JPH04119849A - Manufacture of process screen for serigraph - Google Patents

Abstract

PURPOSE:To enable a physical screen characteristic to be freely established by a method wherein a screen body is formed by electroformed working via an electroformed mold consisting of a resist film. CONSTITUTION:A resist film 11 is removed by peeling off, and further a plate forming layer 5 is separated from an electroformed matrix 9, An obtained blank 10c is reversed, and a resist film 13 for formation of a printing pattern 6 is formed on a surface of the plate forming layer 5. Then, an etching liquid is applied to a blank 10d on which the resist film 13 is formed, the plate forming layer 5 specified by the resist film 13 and a mediating layer 4 are removed by erosive notching, and a printing pattern reaching to a screen body 3 is formed. Thereafter, processes such as water washing, drying, removal of the resist film 13, etc., are performed to obtain a process screen 1. For the process screen 1 obtained by abovementioned process, printing is performed by using a peeled surface from the electroformed matrix 9 of the plate forming layer 5 as a printing surface 15.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to the manufacture of a plate-making screen for screen printing, which is used, for example, in the manufacture of lead frames for IC chips and printed wiring boards with wiring patterns of hybrid river C. Regarding the method.

[Conventional technology]

Conventional plate-making screens are generally made of thread or wire and coated with photoresist, but in order to achieve higher precision printing, a plate-making screen of the form shown in Figure 4 has been developed. It is used (document unknown). This has a metal foil 21 made of nickel, stainless steel, etc. bonded and fixed by electroplating to one side of a screen body 20 made of fine stainless steel wire.

When forming a printing plate, a photoresist is applied to the surface of the metal foil 21, and is exposed and developed to form a resist film for etching. After removing the exposed portion of the metal foil 21 defined by the resist film by etching, the resist film is peeled off to form a printed pattern 23.

Printing is performed by bringing the metal foil 21 side into close contact with the object to be printed. According to this plate-making screen, the printing pattern is printed on the metal foil 21.
Since it is formed with 1, it not only provides chemical resistance and abrasion resistance, but also prevents the pattern edges from sagging or deforming.
Able to print sharply for a long period of time.

C. Problems to be Solved by the Invention] However, the above-mentioned plate-making screen uses a screen body 20, which is made of thin stainless steel wire and has a defined mesh size and shape, as a printing plate element. Therefore, it is not possible to freely select the aperture ratio, the total thickness of the plate-making screen, etc., and the amount of adhesion of printing ink and the printing thickness are fixed, resulting in a lack of flexibility during printing. Further, since there is a limit to the reduction in the diameter of the thin stainless steel wire, the mensch size cannot be reduced below a certain value, and it is difficult to achieve high precision printing. During the plating process, the fine stainless steel wire is covered with a plating layer, which has the disadvantage of reducing the porosity.

This invention solves the above-mentioned problems, and its purpose is to form the screen body and the plate forming layer on which the printed pattern is formed by electroforming, so that physical properties such as aperture ratio and total thickness can be improved. A screen printing plate making system that allows you to freely set the screen characteristics and to make the mesh size sufficiently fine as required.It has excellent flexibility during printing and is suitable for high-precision printing. It's all about getting the screen.

Another object of the present invention is to obtain a plate-making screen that can form a printing surface of a plate-forming layer with high flatness and that can provide high resolution during printing.

[Means to solve the problem]

The manufacturing method of the present invention includes the steps of forming the plate forming layer 5 on the surface of the electroforming mother mold 9 by electroforming, plating the surface of the plate forming layer 5 to form the intermediate layer 4, and the intermediate layer. After coating the photoresist 11a on the surface of 4,
A process of printing a mesh pattern on the photoresist 11a via a pattern film 12 and developing it to form a resist film 11, and forming a group of ink holes 2 on the surface of the intermediate layer 4 defined by the resist film 11. After applying a photoresist to the surface of the plate forming layer 50 peeled off from the electroforming matrix 9, a printed pattern is baked on the photoresist via a pattern film 12, and developed. The plate-making screen l is formed through a process of processing to form a resist film 13 and a process of etching the plate forming layer 5 defined by the resist film 13 to form a printed pattern 6 that reaches the screen body 3. do.

[Effect]

An electroforming mold is formed using the resist film 11, and the screen body 3 is formed by electroforming on the surface of the intermediate layer 4 defined by this mold, so the mesh size, mesh pattern, and thickness of the screen body 3 can be freely set. ,
The thickness of the plate forming layer 5 formed by electroforming prior to the screen body 3 can also be freely set.

After forming the plate forming layer 5 in advance and forming the intermediary layer 4 and the screen body 3 on its surface side, the plate forming layer 5 is peeled off from the electroforming mother mold 9. Therefore, in a series of processing steps, the plate forming layer 5 is It is possible to prevent stress from acting and internal stress from remaining, and the plate-making screen 1 is formed by using the printing surface 15 as the surface of the plate-forming layer 5 that comes into contact with the electroforming mold 9, that is, the surface that provides high flatness. , the degree of adhesion to the printing target can be improved.

The intermediary layer 4 is provided to improve the bonding strength between the screen body 3 and the screen body 3 on the surface of the plate-forming layer 5 and to prevent peeling.

〔Effect of the invention〕

In this invention, the plate forming layer 5 is formed by electroforming in order to form the printed pattern 6, and the intermediate layer 4 is formed on the surface of the plate forming layer 5.
Since the screen body 3 is formed by electroforming through an electroforming mold made of a resist film 11, the mesh size and mesh pattern of the screen body 3 and the total thickness of the plate-making screen 1 are It is now possible to freely set the physical screen characteristics such as, etc., and it is now possible to accurately control the amount of ink adhesion and printing thickness depending on the printing target. This improves flexibility during printing, increasing the degree of freedom in the design of printed wiring, for example.Furthermore, the mesh size can be highly miniaturized, making it possible to print with high precision, such as lead wires. When forming IC lead frames, which are becoming increasingly dense, wiring patterns can be formed with high printing accuracy.

The plate forming layer 5 is formed on the electroforming mother mold 9, and the intermediary layer 4 and the screen body 3 are formed on the surface side thereof. Since it is held by the mold 9, it is possible to prevent stress from acting on the plate forming layer 5 and remaining as internal stress during a series of processing steps. In addition, the electroforming mother mold 9 of the plate forming layer 5 that provides high flatness
Since the contact surface with the printing surface 15 is used as the printing surface 15, the degree of adhesion between the plate making screen 1 and the printing object during printing can be improved, and the resolution during printing can be improved as a whole.

[First Embodiment] Figures 1 (al to g) and 2 show a first embodiment of the method for manufacturing a plate-making screen according to the present invention.

As shown in FIG. 2, the plate making screen 1 includes a screen body 3 having a group of ink ports 2, and a screen body 3 having a group of ink ports 2.
A plate forming layer 5 is integrated on one side of the plate via an intermediary layer 4, and a printing pattern 6 is formed on the plate forming N5.

In this plate-making screen 1, a plate forming layer 5, an intermediary layer 4, and a screen body 3 are formed in this order through the steps shown in FIGS.

To explain in detail, nickel is electrodeposited on the surface of an electroforming master mold 9 made of a flat stainless steel plate material by electroforming process to form a plate forming layer 5 having a thickness of 10 μm (see FIG. 1). a)).

Next, the blank 10a obtained in the above step is transferred to a plating bath, and the surface of the plate forming layer 5 is plated with copper cyanide to form an intermediate layer 4 having a thickness of 2 to 3 μm (FIG. 1(b)). ).

This intermediary layer 4 is provided to firmly bind and integrate the screen body 3 formed in a later step with the board forming layer 5, and if it is omitted, layer 5
and the screen body 3 are relatively easily peeled off.

After forming the intermediate layer 4, the entire blank 10b is washed with water and dried, and a resist film 11 is formed on the surface of the intermediate layer 4. Specifically, a photoresist (11a) is applied to the surface of the intermediary layer 4 to a uniform thickness and dried (FIG. 1(C)). Next, the pattern film 12 is closely attached to the photoresist 11a, a mesh pattern is baked, development, removal of unexposed areas, drying, etc. are performed, and the resist film 11 becomes an electroforming mold.
(Fig. 1(d)).

The blank is treated with an acid bath to activate the surface of the intermediate layer 4 that is not covered with the resist film 11, and then washed with water and dried. A 4% aqueous sulfuric acid solution was used as the acid bath solution.

Next, the blank after the acid bath is transferred to an electroforming bath, and the resist film 1
Nickel is electrodeposited on the surface of the intermediate layer 4 defined in 1, that is, the activated surface, by electroforming, and the resist film 11 is formed.
In this embodiment, the screen body 3 is equipped with a group of ink ports 2 that match the mesh pattern of, for example, 25
It is formed to a thickness of μm (FIG. 1(e)). The thickness of the screen body 3 can be freely set within the range of the thickness of the resist film 11 by adjusting the electroforming time.
It can also be freely set by changing the thickness dimension. After this, as shown in FIG. 1 (fl), the resist film 11
is peeled off and the plate forming layer 5 is further separated from the electroforming mother mold 9.

The blank 10c obtained in the above step is inverted, and a resist film 13 for forming a printed pattern 6 on the surface of the plate forming layer 5 is formed. This resist film 13 is formed in the same manner as the resist film 11 formed in the previous step, and differs only in that the pattern printed on the film surface is a printed pattern and that the film thickness is small.

Next, an etching solution is applied to the blank 10d on which the resist film 13 has been formed, and the plate forming layer 5 and intermediate layer 4 defined by the resist film 13 are etched away to form a printed pattern 6 that reaches the screen body 3. do. Thereafter, by performing processes such as washing with water, drying, and removing the resist film 13, the plate-making screen 1 shown in FIG. 2 can be obtained.

The plate-making screen I obtained above is printed with the surface of the plate-forming layer 5 separated from the electroforming mold 9 as the printing surface 15.

[Second Embodiment] In the first embodiment, the intermediary layer 4 is formed by a normal electroplating method.
was formed. This example differs from the first example in that copper is formed on the surface of the plate forming layer 5 by a strike plating method, but otherwise the plate-making screen 1 was formed through the same process as in the first example.

[Third Embodiment] FIG. 3 shows another embodiment of the plate-making screen 1 with a modified mesh pattern, in which a group of ink ports 2 are formed by circular holes. In this way, the mesh size and mesh pattern can be freely changed and selected according to the physical characteristics required of the prepress screen 1.

[Another Embodiment] The screen main body 3 and the plate forming layer 5 may be formed of a nickel alloy containing a portion of cobalt, for example, instead of being formed of Ni-Nokel.

The intermediary N4 in the first embodiment may be made of copper instead of copper cyanide.

As the acid bath solution for activating the surface of the mediating layer 4, a 2% aqueous hydrochloric acid solution can also be used.

[Brief explanation of drawings]

1A to GL and FIG. 2 show a first embodiment according to the present invention, FIGS. The figure is a partially enlarged perspective view of the plate-making screen. FIG. 3 is a partially enlarged perspective view showing a third embodiment of the plate-making screen. FIG. 4 is a sectional view showing a conventional plate-making screen. 1... Plate making screen, 2... Ink port, 3... Screen body, 4... Intermediate layer, 5... Board forming layer, 6... ...Printing pattern, 9...Electroforming mother mold, 11...Resist film, 13...Resist film, 15...Printing surface. Same inventor

Claims (1)

[Claims] 1. A step of forming a plate forming layer (5) on the surface of the electroforming mother mold (9) by electroforming, and plating the surface of the plate forming layer (5) to form an intermediate layer (4). ), and after applying a photoresist (11a) on the surface of the intermediary layer (4), a mesh pattern is printed on the photoresist (11a) through a pattern film (12), and the resist is processed by development. A step of forming a film (11) and a step of forming a screen body (3) having a group of ink holes (2) on the surface of the intermediary layer (4) defined by the resist film (11) by electroforming. After applying a photoresist to the surface of the plate forming layer (5) peeled off from the electroforming mother mold (9), a printed pattern is baked on the photoresist via a pattern film, and developed to form a resist film (13). ) and a step of etching the plate forming layer (5) defined by the resist film (13) to form a printing pattern (6) that reaches the screen body (3). A method for producing a screen printing plate-making screen, characterized by forming (1).