JPH0294693A - Printed wiring board having coaxial through-hole - Google Patents

Printed wiring board having coaxial through-hole

Info

Publication number
JPH0294693A
JPH0294693A JP24694188A JP24694188A JPH0294693A JP H0294693 A JPH0294693 A JP H0294693A JP 24694188 A JP24694188 A JP 24694188A JP 24694188 A JP24694188 A JP 24694188A JP H0294693 A JPH0294693 A JP H0294693A
Authority
JP
Japan
Prior art keywords
hole
coaxial
characteristic impedance
external conductor
tubular external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24694188A
Inventor
Isatake Sawano
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP24694188A priority Critical patent/JPH0294693A/en
Publication of JPH0294693A publication Critical patent/JPH0294693A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

PURPOSE: To match characteristic impedance of all the signal transmission pathes inside a printed wiring board readily and to improve high frequency characteristics by making a through-hole of coaxial structure.
CONSTITUTION: Signal wiring patterns 4, 14 are strip lines located apart a fixed distance from a ground layer 15. The mutual connection is made by a through-hole 3. The through-hole 3 is enclosed by a tubular external conductor 2 which is coaxial with a center axis 7 of the through-hole 3 through an insulating layer 8 of a fixed thickness. The tubular external conductor 2 is connected electrically with a ground layer 15 and ground electric potential is supplied. Therefore, a coaxial through-hole 1 is constituted by the through-hole 3 and the tubular external conductor 2. According to this constitution, it is possible to make characteristic impedance of the coaxial through-hole 1 the same as characteristic impedance Z0 of a strip line by selecting an appropriate thickness of the insulating layer 8, thus realizing a good high frequency characteristics.
COPYRIGHT: (C)1990,JPO&Japio
JP24694188A 1988-09-30 1988-09-30 Printed wiring board having coaxial through-hole Pending JPH0294693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24694188A JPH0294693A (en) 1988-09-30 1988-09-30 Printed wiring board having coaxial through-hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24694188A JPH0294693A (en) 1988-09-30 1988-09-30 Printed wiring board having coaxial through-hole

Publications (1)

Publication Number Publication Date
JPH0294693A true JPH0294693A (en) 1990-04-05

Family

ID=17156020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24694188A Pending JPH0294693A (en) 1988-09-30 1988-09-30 Printed wiring board having coaxial through-hole

Country Status (1)

Country Link
JP (1) JPH0294693A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113704A (en) * 1990-09-03 1992-04-15 Matsushita Electric Ind Co Ltd Printed circuit board
US5791911A (en) * 1996-10-25 1998-08-11 International Business Machines Corporation Coaxial interconnect devices and methods of making the same
US5949030A (en) * 1997-11-14 1999-09-07 International Business Machines Corporation Vias and method for making the same in organic board and chip carriers
US5955704A (en) * 1996-11-21 1999-09-21 Dell U.S.A., L.P. Optimal PWA high density routing to minimize EMI substrate coupling in a computer system
WO2000033624A1 (en) * 1998-12-02 2000-06-08 Teradyne, Inc. Printed circuit board and method for fabricating such board
WO2001048819A2 (en) * 1999-12-28 2001-07-05 Intel Corporation Interconnect structure and method of fabrication therefor
WO2002058234A2 (en) * 2001-01-16 2002-07-25 Formfactor, Inc. High frequency printed circuit board via
US6606014B2 (en) 1999-02-25 2003-08-12 Formfactor, Inc. Filter structures for integrated circuit interfaces
US6617526B2 (en) * 2001-04-23 2003-09-09 Lockheed Martin Corporation UHF ground interconnects
US6770822B2 (en) * 2002-02-22 2004-08-03 Bridgewave Communications, Inc. High frequency device packages and methods
US6787710B2 (en) 2001-05-29 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Wiring board and a method for manufacturing the wiring board
US6828513B2 (en) * 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
US7411474B2 (en) 2005-10-11 2008-08-12 Andrew Corporation Printed wiring board assembly with self-compensating ground via and current diverting cutout
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113704A (en) * 1990-09-03 1992-04-15 Matsushita Electric Ind Co Ltd Printed circuit board
US5791911A (en) * 1996-10-25 1998-08-11 International Business Machines Corporation Coaxial interconnect devices and methods of making the same
US5955704A (en) * 1996-11-21 1999-09-21 Dell U.S.A., L.P. Optimal PWA high density routing to minimize EMI substrate coupling in a computer system
US5949030A (en) * 1997-11-14 1999-09-07 International Business Machines Corporation Vias and method for making the same in organic board and chip carriers
WO2000033624A1 (en) * 1998-12-02 2000-06-08 Teradyne, Inc. Printed circuit board and method for fabricating such board
US6181219B1 (en) 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
US6606014B2 (en) 1999-02-25 2003-08-12 Formfactor, Inc. Filter structures for integrated circuit interfaces
WO2001048819A2 (en) * 1999-12-28 2001-07-05 Intel Corporation Interconnect structure and method of fabrication therefor
WO2001048819A3 (en) * 1999-12-28 2002-03-07 Intel Corp Interconnect structure and method of fabrication therefor
KR100945401B1 (en) * 2001-01-16 2010-03-04 폼팩터, 인크. High frequency printed circuit board via
WO2002058234A2 (en) * 2001-01-16 2002-07-25 Formfactor, Inc. High frequency printed circuit board via
WO2002058234A3 (en) * 2001-01-16 2002-10-24 Formfactor Inc High frequency printed circuit board via
US6617526B2 (en) * 2001-04-23 2003-09-09 Lockheed Martin Corporation UHF ground interconnects
US6787710B2 (en) 2001-05-29 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Wiring board and a method for manufacturing the wiring board
US6770822B2 (en) * 2002-02-22 2004-08-03 Bridgewave Communications, Inc. High frequency device packages and methods
US7520054B2 (en) 2002-02-22 2009-04-21 Bridgewave Communications, Inc. Process of manufacturing high frequency device packages
US6828513B2 (en) * 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
US7411474B2 (en) 2005-10-11 2008-08-12 Andrew Corporation Printed wiring board assembly with self-compensating ground via and current diverting cutout
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards

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