JPH04109509A - Organic insulating material - Google Patents
Organic insulating materialInfo
- Publication number
- JPH04109509A JPH04109509A JP22870090A JP22870090A JPH04109509A JP H04109509 A JPH04109509 A JP H04109509A JP 22870090 A JP22870090 A JP 22870090A JP 22870090 A JP22870090 A JP 22870090A JP H04109509 A JPH04109509 A JP H04109509A
- Authority
- JP
- Japan
- Prior art keywords
- density polyethylene
- insulating material
- alpha
- formula
- organic insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 title claims abstract description 21
- 229920000098 polyolefin Polymers 0.000 claims abstract description 13
- 239000000539 dimer Substances 0.000 claims abstract description 9
- QGABUHGYHVKOCM-UHFFFAOYSA-N 1-(2-tert-butylperoxypropan-2-yl)-4-propan-2-ylbenzene Chemical compound CC(C)C1=CC=C(C(C)(C)OOC(C)(C)C)C=C1 QGABUHGYHVKOCM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract description 11
- -1 polyethylene Polymers 0.000 abstract description 11
- 230000015556 catabolic process Effects 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 abstract description 10
- 239000004698 Polyethylene Substances 0.000 abstract description 8
- 229920000573 polyethylene Polymers 0.000 abstract description 8
- 238000004132 cross linking Methods 0.000 abstract description 7
- 229920001903 high density polyethylene Polymers 0.000 abstract description 7
- 239000004700 high-density polyethylene Substances 0.000 abstract description 7
- 125000002877 alkyl aryl group Chemical group 0.000 abstract description 6
- 125000003118 aryl group Chemical group 0.000 abstract description 6
- 229920001684 low density polyethylene Polymers 0.000 abstract description 6
- 239000004702 low-density polyethylene Substances 0.000 abstract description 6
- 229910052736 halogen Inorganic materials 0.000 abstract description 2
- 125000005843 halogen group Chemical group 0.000 abstract description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract description 2
- 238000001125 extrusion Methods 0.000 description 15
- 239000000203 mixture Substances 0.000 description 11
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 229920001179 medium density polyethylene Polymers 0.000 description 5
- 239000004701 medium-density polyethylene Substances 0.000 description 5
- 239000004708 Very-low-density polyethylene Substances 0.000 description 4
- 229920003020 cross-linked polyethylene Polymers 0.000 description 4
- 239000004703 cross-linked polyethylene Substances 0.000 description 4
- 229920000092 linear low density polyethylene Polymers 0.000 description 4
- 239000004707 linear low-density polyethylene Substances 0.000 description 4
- 229920001866 very low density polyethylene Polymers 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- MMSLOZQEMPDGPI-UHFFFAOYSA-N p-Mentha-1,3,5,8-tetraene Chemical compound CC(=C)C1=CC=C(C)C=C1 MMSLOZQEMPDGPI-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ZOKCNEIWFQCSCM-UHFFFAOYSA-N (2-methyl-4-phenylpent-4-en-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)CC(=C)C1=CC=CC=C1 ZOKCNEIWFQCSCM-UHFFFAOYSA-N 0.000 description 1
- XMCNZCCURGYSDQ-UHFFFAOYSA-N 1-(1-Methylethenyl)-4-(1-methylethyl)benzene Chemical compound CC(C)C1=CC=C(C(C)=C)C=C1 XMCNZCCURGYSDQ-UHFFFAOYSA-N 0.000 description 1
- VNMBZYVZFQOLPY-UHFFFAOYSA-N 1-ethyl-3-prop-1-en-2-ylbenzene Chemical compound CCC1=CC=CC(C(C)=C)=C1 VNMBZYVZFQOLPY-UHFFFAOYSA-N 0.000 description 1
- IBTHFIILQIUOEK-UHFFFAOYSA-N 1-ethyl-4-prop-1-en-2-ylbenzene Chemical compound CCC1=CC=C(C(C)=C)C=C1 IBTHFIILQIUOEK-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Insulating Materials (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は有機絶縁材料、特に電線、ケーブル、およびそ
れらの付属品の絶縁に有用な有機絶縁材料に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention This invention relates to organic insulating materials, particularly those useful for insulating electrical wires, cables, and their accessories.
有機絶縁材料のうちポリエチレン等のポリオレフィンは
、電線、ケーブルおよびそれらの付属品の絶縁材料とし
て広く用いられている。ポリエチレンは電気絶縁性にす
ぐれ、低密度ポリエチレン、中密度ポリエチレン、高密
度ポリエチレンに大別される。高密度ポリエチレンは低
密度および中密度ポリエチレンより成形温度が高く、１
４５°Ｃ以上である。低密度ポリエチレンには、直鎖状
低密度ポリエチレン、直鎖状超低密度ポリエチレンが含
まれるが、これらは低密度であるにかかわらず成形温度
が比較的高い（１４０’Ｃ以上）。Among organic insulating materials, polyolefins such as polyethylene are widely used as insulating materials for electric wires, cables, and their accessories. Polyethylene has excellent electrical insulation properties and is broadly classified into low-density polyethylene, medium-density polyethylene, and high-density polyethylene. High-density polyethylene has a higher molding temperature than low-density and medium-density polyethylene;
The temperature is 45°C or higher. Low-density polyethylene includes linear low-density polyethylene and linear very low-density polyethylene, but these have relatively high molding temperatures (140'C or higher) despite their low density.
これらのポリエチレンを架橋した架橋ポリエチレンは、
未架橋のポリエチレンより耐熱性にすくれ、有用である
。ポリエチレンを架橋するための架橋剤としては、一般
にジクミルペルオキシド（ｄｉｃｕｍｙｌ ｐｅｒｏｘ
ｉｄｅ）が用いられ、架橋ポリエチレンの成形は通常１
３０°Ｃ前後で行われている。Cross-linked polyethylene made by cross-linking these polyethylenes is
It is more heat resistant than uncrosslinked polyethylene and is useful. Dicumyl peroxide is generally used as a crosslinking agent for crosslinking polyethylene.
ide) is used, and the molding of crosslinked polyethylene is usually 1
It is carried out at around 30°C.
〔発明が解決しようとする課題］
しかし、架橋剤としてジクミルペルオキシド（ＤＣＰ）
を用いる従来の架橋ポリエチレンは、成形時間の短縮や
押し出しの高速化のため、成形温度を高（すると、成形
時に架橋剤の一部が分解し、スコーチ（焼け）が発生し
て、交流破壊電圧が低下する。特に、もともと成形温度
の高い中密度ポリエチレン、高密度ポリエチレン、直鎖
状低密度または極低密度ポリエチレンにＤＣＰを用いて
架橋すると、スコーチの発生が大きく、また成形が困難
であった。[Problem to be solved by the invention] However, dicumyl peroxide (DCP) as a crosslinking agent
Conventional cross-linked polyethylene uses a high molding temperature in order to shorten molding time and speed up extrusion. In particular, when DCP is used to crosslink medium-density polyethylene, high-density polyethylene, linear low-density polyethylene, or very low-density polyethylene, which originally has a high molding temperature, scorch occurs significantly and molding is difficult. .
それ故、本発明の目的は、交流破壊電圧の低下を招くス
コーチの発生が防止された、架橋ポリオレフィンから成
る有機絶縁材料を提供することである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an organic insulating material made of crosslinked polyolefin, which prevents the generation of scorch that causes a decrease in AC breakdown voltage.
本発明の他の目的は、成形温度の高いポリオレフィンを
架橋した、成形容易な架橋ポリオレフィンから成る有機
絶縁材料を提供することである。Another object of the present invention is to provide an organic insulating material composed of a crosslinked polyolefin that can be easily molded by crosslinking a polyolefin that has a high molding temperature.
本発明では、交流破壊電圧の低下を招くスコーチの発生
が防止され、また成形温度の高いポリオレフィンを架橋
した成形容易な架橋ポリオレフィンから成る有機絶縁材
料を提供するため、架橋剤としてＬ（１−ｔ−ブチルジ
オキシイソプロビル）−４イソプロビルヘンゼンを用い
てポリオレフィンを架橋した。１−（１−ｔ−ブチルジ
オキシイソプロビル）４−イソプロピルベンゼンは別名
１−（１−ｔ−ブチルペルオキシイソプロピル）−４−
イソプロピルベンゼン、より正式な化合物命名法によれ
ば４゛−イソプロピル−１，１−ジメチルベンジル ｔ
−ブチル ペルオキシドで、過酸化物の一つである。こ
の過酸化物とα−芳香族置換−α−メチルアルケンの不
飽和二量体を組み合わせて用いてもよい。In the present invention, L(1-t The polyolefin was crosslinked using Hensen-butyldioxyisopropyl)-4isopropyl. 1-(1-t-butyldioxyisopropyl)4-isopropylbenzene is also known as 1-(1-t-butylperoxyisopropyl)-4-
Isopropylbenzene, more formally known as 4′-isopropyl-1,1-dimethylbenzyl
-Butyl peroxide, one of the peroxides. This peroxide and an unsaturated dimer of α-aromatically substituted α-methylalkene may be used in combination.
本発明で用いる架橋ポリオレフィンは、低密度ポリエチ
レン、中密度ポリエチレン、高密度ポリエチレン、直鎖
状低密度または超低密度ポリエチレンの重合体のほか、
エチレンを共重合比５０％以上含むエチレン共重合体、
例えば酢酸ビニル、アルキルアクリレートまたはアルキ
ルメタアクリレート（例えばエチルアクリレート）、プ
ロピレン等とエチレンとの共重合体を包含し、これらの
一種または二種以上から成る。The crosslinked polyolefin used in the present invention includes polymers of low density polyethylene, medium density polyethylene, high density polyethylene, linear low density or very low density polyethylene,
Ethylene copolymer containing ethylene at a copolymerization ratio of 50% or more,
Examples include copolymers of vinyl acetate, alkyl acrylates, alkyl methacrylates (eg, ethyl acrylate), propylene, etc., and ethylene, and are composed of one or more of these.
１−ｃｉ−ｔ−ブチルジオキシイソプロビル）−４−イ
ソプロピルベンゼンは、下記構造式■を有する化合物で
ある。1-ci-t-butyldioxyisopropyl)-4-isopropylbenzene is a compound having the following structural formula (2).
■
α−芳香族置換−α−メチルアルケンの不飽和二量体は
下記一般式■で表される。(2) The unsaturated dimer of α-aromatically substituted-α-methylalkene is represented by the following general formula (2).
式中Ｒはアリール基、アルカリール基またはメチル基を
表し、Ｒ＋、Ｒｚはアリール基またはアルカリール基を
表し、これらのアリール基、アルカリール基はそれぞれ
ハロゲン置換されていてもよい。一般式■の化合物は例
えば、α−メチルスチレン、ｐ−メチル−α−メチルス
チレン、ｐ−エチル−α−メチルスチレン、ｐ−イソプ
ロピル−α−メチルスチレン、トメチル−α−メチルス
チレン、ｍ−エチル−α−メチルスチレン、ａｒ−ジメ
チルα−メチルスチレン、ａｒ−ジエチル−α−メチル
スチレン、ａｒ−メチル−ａｒ−イソプロピル−α−メ
チルスチレン、ａｒ−クロロ−α−メチルスチレン、ａ
ｒ−ジクロロ−α−メチルスチレン、ａｒ−クロロ−ａ
ｒ−メチル−α−メチルスチレンの不飽和二量体である
。化合物の具体例として、α−メチルスチレンの不飽和
二量体である２、４−ジフェニル−４−メチル−１−ペ
ンテンを挙げることができる。上記不飽和二量体は２種
以上を用いてもよい。In the formula, R represents an aryl group, an alkaryl group, or a methyl group, and R+ and Rz represent an aryl group or an alkaryl group, and each of these aryl groups and alkaryl groups may be substituted with halogen. Compounds of general formula (2) include, for example, α-methylstyrene, p-methyl-α-methylstyrene, p-ethyl-α-methylstyrene, p-isopropyl-α-methylstyrene, tomethyl-α-methylstyrene, m-ethyl -α-methylstyrene, ar-dimethylα-methylstyrene, ar-diethyl-α-methylstyrene, ar-methyl-ar-isopropyl-α-methylstyrene, ar-chloro-α-methylstyrene, a
r-dichloro-α-methylstyrene, ar-chloro-a
It is an unsaturated dimer of r-methyl-α-methylstyrene. A specific example of the compound is 2,4-diphenyl-4-methyl-1-pentene, which is an unsaturated dimer of α-methylstyrene. Two or more types of the above unsaturated dimers may be used.
架橋剤の添加量は特に限定しないが、架橋度が好ましく
は６０％以上、特に７０％以上になるような量を選ぶ。The amount of crosslinking agent added is not particularly limited, but the amount is selected such that the degree of crosslinking is preferably 60% or more, particularly 70% or more.
それにより、電線、ケーブル等の浸水課電特性が向上す
る。従来用いられたジクミルペルオキシド、１．３−ビ
ス−（ｔ−ブチルペルオキシイソプロピル）−４−イソ
プロピルベンゼン、２，５−ジメチル−２，５−ジーｔ
ｅｒ ｔ−ブチルヘキシン−３等を併用することもでき
るが、その添加量は上記構造式Ｉの化合物の１／２未満
の量にすることが好ましい。This improves the submerged charging characteristics of electric wires, cables, etc. Conventionally used dicumyl peroxide, 1,3-bis-(t-butylperoxyisopropyl)-4-isopropylbenzene, 2,5-dimethyl-2,5-di-t
Although er t-butylhexyne-3 or the like can be used in combination, the amount added is preferably less than 1/2 of the amount of the compound of structural formula I above.
本発明の有機絶縁材料には、酸化防止剤、滑剤、着色剤
等を添加することができる。Antioxidants, lubricants, colorants, etc. can be added to the organic insulating material of the present invention.
本発明の有機絶縁材料は、電線、ケーブル、それらの付
属品等の、導体または導体遮蔽層（例えば内部半導電層
）の外周に設ける絶縁層として、あるいは絶縁用プラス
チック成形品として有用である。The organic insulating material of the present invention is useful as an insulating layer provided on the outer periphery of a conductor or conductor shielding layer (for example, an internal semiconducting layer) of electric wires, cables, accessories thereof, etc., or as an insulating plastic molded product.
本発明の有機絶縁材料は、上記構造式■の化合物を用い
てポリオレフィンを架橋するため、低密度ポリエチレン
はもとより、成形温度のもともと高い中密度ポリエチレ
ン、高密度ポリエチレン、直鎖状低密度または超低密度
ポリエチレン等を架橋しても、スコーチが発生しない。Since the organic insulating material of the present invention cross-links polyolefin using the compound of the above structural formula Scorch does not occur even when high-density polyethylene is crosslinked.
エチレン共重合体でも同様である。スコーチの発生がな
いので、本発明の有機絶縁材料は、同じ厚さで高い交流
破壊電圧を示す。上記構造式Ｊの化合物とα−芳香族置
換−α−メチルアルケンの不飽和二量体を組み合わせる
と、押し出し成形時に起きるポリエチレンの過度の架橋
が防止されるため、スコーチが発生しない。また、中密
度ポリエチレン、高密度ポリエチレン、直鎖状低密度ま
たは極低密度ポリエチレンに対して、構造式Ｉの化合物
のみを用いる場合より高いゲル分率が容易に得られる。The same applies to ethylene copolymers. Due to the absence of scorch, the organic insulating material of the present invention exhibits a high AC breakdown voltage at the same thickness. When the compound of structural formula J is combined with an unsaturated dimer of α-aromatically substituted α-methylalkene, excessive crosslinking of polyethylene that occurs during extrusion molding is prevented, so that scorch does not occur. Further, higher gel fractions can be easily obtained for medium density polyethylene, high density polyethylene, linear low density or very low density polyethylene than when only the compound of structural formula I is used.
以下、実施例により本発明をさらに詳細に説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples.
〔実施例１〜６〕
本発明の有機絶縁材料を用いた電力用ケーブルの断面を
図に示す。ケーブル１は、導体２の外周に、厚さ０．７
ｍｍの内部半導電層３、厚さ４ｍｍの絶縁層４、厚さ０
．７ ｍｍの外部半導電層５を有し、導体２は断面積６
０ｒＭ１２の軟銅撚線、絶縁層４は本発明による架橋ポ
リエチレンから成る。[Examples 1 to 6] The cross-sections of power cables using the organic insulating material of the present invention are shown in the figures. The cable 1 has a thickness of 0.7 on the outer periphery of the conductor 2.
mm internal semiconducting layer 3, 4 mm thick insulating layer 4, thickness 0
．． With an external semiconducting layer 5 of 7 mm, the conductor 2 has a cross-sectional area of 6
Annealed copper strands of 0 rM12, the insulating layer 4 consisting of crosslinked polyethylene according to the invention.
図に示すケーブルは、以下のようにして製造した。The cable shown in the figure was manufactured as follows.
第１表に示す６種の組成物を、２２インチミキシングロ
ールで混練し、シートとし、ペレタイザでベレット化し
、押し出し機により溶融、１４５°Ｃで押し出しを行い
、内部半導電層３の外周に被覆し、さらに外部半導電層
５を常法により押し出し被覆する。押し出し後、直ちに
窒素ガスを熱媒体とする乾式架橋管内で架橋し、その後
、加圧冷却することによってケーブル１を完成させた。The six compositions shown in Table 1 were kneaded using a 22-inch mixing roll, formed into a sheet, made into pellets using a pelletizer, melted using an extruder, extruded at 145°C, and coated on the outer periphery of the internal semiconductive layer 3. Then, an outer semiconducting layer 5 is extruded and coated using a conventional method. After extrusion, the cable 1 was immediately crosslinked in a dry crosslinking pipe using nitrogen gas as a heating medium, and then cooled under pressure to complete the cable 1.
これらのケーブルを次のようにして評価した。These cables were evaluated as follows.
（１）押し出し加工性
ケーブルの押し出し後の外観すなわちスコーチ（焼け）
の発生の有無を観察する。(1) Appearance of extrudable cable after extrusion, that is, scorch (burnt)
Observe whether or not this occurs.
（２）交流破壊電圧
供試ケーブルを常温で２０ ｋ Ｖ／ １０ｍ１ｎの割
合で電圧を上昇し、絶縁破壊電圧を測定した。(2) AC breakdown voltage The voltage of the test cable was increased at a rate of 20 kV/10 m1n at room temperature, and the dielectric breakdown voltage was measured.
試験結果を第１表に、押し出し時の組成とともに示した
。なお第１表中、組成は重量比を、各ポリエチレンの下
の数字はそれぞれの密度を、化合物■は １− （１−
ｔ−ブチルジオキシイソプロビル）４−イソプロピルベ
ンゼンを示す。The test results are shown in Table 1 along with the composition at the time of extrusion. In Table 1, the composition is the weight ratio, the number below each polyethylene is the density, and compound ■ is 1- (1-
t-Butyldioxyisopropyl) 4-isopropylbenzene.
第１表
第１表から明らかなように、実施例１〜６の絶縁材料は
いずれも、２４０ｋＶ以上の高い交流破壊電圧を示し、
ゲル分率が７０％以上で、押し出し加工性も良い。Table 1 As is clear from Table 1, the insulating materials of Examples 1 to 6 all exhibited a high AC breakdown voltage of 240 kV or more,
The gel fraction is 70% or more and the extrusion processability is also good.
〔実施例７〜１２］
実施例１〜６における押し出し組成物を、第２表に示す
α−メチルスチレンニ量体を含む組成のものに置き換え
、それ以外は実施例１〜６と同様の方法でケーブルを製
造し、評価した。その結果を、押し出し組成とともに第
２表に示す。[Examples 7 to 12] The extrusion composition in Examples 1 to 6 was replaced with one containing the α-methylstyrene dimer shown in Table 2, and the method was the same as in Examples 1 to 6 except for that. A cable was manufactured and evaluated. The results are shown in Table 2 along with the extrusion composition.
第２表から明らかなように、実施例７〜１２の絶縁材料
はいずれも、２１０ｋＶ以上の高い交流破壊電圧を示し
、ゲル分率が７０％以上で、押し出し加工性も良い。As is clear from Table 2, all of the insulating materials of Examples 7 to 12 exhibited a high AC breakdown voltage of 210 kV or more, had a gel fraction of 70% or more, and had good extrusion processability.
〔実施例１３〜１４〕
実施例１〜６における押し出し組成物を、第３表に示す
組成のものに置き換え、その他は実施例１〜６と同様の
操作でケーブルを製造し、評価した。その結果を押し出
し組成とともに第３表に示す。なお、比較のため実施例
８を併せて示した。[Examples 13-14] Cables were manufactured and evaluated in the same manner as in Examples 1-6 except that the extrusion compositions in Examples 1-6 were replaced with those having the compositions shown in Table 3. The results are shown in Table 3 along with the extrusion composition. Note that Example 8 is also shown for comparison.
第３表から明らかなように、実施例１３〜１４の絶縁材
料はいずれも、浸水課電に対し２３０ｋＶ以上の高い交
流破壊電圧を示し、ゲル分率が７０％以上で、押し出し
加工性も良い。As is clear from Table 3, all of the insulating materials of Examples 13 to 14 exhibited a high AC breakdown voltage of 230 kV or more when immersed in water, had a gel fraction of 70% or more, and had good extrusion processability. .
第２表
第３表
〔比較例１〜４〕
実施例１〜６における押し出し組成物を、第４表に示す
従来の組成のものに置き換え、その他は実施例１〜６と
同様の操作でケーブルを製造し、評価した。その結果を
押し出し組成とともに第４表に示す。Table 2 Table 3 [Comparative Examples 1 to 4] The extrusion compositions in Examples 1 to 6 were replaced with those of the conventional compositions shown in Table 4, and the cables were made in the same manner as in Examples 1 to 6. was manufactured and evaluated. The results are shown in Table 4 along with the extrusion composition.
第４表に示されるように、比較例１〜４の絶縁材料はい
ずれも、ゲル分率は７０％以上を示すが、押し出し加工
が困難で、ケーブルについての交流破壊電圧測定は不可
能であった。As shown in Table 4, all of the insulating materials of Comparative Examples 1 to 4 have a gel fraction of 70% or more, but extrusion processing is difficult and AC breakdown voltage measurement of cables is impossible. Ta.
本発明による架橋ポリオレフィンから成る有機絶縁材料
は、スコーチが発生しないため、これを用いて成形した
絶縁物の交流破壊電圧が高い。Since the organic insulating material made of the crosslinked polyolefin according to the present invention does not generate scorch, an insulator formed using the same has a high AC breakdown voltage.
また、本発明による有機絶縁材料は、成形温度の高いポ
リオレフィンを架橋したものであるが、成形が容易であ
る。Further, the organic insulating material according to the present invention is a crosslinked polyolefin having a high molding temperature, and is easy to mold.
図は、本発明の実施例で製造された電力用ケーブルの断
面図である。
符号の説明
１−・−・−−−−−−−ケーブル
２−・−−−一一一−−導体
３・−−−−−−−−一・内部半導電層４−−−−一・
・−絶縁層
５−・・−・−・−・−外部半導電層The figure is a cross-sectional view of a power cable manufactured in an example of the present invention. Explanation of symbols 1 - - - - - - - Cable 2 - - - - 1 - - Conductor 3 - - - - - - - - - 1 - Internal semiconducting layer 4 - - - - 1・
・−Insulating layer 5−・・−・−・−・−External semiconducting layer
Claims (2)
プロピル）−４−イソプロピルベンゼンを用いて架橋さ
れたポリオレフィンから成ることを特徴とする、有機絶
縁材料。(1) An organic insulating material comprising a polyolefin crosslinked using 1-(1-t-butyldioxyisopropyl)-4-isopropylbenzene as a crosslinking agent.
プロピル）−４−イソプロピルベンゼンを用い、α−芳
香族置換−α−メチルアルケンの不飽和二量体の存在下
に架橋されたポリオレフィンから成ることを特徴とする
、有機絶縁材料。(2) Polyolefin crosslinked using 1-(1-t-butyldioxyisopropyl)-4-isopropylbenzene as a crosslinking agent in the presence of an unsaturated dimer of α-aromatically substituted α-methylalkene An organic insulating material characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22870090A JP2666543B2 (en) | 1990-08-29 | 1990-08-29 | Electric wires and cables |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22870090A JP2666543B2 (en) | 1990-08-29 | 1990-08-29 | Electric wires and cables |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04109509A true JPH04109509A (en) | 1992-04-10 |
| JP2666543B2 JP2666543B2 (en) | 1997-10-22 |
Family
ID=16880433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22870090A Expired - Lifetime JP2666543B2 (en) | 1990-08-29 | 1990-08-29 | Electric wires and cables |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2666543B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093736B (en) * | 2006-06-21 | 2010-04-21 | 江苏中煤电缆股份有限公司 | Rubber insulation material and insulating sheath material for mine cable |
-
1990
- 1990-08-29 JP JP22870090A patent/JP2666543B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2666543B2 (en) | 1997-10-22 |
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