JPH04113704A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH04113704A JPH04113704A JP23349890A JP23349890A JPH04113704A JP H04113704 A JPH04113704 A JP H04113704A JP 23349890 A JP23349890 A JP 23349890A JP 23349890 A JP23349890 A JP 23349890A JP H04113704 A JPH04113704 A JP H04113704A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- pattern
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 14
- 239000011889 copper foil Substances 0.000 abstract description 14
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、マイクロ波通信機器を量産する場合に用いる
ことができるプリント基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed circuit board that can be used in the mass production of microwave communication equipment.
従来の技術
一般に、両面に電極を有するプリント基板の電子部品実
装面の銅箔パターンから、マイクロ波帯の信号−を、裏
面の銅箔パターンに供給する場合には、同軸ケーブルや
セミリジットケーブルのような、内部導体と外部導体と
の間に誘電体を充填した同軸線路が用いられる。Conventional technology In general, when a microwave band signal is supplied from a copper foil pattern on the electronic component mounting side of a printed circuit board that has electrodes on both sides to a copper foil pattern on the back side, a coaxial cable or semi-rigid cable is used. Note that a coaxial line filled with a dielectric material between an inner conductor and an outer conductor is used.
発明が解決しようとする課題
しかしながら、上記のようなプリント基板の電子部品実
装面の銅箔パターンから、胴軸線路を用いて裏面の銅箔
パターンにマイクロ波帯の信号を供給する場合、鋼軸線
路用の貫通穴を設ける必要があるため、同箔パターン設
計上大きな制約を受け、高密度実装の面から非常に不利
であった。Problems to be Solved by the Invention However, when a microwave band signal is supplied from the copper foil pattern on the electronic component mounting surface of the printed circuit board as described above to the copper foil pattern on the back surface using the trunk shaft line, the steel shaft Since it was necessary to provide a through hole for the line, there were major restrictions on the foil pattern design, which was extremely disadvantageous in terms of high-density mounting.
又、量産時に、同軸線路の挿入及び半田付けに、時間が
かかり、作業性が悪いという問題点を有していた。Additionally, during mass production, it takes time to insert and solder the coaxial line, resulting in poor workability.
本発明は、このような問題点に基づき、その欠点を解消
し、簡単なプリント基板の加工により、同軸線路を用い
ることなくマイクロ波帯の信号を電子部品実装面から裏
面に供給することの可能な、高密度実装に適した優れた
プリント基板を提供するものである。The present invention is based on these problems, eliminates the drawbacks, and makes it possible to supply microwave band signals from the electronic component mounting surface to the back surface without using a coaxial line by simple processing of a printed circuit board. This provides an excellent printed circuit board suitable for high-density packaging.
課題を解決するための手段
本発明のプリント基板は、電子部品実装面から、マイク
ロ波帯の信号を、特性を劣化させることなく裏面に供給
するためのスルーホールを設けたことを特徴とするもの
である。Means for Solving the Problems The printed circuit board of the present invention is characterized in that a through hole is provided for supplying microwave band signals from the electronic component mounting surface to the back surface without deteriorating the characteristics. It is.
作用
本発明のプリント基板は、電子部品実装面の銅箔パター
ンから、裏面の銅箔パターンに、マイクロ波帯の信号を
、特性劣化させることなく供給できるスルーホールを設
けることにより、高密度実装化及び大幅な作業性の向上
が図れるものである。Function: The printed circuit board of the present invention allows for high-density mounting by providing through-holes that can supply microwave band signals from the copper foil pattern on the electronic component mounting surface to the copper foil pattern on the back surface without deteriorating the characteristics. Moreover, the workability can be greatly improved.
実施例
以下、本発明の一実施例について、図面を参照しながら
説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は、本発明の一実施例におけるプリント基板の裏
面の平面図、第２図は裏面を上方とした場合のプリント
基板の断面図を示す。FIG. 1 is a plan view of the back surface of a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a sectional view of the printed circuit board with the back surface facing upward.
第１図、第２同に示すように、電子部品実装面８の、あ
る一定の特性インピーダンスを有する銅箔パターンと、
その裏面に設けられた同し特性インピーダンスの銅箔パ
ターン１〜２とを、ミスマツチによる信号の反射及び電
力損失の極めて少ない寸法のスルーホール５〜７によっ
て接続することにより、マイクロ波帯の信号を、同軸ケ
ーブル等の同軸線路を使用することなく供給することが
できるため、より高密層な実装が可能となる。又、同軸
線路のプリント基板への挿入及び銅箔パターンとの半田
付けの必要がないため、大幅な作業性の向上を図ること
ができる。As shown in FIGS. 1 and 2, a copper foil pattern having a certain characteristic impedance on the electronic component mounting surface 8,
By connecting copper foil patterns 1 to 2 with the same characteristic impedance provided on the back side through through holes 5 to 7 with dimensions that minimize signal reflection and power loss due to mismatch, microwave band signals can be transmitted. Since it can be supplied without using a coaxial line such as a coaxial cable, it becomes possible to implement a higher density layer. Further, since there is no need to insert the coaxial line into the printed circuit board and solder it to the copper foil pattern, it is possible to significantly improve work efficiency.
発明の効果
以上のように、本発明によれば、電子部品実装面の銅箔
パターンとその裏面のパターンとを、マイクロ波帯の信
号を損失なく伝送可能なスルーホールを介して接続する
ことにより、高密度実装化及び作業性の大幅な向上を図
ることが可能な、実用上非常に有効な発明だということ
ができる。Effects of the Invention As described above, according to the present invention, the copper foil pattern on the electronic component mounting surface and the pattern on the back surface are connected through a through hole that can transmit microwave band signals without loss. It can be said that this invention is a very effective invention in practice, as it enables high-density packaging and a significant improvement in workability.
第１図は、本発明の一実施例におけるプリント基板の裏
面の平面図であり、第２回は裏面を上方とした場合のプ
リントｉ板の断面図を示す。
１〜３・・・・・・＃ｊＡ箔パターン、４・・・・・・
絶縁基板、５〜７・・・・・・スルーホール、８・・・
・・・電子部品実装面。FIG. 1 is a plan view of the back surface of a printed circuit board according to an embodiment of the present invention, and the second section shows a cross-sectional view of the printed I-board with the back surface facing upward. 1 to 3...#jA foil pattern, 4...
Insulating substrate, 5-7...Through hole, 8...
...Electronic component mounting surface.
Claims (1)
ら、マイクロ波帯の信号をスルーホールを介して裏面に
供給するパターンを有するプリント基板。A printed circuit board with a pattern that supplies microwave band signals from the electronic component mounting surface of the printed circuit board, which has electrodes on both sides, to the back surface via through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23349890A JPH04113704A (en) | 1990-09-03 | 1990-09-03 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23349890A JPH04113704A (en) | 1990-09-03 | 1990-09-03 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04113704A true JPH04113704A (en) | 1992-04-15 |
Family
ID=16955965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23349890A Pending JPH04113704A (en) | 1990-09-03 | 1990-09-03 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04113704A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179135A (en) * | 1986-01-31 | 1987-08-06 | Mitsubishi Electric Corp | Microwave device module |
| JPH0294693A (en) * | 1988-09-30 | 1990-04-05 | Nec Corp | Printed wiring board having coaxial through-hole |
-
1990
- 1990-09-03 JP JP23349890A patent/JPH04113704A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179135A (en) * | 1986-01-31 | 1987-08-06 | Mitsubishi Electric Corp | Microwave device module |
| JPH0294693A (en) * | 1988-09-30 | 1990-04-05 | Nec Corp | Printed wiring board having coaxial through-hole |
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