JPH04116144U - Chip-shaped electronic components - Google Patents

Abstract

(57) [Summary] [Purpose] When a chip-shaped electronic component having at least two adjacent external terminal electrodes on the same surface is soldered to a component land on a board, it is possible to prevent solder bridging between the electrodes. To provide an electronic component that ensures reliable connection between a chip component and a board. [Structure] A chip-shaped electronic component having at least two adjacent external terminal electrodes 3 on the same surface, with a solder resist layer made of an insulating solder-resistant material such as epoxy resin between the external terminal electrodes. 4 is formed by a printing method or the like.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to chip-shaped electronic components that have a function to prevent solder bridging of external electrodes. do.

0002

[Conventional technology]

Chip-shaped electronic components with external electrodes on the end faces are mounted on ceramic substrates or printed circuit boards. When mounting on a board, etc., the connections provided on each of these boards and the chip-shaped electronic components are Connect the connecting terminals using flow soldering, reflow soldering, or iron soldering. There are known methods for making connections.

0003

[Problem that the idea aims to solve]

For electrically connecting chip-shaped electronic components with external terminal electrodes on the end surface to the board. The soldering method described above is used for this purpose, but as electronic components become smaller, As a result, the spacing between the external terminal electrodes of the chip gradually narrows, making it relatively difficult to mount components. There was a problem in that short circuits due to solder were more likely to occur.

0004 Therefore, an object of the present invention is to arrange at least two adjacent external terminal electrodes on the same plane. The chip-shaped electronic component on the top is mounted on the board, and the external terminal electrode and the chip-like electronic component on the board are mounted on the board. When soldering component lands, ensure that solder bridges occur between the electrodes. We provide chip-shaped electronic components that can easily connect chip components and substrates. There are many things.

[0005]

[Means to solve the problem]

As a result of research to achieve the above purpose, the present inventor has developed Place it on a board and connect its external terminal electrode to the component land on the board using solder. When connecting external terminal electrodes, use a solder layer made of insulating resin that prevents solder from adhering between the external terminal electrodes. By forming a resist layer, even if the solder melts and flows, it will not occur between the electrodes. We have discovered that short circuits caused by solder can be reliably prevented and have arrived at the present invention.

[0006] That is, the present invention has at least two adjacent external terminal electrodes on the same plane. Chip-shaped electronic components that have insulating properties that prevent solder from adhering between external electrode terminals. The present invention also provides a chip-shaped electronic component characterized by the presence of a soldered resist layer. It is.

[0007] In this invention, the solder resist layer is applied by printing or transfer. It is easy to apply, and the material for the solder resist layer can be used as long as it has insulating properties. For example, epoxy-based or silicon-based resins or glass may be used.

[0008]

[Effect]

An insulating solder resist layer is formed between the external terminal electrodes, so the solder does not melt. At this time, even if the solder flows, it is blocked by the solder resist layer and does not cause a short circuit between the electrodes. stomach.

[0009]

[Example 1] FIG. 1 is a perspective view showing one embodiment of the chip-shaped electronic component of the present invention.

0010 A plurality of external terminal electrodes 3 are formed on the side surface 2 of this electronic component. Electrodes are also formed on the main surface 1 of the electronic component continuously from the side surface.

[0011] In this example, solder made of epoxy resin is used between the terminals of the external electrode on side 2. The resist layer 4 is formed by a printing method.

0012 FIG. 2 is a perspective view showing an example of mounting the chip-shaped electronic component shown in FIG. 1 on a circuit board 5. A chip provided at a predetermined position on the circuit board 5 and connected to the circuit wiring 6. After the cream solder 7 is printed on the component land for mounting the shaped electronic component, the component land is Electronic components are placed on top of the board. Place this circuit board in a reflow oven and apply cream solder. When the solder 7 is melted, even if the solder flows onto the solder resist layer 4, it is repelled. Therefore, short circuits caused by solder between terminal electrodes can be prevented.

[0013]

[Example 2] 3 and 4 are perspective views showing other embodiments of the chip-shaped electronic component of the present invention. In these figures, the solder resist layer 4 is also formed on the main surface 1 of the electronic component. ing. FIG. 5 is a side view showing an example of mounting the chip-shaped electronic component shown in FIG. Therefore, even if the electronic components are placed on the circuit board 5 in this way, the sides of the electronic components will not come into contact with the circuit board 5. , where it is electrically and mechanically connected to the wiring pattern on the circuit board, and in this example In this case, the solder resist layer 4 is formed on the main surface 1 of the chip component. This prevents short circuits caused by solder between the external terminal electrodes formed on the main surface. Ru.

[0014]

[Effect of the idea]

As explained above, the chip-shaped electronic component of the present invention has insulation between the external terminal electrodes. Since a solder resist layer of This prevents short circuits and allows for easy and reliable connections between the chip components and the board. Ru.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing one embodiment of a chip-shaped electronic component of the present invention.

FIG. 2 is a perspective view showing an example of mounting the chip-shaped electronic component of FIG. 1 on a circuit board.

FIG. 3 is a perspective view showing an embodiment of the chip-shaped electronic component of the present invention in which a solder resist layer is also formed on the main surface of the electronic component.

4 is a perspective view showing another embodiment in which a solder resist layer is also formed on the main surface of the electronic component, similar to FIG. 3; FIG.

FIG. 5 is a side view showing an example of mounting the chip-shaped electronic component shown in FIG. 4;

[Explanation of symbols]

1 Main surface of electronic components 2 Aspects of electronic components 3 External terminal electrode 4 Solder resist layer 5 Circuit board 6 Circuit wiring 7 Cream solder

Claims (1)

[Scope of utility model registration request] 1. A chip-shaped electronic component having at least two adjacent external terminal electrodes on the same surface, wherein an insulating solder resist layer that prevents solder from adhering to the external terminal electrodes is present between the external terminal electrodes. Characteristic chip-shaped electronic components.