JPH0426082A - Connection terminal - Google Patents

Connection terminal

Info

Publication number
JPH0426082A
JPH0426082A JP2128637A JP12863790A JPH0426082A JP H0426082 A JPH0426082 A JP H0426082A JP 2128637 A JP2128637 A JP 2128637A JP 12863790 A JP12863790 A JP 12863790A JP H0426082 A JPH0426082 A JP H0426082A
Authority
JP
Japan
Prior art keywords
signal processing
terminal
shielding plate
printed wiring
terminal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2128637A
Other languages
Japanese (ja)
Inventor
Seijiro Ishizuka
誠次郎 石塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2128637A priority Critical patent/JPH0426082A/en
Publication of JPH0426082A publication Critical patent/JPH0426082A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To effectively connect the signal wires inside and outside a shielding plate by connecting the signal wires inside and outside the shielding plate respectively at both ends of a terminal wire which passes through a connection terminal after the connection terminal is installed to the shielding plate. CONSTITUTION:A terminal wire holding member 37 made up of a dielectric having a through hole 41 into which a terminal wire 40 made up of a conductor is inserted, and on the surface of one side of the terminal wire holding member 37, a conductive layer 36 laminated excluding the peripheral portion of the through hole 41 and an opening 35 formed corresponding to the conductive layer 31 are provided. Then, an installation member 25 junctioned to the terminal wire holding member 37 through the conductive layer 36 is installed at a shielding plate 14 to connect the signal wires 18 and 12 outside and inside the shielding plate 14 at both ends of the terminal wire. It is thereby possible to improve the efficiency of the connection work of the signal wires 18 and 20 outside and inside the shielding plate 14.

Description

【発明の詳細な説明】 A産業上の利用分野 本発明は接続端子に関し、例えばディジタル移動無線機
における送受信装置の接続端子に適用して好適なもので
ある。
DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a connection terminal, and is suitable for application to, for example, a connection terminal of a transmitting/receiving device in a digital mobile radio.

B発明の概要 本発明は接続端子において、遮蔽板に接続端子を取り付
けた後、接続端子を貫通する端子線の両端で遮蔽板の内
外の信号線をそれぞれ接続することにより、遮蔽板の内
外の信号線を効率良く接続し得る。
B. Summary of the Invention The present invention provides a connection terminal in which, after the connection terminal is attached to a shielding plate, signal lines inside and outside the shielding plate are connected at both ends of a terminal wire passing through the connecting terminal. Signal lines can be connected efficiently.

C従来の技術 従来例えば自動車に搭載された無線機(以下これを自動
車電話と呼ぶ)と中継所間の電波の送受信には音声信号
に基づいて搬送波を振幅変調するいわゆるAM (am
plitude modulatior+)変調方式が
用いられているが、自動車電話の普及に伴い広範囲にお
いて多敵の自動車電話間での通信を行う必要から、音声
信号をディジタル信号処理によって圧縮し、F M (
frequeticy modulation)変調方
式によって送受信することが考えられている。
C. Conventional technology Conventionally, for example, in the transmission and reception of radio waves between a radio set installed in a car (hereinafter referred to as a car phone) and a relay station, so-called AM (AM) modulation is used to amplitude-modulate a carrier wave based on an audio signal.
However, with the spread of car phones, it is necessary to communicate between car phones with many enemies over a wide range, so the voice signal is compressed by digital signal processing, and the FM (
Transmission and reception using a frequency modulation method is being considered.

かかるFM変調方式を用いた自動車電話においては、第
5図に示すように、送受信装置1のディジタル信号処理
部2から発生されるノイズが他の信号処理部に影響を及
ぼさないようにディジタル信号処理部2をシールドケー
ス3で遮蔽すると共に、シールドケース3に設けられた
貫通孔4に貫通コンデンサ5を挿入して半田付けするこ
とによりディジタル信号処理部2から発生された高周波
ノイズ成分は貫通コンデンサ5を介してシールドケース
3に流れることにより信号線LINEI〜L INEN
を介してアナログ信号処理回路に混入しないようになさ
れている。
In a car phone using such an FM modulation method, as shown in FIG. By shielding part 2 with shield case 3 and inserting feedthrough capacitor 5 into through hole 4 provided in shield case 3 and soldering it, high frequency noise components generated from digital signal processing part 2 are removed from feedthrough capacitor 5. The signal lines LINEI to LINEN are
This is to prevent it from entering the analog signal processing circuit via the

D発明が解決しようとする課題 ところでかかるFM変調方式を用いた自動車電話におい
てはディジタル信号処理回路2及びアナログ信号処理回
路間で多数の(例えば20〜30本の)信号線L I 
NE !−L I NENを接続することが必要となる
が、かかる信号線ごとに貫通コンデンサ5をシールドケ
ース3の貫通孔4に半田付けすることは、取付作業が煩
雑になり、多数の手間を要するため作業効率が良くない
という問題がある。
Problems to be Solved by the Invention In a car phone using such an FM modulation method, a large number (for example, 20 to 30) of signal lines LI are connected between the digital signal processing circuit 2 and the analog signal processing circuit.
NE! -L I NEN is required to be connected, but soldering the feedthrough capacitor 5 to the through hole 4 of the shield case 3 for each signal line makes the installation work complicated and requires a lot of effort. There is a problem that work efficiency is not good.

本発明は以上の点を考慮してなされたもので、簡易な取
付方法により各信号処理回路間を接続することができ、
高周波ノイズ成分を遮蔽することができる接続端子を提
案しようとするものである。
The present invention has been made in consideration of the above points, and allows connection between each signal processing circuit with a simple installation method.
This paper attempts to propose a connection terminal that can shield high-frequency noise components.

8課題を解決するための手段 導線でなる端子線40が挿入される貫通孔41を有する
誘電体でなる端子線保持部材37と、端子線保持部材3
7の一方の面上に、貫通孔4工の周縁部を除いて積層さ
れた導電層36と、導電層36に応じて形成される開口
35を有し、導電層36を介して端子線保持部材37と
接合される取付部材25とを具え、取付部材25を遮蔽
板14に取り付け、遮蔽板14内外の信号線18及び2
0を端子線40の両端で接続するようにする。
8 Means for Solving Problems A terminal wire holding member 37 made of a dielectric material having a through hole 41 into which a terminal wire 40 made of a conducting wire is inserted, and a terminal wire holding member 3
7 has a conductive layer 36 laminated except for the peripheral edge of the four through holes, and an opening 35 formed in accordance with the conductive layer 36, and a terminal wire is held through the conductive layer 36. The mounting member 25 is attached to the shielding plate 14, and the signal lines 18 and 2 are connected to the inside and outside of the shielding plate 14.
0 at both ends of the terminal wire 40.

F作用 端子線40を保持する端子線保持部材37に積層された
導電層36を介して接合された取付部材25を遮蔽板1
4に取り付けた後、端子線40を信号線18及び20に
接続することにより、遮蔽板14内外の信号線18及び
20の接続作業効率を一段と向上することができる。
The mounting member 25 is connected to the terminal wire holding member 37 holding the F action terminal wire 40 via the conductive layer 36 laminated thereon, and the shielding plate 1
By connecting the terminal wire 40 to the signal wires 18 and 20 after the terminal wire 40 is attached to the shield plate 14, the efficiency of connecting the signal wires 18 and 20 inside and outside the shielding plate 14 can be further improved.

G実施例 以下図面について、本発明の一実施例を詳述する。G example An embodiment of the present invention will be described in detail below with reference to the drawings.

第1図において、10は全体として自動車電話における
送受信装置を示し、ディジタル信号処理部11及びアナ
ログ信号処理部12を導体でなるシールドケース本体1
3及びシールド板14によって分離することにより遮蔽
し、ディジタル信号処理部11から発生された高周波ノ
イズ成分がアナログ信号処理部12に影響を与えないよ
うになされている。
In FIG. 1, reference numeral 10 indicates a transmitting/receiving device in a car phone as a whole, and a digital signal processing section 11 and an analog signal processing section 12 are connected to a shield case main body 1 made of a conductor.
3 and a shield plate 14 to prevent high frequency noise components generated from the digital signal processing section 11 from affecting the analog signal processing section 12.

ここでディジタル信号処理基板15から送出された処理
信号はコネクタ16、プラグ17及びリード線1Bを介
してシールド板14の所定位置に電気的かつ機械的に接
合された接続端子19のディジタル信号処理部11側か
ら入力された後、接続端子19のアナログ信号処理部1
2側からリード線20、プラグ21及びコネクタ22を
介してアナログ信号処理部12のアナログ信号処理基板
23に供給されるようになされている。
Here, the processed signal sent from the digital signal processing board 15 is sent to the digital signal processing section of the connection terminal 19 which is electrically and mechanically connected to a predetermined position of the shield plate 14 via the connector 16, plug 17 and lead wire 1B. After input from the 11 side, the analog signal processing unit 1 of the connection terminal 19
The signal is supplied from the second side to the analog signal processing board 23 of the analog signal processing section 12 via a lead wire 20, a plug 21, and a connector 22.

またディジタル信号処理基板15又はアナログ信号処理
基板23で処理された信号はシールドケース本体13に
設けられたコネクタ24を介して外部と受渡しし得るよ
うになされている。
Further, the signals processed by the digital signal processing board 15 or the analog signal processing board 23 can be delivered to the outside via a connector 24 provided on the shield case body 13.

ディジタル信号処理部11及びアナログ信号処理部12
を接続する接続端子19は、第2図に示すように、導電
性のサブシールド板25を筒状でなるスペーサ26A、
26B及び27A、27Bを介して上下方向からアナロ
グ側プリント配線基板28及びディジタル側プリント配
線基板29で挟み込むようになされている。
Digital signal processing section 11 and analog signal processing section 12
As shown in FIG.
It is sandwiched between an analog printed wiring board 28 and a digital printed wiring board 29 from above and below via 26B, 27A, and 27B.

ここでサブシールド板25、アナログ側プリント配線基
板28及びディジタル側プリント配線基板29は、第3
図に示すように、接続ビン30Aを同一直線上に配設さ
れたディジタル側プリント配線基板28の貫通孔29A
、スペーサ27A。
Here, the sub-shield plate 25, the analog side printed wiring board 28, and the digital side printed wiring board 29 are connected to the third
As shown in the figure, the through hole 29A of the digital side printed wiring board 28 is arranged on the same straight line as the connection bin 30A.
, spacer 27A.

サブシールド板25の貫通孔25A、スペーサ26A及
びアナログ側プリント配線基板28の貫通孔28Aを介
してナツト31Aでねし止めされると共に、同様に接続
ピン30Bを同一直線上に配設されたディジタル側プリ
ント配線基板290貫通孔29B、スペーサ27B、サ
ブシールド板25の貫通孔25B1スペーサ26B及び
アナログ側プリント配線基板28の貫通孔28Bを介し
てナツト31Bでねし止めすることにより一体に固着さ
れるようになされている。
The digital connector is screwed with a nut 31A through the through hole 25A of the sub-shield plate 25, the spacer 26A, and the through hole 28A of the analog side printed wiring board 28, and the connecting pin 30B is similarly arranged on the same straight line. They are fixed together by screwing them with nuts 31B through the through holes 29B of the side printed wiring board 290, the spacers 27B, the through holes 25B1 of the sub-shield plate 25, the spacers 26B, and the through holes 28B of the analog side printed wiring board 28. It is done like this.

またサブシールド板25はシールド板14と貫通孔25
C114C及び25D、14Dを介してねじ32A、3
2B及びナツト33A、33Bで固着されるようになさ
れている。
Further, the sub-shield plate 25 is connected to the shield plate 14 and the through hole 25.
Screws 32A, 3 through C114C and 25D, 14D
2B and nuts 33A and 33B.

ここでシールド板14にはディジタル側プリント配線基
板29を自在に挿入し得る大きさを有する長方形形状の
開口34が設けられており、サブシールド板25をシー
ルド板14に固着する際にはディジタル側プリント配線
基板29を開口34を挿通し、サブシールド板25をね
じ32A、32B及びナツト33A、33Bにより固定
するようになされている。
Here, the shield plate 14 is provided with a rectangular opening 34 having a size that allows the digital side printed wiring board 29 to be inserted freely, and when the sub-shield plate 25 is fixed to the shield plate 14, the digital side printed wiring board 29 is inserted. The printed wiring board 29 is inserted through the opening 34, and the sub-shield plate 25 is fixed with screws 32A, 32B and nuts 33A, 33B.

また第4図に示すように、サブシールド板25の中央部
には長方形形状の開口35が形成されており、この開口
35をアナログ側プリント配線基板28側から覆うよう
に、銀ペーストでなる導電部材36が積層された誘電体
でなる誘電板37が半田38により固着されている。
Further, as shown in FIG. 4, a rectangular opening 35 is formed in the center of the sub-shield plate 25, and a conductive conductor made of silver paste is formed to cover this opening 35 from the analog side printed wiring board 28 side. A dielectric plate 37 made of a dielectric material on which members 36 are laminated is fixed with solder 38 .

ここで導電部材36は、0〔Ω〕でなるショート抵抗3
9の導線40が貫通するように誘電板37に設けられた
透孔41の周縁部を除いて全面に塗布されており、サブ
シールド板25との接合部において電気的及び機械的に
固着されている。
Here, the conductive member 36 has a short resistance 3 of 0 [Ω].
The dielectric plate 37 is coated over the entire surface except for the peripheral edge of a through hole 41 provided in the dielectric plate 37 so that the conductive wire 40 of No. 9 passes through, and is electrically and mechanically fixed at the joint with the sub-shield plate 25. There is.

また誘電板37にはショート抵抗38の各導線40に対
応して透孔41が設けられており、この透孔41を貫通
した導線40は誘電板37上に形成された銀ペーストで
なるランド42と半田43により固着されるようになさ
れている。これにより導線40と導電性部材36は誘電
板37を介してコンデンサを形成し、ディジタル側プリ
ント配線基板29から送出された信号に重畳している高
周波ノイズ成分を誘電板37、サブシールド板25、シ
ールド板14及びシールドケース本体13を介して流す
ことにより、アナログ信号処理部12への高周波ノイズ
成分の混入を防ぎ得るようになされている。
Further, the dielectric plate 37 is provided with a through hole 41 corresponding to each conducting wire 40 of the short resistor 38, and the conducting wire 40 passing through the through hole 41 is connected to a land 42 made of silver paste formed on the dielectric plate 37. and are fixed by solder 43. As a result, the conductive wire 40 and the conductive member 36 form a capacitor via the dielectric plate 37, and the high frequency noise component superimposed on the signal sent from the digital side printed wiring board 29 is transferred to the dielectric plate 37, the sub-shield plate 25, By flowing through the shield plate 14 and the shield case body 13, it is possible to prevent high frequency noise components from entering the analog signal processing section 12.

またショート抵抗39の導線40はアナログ側プリント
配線基板28に形成された透孔44及び配線パターン4
5を介して半田46で電気的に接合されると共に、ディ
ジタル側プリント配線基板29に形成された透孔47及
び配線パターン48を介して半田49で電気的に接続さ
れている。
Further, the conductive wire 40 of the short resistor 39 is connected to the through hole 44 formed in the analog side printed wiring board 28 and the wiring pattern 4.
5 and are electrically connected with solder 46 through holes 47 and wiring patterns 48 formed in the digital side printed wiring board 29 with solder 49 .

配線パターン45及び49はそれぞれアナログ側プリン
ト配線基板28及びディジタル側プリント配線基板29
に配設されたコネクタ50及び51に接続されており、
コネクタ50に供給された信号はコネクタ50と着脱自
在のプラグ52、リード線20を介してアナログ信号処
理基板23に送出されると共に、コネクタ51に供給さ
れた信号はコネクタ51と着脱自在のプラグ53及びリ
ード線18を介してディジタル信号処理基板15に送出
されるようになされている。
The wiring patterns 45 and 49 are connected to the analog side printed wiring board 28 and the digital side printed wiring board 29, respectively.
It is connected to connectors 50 and 51 arranged in
The signal supplied to the connector 50 is sent to the analog signal processing board 23 via the connector 50, the detachable plug 52, and the lead wire 20, and the signal supplied to the connector 51 is sent to the analog signal processing board 23 via the connector 50, the detachable plug 52, and the lead wire 20. and is sent to the digital signal processing board 15 via the lead wire 18.

以上の構成において、サブシールド板25、アナログ側
プリント配線基板28及びディジタル側プリント配線基
板29の3層でなる接続端子19をアナログ信号処理部
12側からシールド板14に設けられた開口34に嵌め
込み、サブシールド板25をねじ32A、32B及びナ
ツト33A、33Bを用いてシールド板14にねし止め
するだけで取り付けることができる。
In the above configuration, the connection terminal 19 consisting of the three layers of the sub-shield plate 25, the analog-side printed wiring board 28, and the digital-side printed wiring board 29 is fitted into the opening 34 provided in the shield plate 14 from the analog signal processing unit 12 side. The sub-shield plate 25 can be attached to the shield plate 14 by simply screwing it to the shield plate 14 using screws 32A, 32B and nuts 33A, 33B.

ここで導線40及び銀ペーストでなる導電性部材36は
誘電体37を介してコンデンサを構成していることによ
りディジタル信号処理基板15からコネクタ16及びプ
ラグ17を介して接続端子19に供給される処理信号に
含まれる高周波ノイズ成分は導線40から誘電板37、
導電部材36及びサブシールド板25を介して流れ、ア
ナログ信号処理部12に影響を及ぼさないようにできる
Here, the conductive wire 40 and the conductive member 36 made of silver paste constitute a capacitor via the dielectric 37, so that the processing is supplied from the digital signal processing board 15 to the connection terminal 19 via the connector 16 and the plug 17. High frequency noise components included in the signal are transmitted from the conductor 40 to the dielectric plate 37,
It flows through the conductive member 36 and the sub-shield plate 25 and can be prevented from affecting the analog signal processing section 12.

以上の構成によれば、アナログ信号処理基板23及びデ
ィジタル信号処理基板15から供給される処理信号をプ
ラグ52及び53を介して接続し得るコネクタ50及び
51を有する接続端:f19をシー・ルド板14に取り
付けるという簡易な作業によりアナログ信号処理部12
及びディジタル信号処理部11における信号線を互いに
結線することができ、作業効率を一段と向上することが
できる。
According to the above configuration, the connection end f19 having the connectors 50 and 51 to which the processed signals supplied from the analog signal processing board 23 and the digital signal processing board 15 can be connected via the plugs 52 and 53 is connected to the shield plate. Analog signal processing unit 12 can be easily connected to
The signal lines in the digital signal processing section 11 can be connected to each other, and work efficiency can be further improved.

なお上述の実施例においては、接続端子19をアナログ
信号処理部12側からシールド板14に取り付ける場合
について述べたが、本発明はこれに代え、ディジタル信
号処理部11側からシールド板14に取り付けるように
しても良い。
In the above-mentioned embodiment, a case has been described in which the connection terminal 19 is attached to the shield plate 14 from the analog signal processing section 12 side, but in the present invention, instead of this, the connection terminal 19 is attached to the shield plate 14 from the digital signal processing section 11 side. You can also do it.

また上述の実施例においては、誘電板37がアナログ側
プリント配線基板28と対向するように、サブシールド
板25をシールド板14に取り付ける場合について述べ
たが、本発明はこれに代え、誘電板37がディジタル側
プリント配線基板29と対向するように取り付けるよう
にしても良い。
Furthermore, in the above-described embodiment, a case has been described in which the sub-shield plate 25 is attached to the shield plate 14 so that the dielectric plate 37 faces the analog-side printed wiring board 28. However, in the present invention, instead of this, the dielectric plate 37 It may be mounted so that it faces the digital side printed wiring board 29.

さらに上述の実施例においては、誘電板37′、アナロ
グ側及びディジクル側プリント配線基板28及び29に
透孔41.44及び47をそれぞれ2列隣り合せに配設
した場合について述べたが、本発明はこれに限らず、例
えば万い違いに配設しても良い。
Further, in the above-described embodiment, a case was described in which two rows of through holes 41, 44 and 47 were arranged adjacently in the dielectric plate 37' and the analog side and digital side printed wiring boards 28 and 29, respectively, but the present invention are not limited to this, and may be arranged in any number of different ways, for example.

さらに上述の実施例においては、導電部材3G及びラン
ド42として銀ベー・ストを用いる場合について述べた
が、本発明はこれに限らず、他の導電性部材を用いて形
成するようにしても良い。
Furthermore, in the above-described embodiment, a case was described in which silver base metal was used as the conductive member 3G and the land 42, but the present invention is not limited to this, and the conductive member 3G and the land 42 may be formed using other conductive members. .

さらに上述の実施例においては、サブシールド板25に
長方形形状の開C135を設ける場合に・ついて述べた
が、本発明はこれに限らず、種々の形状の場合に通用し
得る。
Further, in the above-described embodiment, the case where the sub-shield plate 25 is provided with a rectangular opening C135 has been described, but the present invention is not limited to this, and can be applied to various shapes.

さらに上述の実施例においては、接続端子19としてア
ナログ側プリント配線基板28及びディジタル側プリン
ト配線基板29をサブシールド板25を挟んで配設した
ものを用いた場合について述べたが、本発明はこれに限
らず、導電部材36を塗布してなる誘電板37を固着し
てなるサブシールド板25を貫通する導線40の両端で
アナログ信号処理部12のリード線20及びディジタル
信号処理部11のリード線18を接続するようにしても
上述と同様の効果を得ることができる。
Furthermore, in the above-described embodiment, a case was described in which the analog side printed wiring board 28 and the digital side printed wiring board 29 were arranged with the sub-shield plate 25 in between as the connection terminals 19. However, the lead wire 20 of the analog signal processing section 12 and the lead wire of the digital signal processing section 11 are connected at both ends of the conductive wire 40 passing through the sub-shield plate 25 formed by adhering a dielectric plate 37 coated with a conductive member 36. Even if 18 are connected, the same effect as described above can be obtained.

さらに上述の実施例においては、ディジタル信号処理部
11及びアナログ信号処理部12間で処理信号を送受信
する場合について述べたが、本発明はこれに限らず、デ
ィジタル信号処理部間において処理信号の受渡しをする
場合に用いても良い。
Further, in the above-described embodiment, a case was described in which a processed signal is transmitted and received between the digital signal processing section 11 and the analog signal processing section 12, but the present invention is not limited to this, and the present invention is not limited to this, and the processing signal is exchanged between the digital signal processing section 11 and the analog signal processing section 12. It may be used when doing.

さらに上述の実施例においては、2つの信号処理回路間
で処理信号を受渡しする場合について述べたが、本発明
はこれに限らず、複数の信号処理回路間で処理信号を受
渡しする場合にも適用し得る。
Further, in the above-described embodiment, a case was described in which a processed signal was transferred between two signal processing circuits, but the present invention is not limited to this, but can also be applied to a case in which processed signals are transferred between a plurality of signal processing circuits. It is possible.

さらに上述の実施例においては、接続端子19を自動車
電話に用いられる送受信装置10に用いる場合について
述べたが、本発明はこれに限らず5、広く信号処理回路
間を接続する場合に適用(2、得る。
Further, in the above-described embodiment, the case where the connection terminal 19 is used in the transmitting/receiving device 10 used in a car telephone has been described, but the present invention is not limited to this, and is applicable to a wide range of cases in which signal processing circuits are connected (2). ,obtain.

H発明の効果 上述のように本発明によれば、接続端子を遮蔽板の所定
位置に取り付け、端子線の両端で信号線をそれぞれ接続
するようにしたことにより、遮蔽板内外の信号線を一段
と効率良く接続することができ、かくして高周波ノイズ
成分を遮蔽することができるや
H Effects of the Invention As described above, according to the present invention, the connection terminals are attached to predetermined positions on the shielding plate, and the signal lines are connected at both ends of the terminal wires, thereby further increasing the number of signal lines inside and outside the shielding plate. It is possible to connect efficiently and thus shield high frequency noise components.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による接続端子の一実施例を示す破断面
図、第2図は本発明による接続端子の詳細構成を示す分
解斜視図、第3図は第2図に示す接続端子の縦断面図、
第4図はサブシールド板の説明ぼ供する斜視図、第5図
は従来の接続1端子の説明に供する路線的斜視図である
。 19・・・・・・接続端子、25・・・・・・ザブシー
・ルド板、28・・・・・・アナログ側プリント配線基
板、29・・・・・・ディジタル側プリン)・配線基板
、34.35・・・・・・開口、36・・・・・・導電
部材、37・・・・・・導電板、39・・・・・・ショ
ート抵抗、40・・・・・・導線、42・・・・・・ラ
ンド、45.48・・・・・・配線バタ・−・ン。 to送!!信条装 12アナロア信5処理部 tフlり、イダ弓Oイヒ二俸オ芦Uζ 革 題 ナット 1、事件の表示 平成2年特許願第128637号 2、発明の名称 接続端子 3、補正をする者 事件との関係  特許出願人 住所 東京部品用図化品用6丁目7番35号名称(21
B)ソニー株式会社 代表者  大 賀 典 雄 4、代 理 人 〒150(電話03−4.7O−65
91)居所 東京都渋谷区神宮前三丁目22番10号明
細書の 「発明の詳細な説明」 の欄 6、補正の内容 (1)明細書、第2頁12行、「振幅変調」を、「周波
数変調」と訂正する。 (2)  同、第2頁13行、r A M (ampl
itude modulation) Jを、’ F 
M (Frequency l’1odulatjon
) Jと訂正する。 (3)同、第2頁12行’ F M (frequen
cy modulation) Jを、[F S K 
(Frequency 5hift Keying)や
P S K (Phase 5hift Keying
)のディジタル」と訂正する。 (4)同、第3頁1行及び14行、I’ F M変調方
式」を、「ディジタル変調方式」と訂正する。
FIG. 1 is a broken cross-sectional view showing one embodiment of the connecting terminal according to the present invention, FIG. 2 is an exploded perspective view showing the detailed configuration of the connecting terminal according to the present invention, and FIG. 3 is a longitudinal cross-section of the connecting terminal shown in FIG. 2. side view,
FIG. 4 is a perspective view for explaining the sub-shield plate, and FIG. 5 is a perspective view for explaining one conventional connection terminal. 19...Connection terminal, 25...Zubshield board, 28...Analog side printed wiring board, 29...Digital side printed wiring board, 34.35... Opening, 36... Conductive member, 37... Conductive plate, 39... Short resistor, 40... Conductive wire, 42...Land, 45.48...Wiring butter...N. To send! ! Creed equipment 12 analog lower signal 5 processing unit t flip, Ida bow O Ihi 2 salary O Ashi Uζ Leather title nut 1, Display of incident 1990 patent application No. 128637 2, Name of invention connection terminal 3, Make amendment Relationship with the case Patent applicant address No. 6-7-35 Tokyo Parts Illustrated Product Name (21
B) Sony Corporation Representative Norio Ohga 4, Agent 150 (Telephone 03-4.7O-65)
91) Place of residence No. 3-22-10 Jingumae, Shibuya-ku, Tokyo Contents of amendment in column 6 of “Detailed description of the invention” of the specification (1) Specification, page 2, line 12, “amplitude modulation” was changed to “ "Frequency modulation" is corrected. (2) Same, page 2, line 13, r A M (ampl
itude modulation) J,' F
M (Frequency l'1odulatjon
) Correct it as J. (3) Same, page 2, line 12'
cy modulation) J, [F S K
(Frequency 5hift Keying) and P S K (Phase 5hift Keying)
) is corrected to ``digital''. (4) Same, page 3, lines 1 and 14, "I'FM modulation method" is corrected to "digital modulation method."

Claims (1)

【特許請求の範囲】[Claims] 導線でなる端子線が挿入される貫通孔を有する誘電体で
なる端子線保持部材と、上記端子線保持部材の一方の面
上に、上記貫通孔の周縁部を除いて積層された導電層と
、上記導電層に応じて形成される開口を有し、上記導電
層を介して上記端子線保持部材と接合される取付部材と
を具え、上記取付部材を遮蔽板に取り付け、上記遮蔽板
内外の信号線を上記端子線の両端で接続することを特徴
とする接続端子。
a terminal wire holding member made of a dielectric material having a through hole into which a terminal wire made of a conductive wire is inserted; and a conductive layer laminated on one surface of the terminal wire holding member except for a peripheral portion of the through hole. , a mounting member having an opening formed in accordance with the conductive layer and joined to the terminal wire holding member through the conductive layer, the mounting member being attached to the shielding plate, and the mounting member being attached to the shielding plate, A connection terminal characterized in that a signal line is connected at both ends of the terminal line.
JP2128637A 1990-05-18 1990-05-18 Connection terminal Pending JPH0426082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2128637A JPH0426082A (en) 1990-05-18 1990-05-18 Connection terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2128637A JPH0426082A (en) 1990-05-18 1990-05-18 Connection terminal

Publications (1)

Publication Number Publication Date
JPH0426082A true JPH0426082A (en) 1992-01-29

Family

ID=14989744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2128637A Pending JPH0426082A (en) 1990-05-18 1990-05-18 Connection terminal

Country Status (1)

Country Link
JP (1) JPH0426082A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002290072A (en) * 2001-03-28 2002-10-04 Hitachi Kokusai Electric Inc Mounting structure of feed-through nozzle filter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002290072A (en) * 2001-03-28 2002-10-04 Hitachi Kokusai Electric Inc Mounting structure of feed-through nozzle filter

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