JPH04110459A - Electrical insulating plate material - Google Patents

Electrical insulating plate material

Info

Publication number
JPH04110459A
JPH04110459A JP22837490A JP22837490A JPH04110459A JP H04110459 A JPH04110459 A JP H04110459A JP 22837490 A JP22837490 A JP 22837490A JP 22837490 A JP22837490 A JP 22837490A JP H04110459 A JPH04110459 A JP H04110459A
Authority
JP
Japan
Prior art keywords
substrate
stainless steel
inclusions
film
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22837490A
Other languages
Japanese (ja)
Inventor
Yusuke Oikawa
雄介 及川
Tsunetoshi Takahashi
高橋 常利
Isao Ito
功 伊藤
Misao Hashimoto
橋本 操
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP22837490A priority Critical patent/JPH04110459A/en
Publication of JPH04110459A publication Critical patent/JPH04110459A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To produce the plate material without any film defect such as a pinhole and excellent in insulation performance by reducing the inclusion on the surface of a substrate at the time of dry-coating the stainless steel substrate with a ceramic insulating thin film. CONSTITUTION:The intrusion of oxygen, etc., into steel is controlled by vacuum refining, and the number of inclusions is reduced in the stainless steel sheet. The stainless steel sheet thus obtained is bright-annealed and then specularly polished to obtain a substrate. The substrate is dry-coated with a ceramic insulating film by sputtering, ion plating, etc., to obtain a stainless steel substrate insulating material excellent in insulation performance. Concretely, a leakage current is reduced to <=10<-10>A when the number of the inclusions >=1mum long on the stainless steel substrate surface is controlled to <=100 per square millimeter.

Description

【発明の詳細な説明】 産業−にの利用分野 本発明は金属基板上にドライコーティング法によりセラ
ミック薄膜を形成した電気絶縁性板状材料に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electrically insulating plate-like material in which a ceramic thin film is formed on a metal substrate by a dry coating method.

従来の技術 電気絶縁性板状材料はIC基板、太陽電池基板等に使用
され、電気、情報産業には欠かせない素材となっている
。また、コンデンサや静電アクチュエイター等の絶縁性
以外の特性を必要とする素子においても、その固有特性
に加え電気絶縁性は必要不可欠な特性の一つとなってい
る。
BACKGROUND OF THE INVENTION Electrically insulating plate-like materials are used for IC substrates, solar cell substrates, etc., and are indispensable materials for the electrical and information industries. Furthermore, in elements such as capacitors and electrostatic actuators that require properties other than insulation, electrical insulation is one of the essential properties in addition to their inherent properties.

この絶縁性材料には、従来セラミック材料や有機材料が
用いられているが、セラミック旧材は強度或いは加工性
に欠け、有機材料は耐熱性に劣る等の欠点を持つ。しか
しながら、代替材料は見出されていないのが現状である
Conventionally, ceramic materials and organic materials have been used as this insulating material, but old ceramic materials lack strength or workability, and organic materials have drawbacks such as poor heat resistance. However, at present, no alternative material has been found.

絶縁性材料として考えられ得るものにドライコーティン
グ法を用いセラミック薄膜を表面にコーティングするこ
とによって電気絶縁性を付与した金属材料がある。この
金属材料はある程度の加工性を有し耐熱性や強度に優れ
また安価である。しかし、この金属材料としては、耐薬
品性、強度等の面よりステンレス鋼板を基板として用い
るのが最適である。
An example of an insulating material is a metal material whose surface is coated with a ceramic thin film using a dry coating method to provide electrical insulation. This metal material has a certain degree of workability, excellent heat resistance and strength, and is inexpensive. However, from the standpoint of chemical resistance, strength, etc., it is best to use a stainless steel plate as the metal material for the substrate.

尚、ドライコーティング法とは高真空中において薄膜を
作成する方法の総称であり、LSI(7)製造時に、シ
リコンウェハの」−に絶縁皮膜を作成する手法等として
広く利用されている。
The dry coating method is a general term for a method of forming a thin film in a high vacuum, and is widely used as a method for forming an insulating film on a silicon wafer when manufacturing an LSI (7).

発明が解決しようとする課題 ステンレス鋼板を基板として用いる場合、その表面は圧
延疵、介在物、凹凸等により−・様、平滑なものとはな
っておらず、それ故その上に形成された膜も一様ではな
く、ピンホール等の物理的な膜欠陥或いは物理的には欠
陥となっていないが電気的に絶縁性の弱い部分が多数存
在する。
Problems to be Solved by the Invention When a stainless steel plate is used as a substrate, its surface is not smooth due to rolling defects, inclusions, unevenness, etc., and therefore the film formed thereon is not smooth. The film is not uniform, and there are many physical film defects such as pinholes, and many parts that are not physically defective but have weak electrical insulation.

このためステア1/ス鋼板の表面にセラミック薄膜を形
成している材料は、表面に絶縁性膜が存在しているにも
関わらず一般に絶縁性は良好ではない。従って、ステン
レス基板上基板とする電気絶縁性板状材料の絶縁性を向
」ニさせるには膜欠陥や電気的弱点部をできる限り減少
させる必要がある。
For this reason, the material forming the ceramic thin film on the surface of the steer 1/S steel plate generally does not have good insulation properties, despite the presence of an insulating film on the surface. Therefore, in order to improve the insulation properties of the electrically insulating plate material used as the substrate on the stainless steel substrate, it is necessary to reduce film defects and electrical weak points as much as possible.

本発明はこのような膜欠陥や電気的弱点部の非常に少な
い、ステア1/ス鋼板を基板とする電気絶縁性板状材料
を提供することをlI的とする。
The object of the present invention is to provide an electrically insulating plate-like material using a steered steel plate as a substrate, which has very few film defects and electrical weak points.

課題を解決するための手段・作用 従来、絶縁膜の膜欠陥を減少させる方法どして、成膜時
に蒸着装置や蒸着条件の改善が試みられ多くの文献があ
る。しか17ながらその基板を改善することで膜欠陥を
減少させる知見は皆無である。本発明者等は基板につい
て検剃を重ねた結果、基板表面欠陥を減少させることが
有効であるという知見を得た。即ち、セルフヒーリング
法(Werner Kern、 5olid 5tat
e Technology Mar、 p35〜42 
(1974))等によって把握できる絶縁欠陥の位置が
、基板欠陥の上である事が多く、基板表面欠陥が膜欠陥
の原因のがなり重要な位置を占めている。
Means and Effects for Solving the Problems Conventionally, as a method for reducing film defects in an insulating film, there are many documents in which attempts have been made to improve the evaporation equipment and evaporation conditions during film formation. However, there is no knowledge that film defects can be reduced by improving the substrate. As a result of repeated inspections of substrates, the present inventors have found that it is effective to reduce substrate surface defects. That is, the self-healing method (Werner Kern,
e Technology Mar, p35-42
(1974)), etc., are often located above substrate defects, and substrate surface defects play an important role in causing film defects.

ノ、(板表面欠陥を低減する方法としては鏡面研磨法が
考えられ、実際研磨材は研磨前(ステンl/ス光輝焼鈍
材)に比し絶縁性がかなり向1−する。しかしながら、
鏡面研磨材は生産コストが非常に高い−[二、ステンレ
ス鋼中に存在する介在物がIfj材に比し研磨されにく
く突起どして残り、これが絶縁欠陥の起点となるためこ
れを用いても電気絶縁性は市場の要求を満たす1/ベル
には至らない。そこでこの研磨時突起となる介在物を低
減することにより、電気絶縁性の優れた材料を得る事が
できる。
(Mirror polishing method is considered as a method to reduce plate surface defects, and in fact, the insulation properties of the abrasive material are considerably better than those before polishing (stainless steel/bright annealed material).However,
The production cost of mirror polishing materials is very high - [2.Inclusions present in stainless steel are difficult to polish compared to Ifj materials and remain as protrusions, which become the starting point of insulation defects, so even if this material is used, The electrical insulation property does not reach the level of 1/bel that meets market requirements. Therefore, by reducing inclusions that become protrusions during polishing, a material with excellent electrical insulation properties can be obtained.

本発明の要旨とするところは下記の通りである。The gist of the present invention is as follows.

(1)ステンレス基板上にドライコーティング法により
セラミック薄膜を形成した電気絶縁性板状材料において
、基板が介在物個数を冷延板の表面において長さ1gm
以上のものが1″f方ミリあたり100個以内とした材
料からなることを特徴とする電気絶縁性板状材料。
(1) In an electrically insulating plate-like material in which a ceramic thin film is formed on a stainless steel substrate by a dry coating method, the number of inclusions on the substrate is 1 g on the surface of the cold-rolled plate.
An electrically insulating plate-like material characterized in that the above-mentioned materials are made of a material having not more than 100 pieces per 1″f-side millimeter.

(2)ドライコーティング法が、スパッタリング、イオ
ンプレーティング、プラズマCVDである請求項1に記
載の電気絶縁性板状材料。
(2) The electrically insulating plate material according to claim 1, wherein the dry coating method is sputtering, ion plating, or plasma CVD.

以下、本発明の詳細な説明する。The present invention will be explained in detail below.

介在物を低減する手段としては真空溶融による精錬を行
い鋼中の酸素等の混入を抑えることが考えられ、実際真
空溶融法の一種である電子ビーム精錬法を用いると鋼中
の酸素は真空中に放出され、介在物個数が通常の1割以
下と非常に少ない極1+’4浄鋼を製造できる。
One way to reduce inclusions is to suppress the incorporation of oxygen, etc. into the steel by refining by vacuum melting.In fact, when electron beam refining, which is a type of vacuum melting method, is used, the oxygen in the steel is removed in a vacuum. It is possible to produce ultra-1+'4-clean steel with a very small number of inclusions, less than 10% of normal inclusions.

これを用い、介在物の個数を低減した材料を光輝焼鈍の
後鏡面研磨する事によって得た基板に絶縁膜を形成する
事によって絶縁性の良好なステンレス基板絶縁材料を得
ることができる。具体的には実施例1にあるように1μ
m以−にの長さの介在物個数が1平方ミリあたり 10
0個以内になると漏洩電流は1O−10A以下となり、
市場要求1/ベルに達する。
Using this, a stainless steel substrate insulating material with good insulation properties can be obtained by forming an insulating film on a substrate obtained by bright annealing and mirror polishing a material with a reduced number of inclusions. Specifically, as in Example 1, 1μ
The number of inclusions with a length of m or more is 10 per square millimeter.
When it becomes less than 0, the leakage current becomes less than 1O-10A,
Market demand reaches 1/bell.

尚、光輝焼鈍材を用いる理由としては、その他の酸洗材
は粒界や研削「Iのため表面の凹凸が非常に大きく、鏡
面研磨材基板の用途には適さないためである。また、絶
縁膜の形成プロセスとしては、ドライコーティングのス
パッタリング、イオンプレーティング、プラズマCVD
等が用いられる。尚、絶縁膜は1層に限らず、例えば、
5in)(+ M 203等の2層以−1−の複合層と
する事ができる。複合層としたセラミック薄膜は単一層
膜と比較し]−層膜が下層膜の欠陥部を埋める効果があ
るため絶縁性が向−ヒする。
The reason for using bright annealed materials is that other pickling materials have very large surface irregularities due to grain boundaries and grinding, making them unsuitable for use as mirror-polished substrates. Film formation processes include dry coating sputtering, ion plating, and plasma CVD.
etc. are used. Note that the insulating film is not limited to one layer, for example,
5in) (+ M 203 etc. can be made into a composite layer of 2 or more layers.Compared with a single layer film, the ceramic thin film made of a composite layer has the effect of filling the defects in the underlying film. Therefore, the insulation properties are improved.

実施例 実施例1 基板として5US430を用い、電子ビーム溶解法を用
いて精錬し介在物を低減した材料ど通常電気炉を用いて
精錬した材料を用い、光輝焼鈍、鏡面研磨した。基板の
成分と介在物個数の代表値を第1表に示す。これに同一
条件でM2O3絶縁膜を形成した。尚、コーティング条
件は第2表に示すとおりであり、1模厚はすべてO,J
pmである。
Examples Example 1 Using 5US430 as a substrate, bright annealing and mirror polishing were performed using a material that was refined using an electron beam melting method to reduce inclusions, or a material that was normally refined using an electric furnace. Table 1 shows typical values of the components of the substrate and the number of inclusions. An M2O3 insulating film was formed on this under the same conditions. The coating conditions are as shown in Table 2, and all thicknesses are O, J.
It is pm.

このようにして作成した各材料の直流電圧50Vにおけ
る漏れ電流を測定した。測定方法は、表面にA1電極(
5+*m角X 0.17Lm)を蒸着した材料の一ヒに
直径2φのステンレス製電極を荷重50gどなるよう置
いた測定系で、電圧をI V/seeの速度で−1−昇
させ、電流を測定している。漏洩電流測定結果を第1図
に示す。介在物個数が減少すると絶縁性は向」ニし、I
Bm以−ヒの長さの介在物個数が1平方ミリあたり 1
00個以内になると絶縁性(漏洩電流)は1.0−10
A以下となり、市場要求1/ベルに達する。なお、介在
物の長さはIBm〜15用mの範囲であった。
The leakage current of each material thus prepared at a DC voltage of 50 V was measured. The measurement method is to use an A1 electrode (
In the measurement system, a stainless steel electrode with a diameter of 2φ was placed on a piece of material deposited with a 5+*m square x 0.17Lm) with a load of 50g. are being measured. Figure 1 shows the leakage current measurement results. As the number of inclusions decreases, the insulation improves, and I
The number of inclusions with a length of Bm or more is 1 per square millimeter.
If it is less than 00, the insulation (leakage current) is 1.0-10.
A or less, reaching the market demand of 1/bell. The length of the inclusions was in the range of IBm to 15m.

実施例2 基板として、介在物個数を玲延板の表面において長さI
gm以−にのものが1平方ミリ当り 100個以内とし
た5O3430光輝焼鈍材を用い、2種類のコーティン
グ処理を行った。jつは、実施例1と同一条件でM2O
3膜を0.8gmコーティングし、もう1つは同じ条件
でAg2O3を0.4gmコーティングした後、プラズ
マCVDを用い第2表に示す条件で5iO)(を0.4
μmコーティングした。第2INはこの拐料の直流電圧
50Vにおける漏れ電源値である。同じ膜厚でもAQ7
03 +5iox2層膜の方が絶縁特性が優れているこ
とがわかる。
Example 2 As a substrate, the number of inclusions is determined by the length I on the surface of the rolled plate.
Two types of coating treatments were performed using 5O3430 bright annealed material with less than 100 particles per square millimeter of less than gm. j is M2O under the same conditions as Example 1.
3 films were coated with 0.8 gm, and the other was coated with 0.4 gm of Ag2O3 under the same conditions, and then 5iO) (0.4 gm) was coated using plasma CVD under the conditions shown in Table 2.
μm coated. The second IN is the leakage power value at a DC voltage of 50V. AQ7 even with the same film thickness
It can be seen that the 03 +5 iox two-layer film has better insulation properties.

(以下余白) 発明の効果 本発明によれば、ステンレス鋼板を基板として電気絶縁
性の優れた板状材料を提供することができる。
(Hereinafter, blank spaces) Effects of the Invention According to the present invention, it is possible to provide a plate-like material having excellent electrical insulation properties using a stainless steel plate as a substrate.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は電子ビーム溶解法を用いて精錬したステンレス
鋼と通常の電気炉で形成した材料とを基板として用いた
絶縁材の絶縁性(漏洩電流)を示す図、第2図は同一の
ステンレス鋼基板にM2O31層膜と5iO)(+/I
jj2032層膜とをそれぞれコーティングした絶縁材
料の絶縁性(漏洩電流)の相違を示す図である。
Figure 1 shows the insulation properties (leakage current) of an insulating material made of stainless steel refined using electron beam melting and a material formed in an ordinary electric furnace, and Figure 2 shows the insulation properties (leakage current) of the same stainless steel. M2O3 single layer film and 5iO)(+/I
2032 is a diagram showing the difference in insulation properties (leakage current) of the insulating materials coated with the JJ2032 layer film. FIG.

Claims (2)

【特許請求の範囲】[Claims] (1)ステンレス基板上にドライコーティング法により
セラミック薄膜を形成した電気絶縁性板状材料において
、基板が介在物個数を冷延板の表面において長さ1μm
以上のものが1平方ミリあたり100個以内とした材料
からなることを特徴とする電気絶縁性板状材料。
(1) In an electrically insulating plate-like material in which a ceramic thin film is formed on a stainless steel substrate by a dry coating method, the number of inclusions on the substrate is 1 μm in length on the surface of the cold-rolled plate.
An electrically insulating plate-like material characterized by being made of a material having 100 or less of the above elements per square millimeter.
(2)ドライコーティング法が、スパッタリング、イオ
ンプレーティング、プラズマCVDである請求項1に記
載の電気絶縁性板状材料。
(2) The electrically insulating plate material according to claim 1, wherein the dry coating method is sputtering, ion plating, or plasma CVD.
JP22837490A 1990-08-31 1990-08-31 Electrical insulating plate material Pending JPH04110459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22837490A JPH04110459A (en) 1990-08-31 1990-08-31 Electrical insulating plate material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22837490A JPH04110459A (en) 1990-08-31 1990-08-31 Electrical insulating plate material

Publications (1)

Publication Number Publication Date
JPH04110459A true JPH04110459A (en) 1992-04-10

Family

ID=16875465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22837490A Pending JPH04110459A (en) 1990-08-31 1990-08-31 Electrical insulating plate material

Country Status (1)

Country Link
JP (1) JPH04110459A (en)

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