는 전자부품수납케이스에 관한 것이다.This invention relates to an electronic component storage case in which a case containing electronic components is sealed with a cover.

제 5 도는 홀효과형 센서장치의 평면도이고, 1은 플레임, 2는 플레임(1)상에 형성된 폴리푸틸렌 텔레프틸레이드(PBT)로 구성된 제1의 케이스, 3은 플레임(1)상에 형성된 제2의 케이스, 4는 제1의 케이스(2)내 및 제2의 케이스(3)내에 수납된 반도체로된 전자부품으로서의 홀IC센서, 5는 제1의 케이스(2) 및 제2의 케이스(3)를 커버(5)로 밀폐하기 위한 접착제이다.5 is a plan view of a Hall effect sensor device, 1 is a flame, 2 is a first case composed of polybutylene teleptylide (PBT) formed on flame 1, 3 is formed on flame 1 The second case, 4 is a Hall IC sensor as an electronic component made of semiconductor housed in the first case 2 and in the second case 3, 5 is the first case 2 and the second case. It is an adhesive agent for sealing (3) with the cover 5.

상기의 홀 효과용 센서장치가 조립되어 있는 배전기에서는, 내연기관의 크랭크축의 회전에 의해 구동축(도시않음)이 회전하고, 이 구동축에 고착된벤(Vane)(도시않음)이 마그네트와 (도시않음) 홀IC센서(4) 사이의 공극(도시않음)을 가로지를 때마다 마그네트로부터 홀IC센서(4)를 향해 통과하는 자속(磁束)을 차단하고, 홀IC센서(4)에는 구동축의 회전에 따른 자속의 변화로 주어진다. 이 홀IC센서(4)에서는 자속의 변화를 전기신호로 변환해서 이 신호에 의해 내연기관의 점화시기가 제어된다.In the distributor in which the above-described hall effect sensor device is assembled, the drive shaft (not shown) is rotated by the rotation of the crankshaft of the internal combustion engine, and the vane (not shown) fixed to the drive shaft is magnet and (not shown). ) The magnetic flux passing from the magnet toward the Hall IC sensor 4 is blocked each time it crosses the gap (not shown) between the Hall IC sensors 4, and the Hall IC sensor 4 is connected to the rotation of the drive shaft. Given by the change in flux. In this hall IC sensor 4, the change in magnetic flux is converted into an electric signal, and the ignition timing of the internal combustion engine is controlled by this signal.

상기한 홀효과용 센서장치에서는, 제1의 케이스(2) 및 제2의 케이스(3)에 커버(5)를 올려놓은 후 케이스(2)(3)과 커버(5) 사이의 틈새에 접착제(6)를 흘려보내서, 건조내에서 건조해서 케이스(2)(3)을 커버(5)로 봉합고 있음으로 홀효과용 센서장치의 제조공정에서는 벳치(batch)처리에 의한 건조공정이 필요하게 되고 자동화가 곤란하다는 과제가 있었다. 또 접착제(6)를 준비해야 되고 그만큼 제조코스트가 올라간다는 과제가 있었다.In the Hall effect sensor device described above, the cover 5 is placed on the first case 2 and the second case 3, and then adhesive is applied to the gap between the cases 2, 3 and 5. (6) is flowed, dried in drying, and the cases (2) and (3) are sealed with a cover (5), so that the drying process by batch processing is necessary in the manufacturing process of the hall effect sensor device. There was a problem that automation was difficult. Moreover, the adhesive 6 had to be prepared, and there existed a subject that manufacturing cost went up by that much.

케이스(2)(3)을 커버(5)로 봉하는 수단으로, 이외에 초음파용착의 방법도 있으나 이 경우에는 소음이 문제가 되고, 또한 미세한 진동에 의해 홀IC센서(4)에 손상을 주게 된다는 과제가 있었다.As a means of sealing the case (2) (3) with the cover (5), there is also a method of ultrasonic welding in this case, but noise is a problem in this case, and damage to the Hall IC sensor (4) by the fine vibration There was a challenge.

또 케이스(2)(3)을 커버(5)를 봉하는 다른 수단으로 고주파용착이 있으나, 이때에는 고자장(高磁場)에 의해 홀IC센서(4)에 손상을 주게되는 동시에 금속부분이 발열해서, 예를들어 납땜부분이 녹아버린다는 과제가 있었다.In addition, there is a high frequency welding as another means of sealing the case (2) and (3) to the cover (5). At this time, the magnetic field causes damage to the Hall IC sensor (4) and at the same time the metal part generates heat. Thus, for example, there has been a problem that the soldered part melts.

이 고안은 상기와 같은 과제를 해결하기 위해 고안된 것으로 전자부품에 손상을 주는 일 없이 봉해지고, 또 자동화하기 쉬운 전자부품 수납케이스를 얻는 것을 목적으로 하는 것이다.This invention is designed to solve the above problems, and an object thereof is to obtain an electronic component storage case that is sealed without damaging the electronic components and is easy to automate.

이 고안에 관한 전자부품 수납케이스는 케이스의 외주부 또는 커버의 어느쪽에 돌출부를 형성해 이 돌출부를 가입된 인두로 눕혀서 케이스와 커버를 용착접합해서 구성된 것이다.The electronic component storage case according to the present invention is formed by welding a case and a cover by forming a protrusion on either the outer periphery of the case or the cover and laying the protrusion on the joined iron.

이 고안에 있어서는 가열된 인두로 돌출부로 가입하며 누름으로써 돌출부는 눕혀지고 케이스와 커버는 용착접합된다.In this design, the heated iron is joined to the protrusion by pressing and the protrusion is laid down and the case and the cover are welded together.

[실시예 1]Example 1

이하, 이 고안의 실시예를 도면에 따라 설명한다. 제 1 도는 이 고안의 한 실시예를 표시하는 단면도이고, 제 5 도 내지 제 7 도와 같거나 상당되는 부분은 동일부호를 붙여 그 설명은 생략한다.An embodiment of this invention is described below with reference to the drawings. 1 is a cross-sectional view showing an embodiment of the present invention, and the same or equivalent parts as those in FIGS. 5 to 7 are denoted by the same reference numerals and description thereof will be omitted.

도면에서, 7은 케이스(8)의 외주부에 형성된 돌출부, 9는 선단부가 R형상의 인두이다.In the drawing, 7 is a protruding portion formed in the outer circumferential portion of the case 8, and 9 is the tip of the R-shaped iron.

상기 전자부품 수납케이스에서는 케이스(8)에 커버(5)를 올려놓고 약 230℃로 가열된 인두(9)를 사용해서 돌출부(7)를 눌러서 안쪽으로 눕히고 돌출부(7)와 커버(5)는 a부에서 융합해서 접합된다. (제 2 도 및 제 3 도 참조)In the electronic component storage case, the cover 5 is placed on the case 8 and the projection 7 is pressed down using the iron 9 heated to about 230 ° C. to lie inward. It joins by fusing in a part. (See FIGS. 2 and 3)

이때 제 4 도에 표시하는 바와 같이 케이스(8)의 외주부에는 D치수의 두께를 갖고 있어 충분한 봉함강도를 갖고 있다.At this time, as shown in FIG. 4, the outer peripheral part of the case 8 has the thickness of D dimension, and has sufficient sealing strength.

[실시예 2]Example 2

또 상기 실시예에서는 케이스(8)측에 돌출부(7)를 형성했으나, 커버(5)측에 돌출부를 형성해도 무방하다. 또 케이스(8)내에 홀IC센서(4)가 수납되어 있을때를 설명했으나, 이에 한정되는 것이 아니고 다른 전자제품을 수납할 수도 있다.Moreover, although the protrusion part 7 was formed in the case 8 side in the said Example, you may form a protrusion part in the cover 5 side. In addition, although the case where the Hall IC sensor 4 is accommodated in the case 8 was demonstrated, it is not limited to this and other electronic products can also be accommodated.

이상 설명한 바와 같이 이 고안의 전자부품 수납케이스에 의하면 케이스의 외주부 또는 커버의 어느쪽엔가 돌출부를 형성해서 이 돌출부를 가열된 인두로 눕혀서, 케이스와 커버를 용착 접합해서 구성함으로써 전자부품을 손상하는 일 없이 케이스내에 커버를 봉합할 수가 있고, 또 종래 필요로 한 접착제를 사용할 필요가 없고 제조코스트를 저감시킬 수 있다는 효과가 있다.As described above, according to the electronic component storage case of the present invention, a protrusion is formed on either the outer periphery of the case or the cover, and the protrusion is laid down by a heated iron, and the case and the cover are welded together to constitute the case without damaging the electronic components. There is an effect that the cover can be sealed in the case, and there is no need to use an adhesive required in the related art, and the manufacturing cost can be reduced.

또 종래예는 있었던 건조공정은 삭감되고 자동화가 쉬워진다는 효과가 있다.Moreover, there exists an effect that the drying process which existed in the prior art is reduced and automation becomes easy.

Claims (1)

(정정) 전자부품을 수납한 케이스(8)가 커버(5)로 봉함되어 있는 전자부품 수납케이스에 있어서,(Correction) In the electronic part storage case in which the case 8 which accommodated the electronic component is sealed by the cover 5, 상기 케이스(8)의 외주부 또는 상기 커버(5)의 어느쪽인가에 돌출부(7)를 만들어 이 돌출부(7)을 가열한 인두(9)로 눕혀서 상기 케이스(8)와 상기 커버(5)를 용착접합해서 되는 것을 특징으로 하는 전자부품 수납케이스.A protrusion 7 is formed on the outer periphery of the case 8 or on the cover 5, and the case 7 and the cover 5 are laid down by a heated iron 9. An electronic component storage case characterized by welding welding.
KR92004941U 1991-04-24 1992-03-27 Receipt case of electrical products KR960001209Y1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-028185 1991-04-24
JP1991028185U JPH04123372U (en) 1991-04-24 1991-04-24 electronic parts storage case

Publications (2)

Publication Number Publication Date
KR920020534U KR920020534U (en) 1992-11-17
KR960001209Y1 true KR960001209Y1 (en) 1996-02-08

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Application Number Title Priority Date Filing Date
KR92004941U KR960001209Y1 (en) 1991-04-24 1992-03-27 Receipt case of electrical products

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JP (1) JPH04123372U (en)
KR (1) KR960001209Y1 (en)
DE (1) DE4212673A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19806722A1 (en) * 1998-02-18 1999-08-19 Itt Mfg Enterprises Inc Active sensor with electronic component, e.g. for motor vehicle braking system
CN106061175B (en) * 2016-07-04 2021-10-01 中洁环淼(江苏)环境科技有限公司 Casing with portable buckle three proofings structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2717348C3 (en) * 1977-04-19 1981-01-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Electromechanical component
JPS59182827U (en) * 1983-05-24 1984-12-05 アルプス電気株式会社 push button switch

Also Published As

Publication number Publication date
KR920020534U (en) 1992-11-17
JPH04123372U (en) 1992-11-09
DE4212673A1 (en) 1992-10-29

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