JPH04107987A - Packaging method of electronic parts - Google Patents

Abstract

PURPOSE:To enable one part of traveling distance of a substrate in XY directions to be taken care of by that of a nozzle and electronic parts to be packaged at high speed by allowing the multi-nozzle type transfer head to be rotated by theta. CONSTITUTION:When mounting electronic parts P2 which are sucked to a nozzle 11a, a motor 3 is driven and a transfer head 2 is rotated by 180 deg.theta. Then the nozzle 11a moves by a distance d which is a rotary diameter of the nozzle 11a in Y direction. Therefore, one part of a traveling distance Y from coordinates a to coordinates b is taken care of by traveling of the nozzle 11a and the substrate 8 may be moved by only Y1-d and the traveling distance of the substrate 8 can be reduced, thus enabling time required for moving the substrate 8 to be reduced and packaging speed of electronic parts P2 to be increased. This transfer head 2 can be rotated by theta while the nozzle 11a takes up the electronic parts and mounts them to the substrate 8.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a method for mounting electronic components, in which a part of the movement of the board in the XY force direction is transferred to the nozzle by rotating a multi-nozzle transfer head by θ. This is to speed up the mounting of electronic components.

(Prior art) A rotary head type electronic component mounting apparatus index-rotates the rotary head and picks up electronic components on a parts feeder by adsorbing them to the nozzle of a transfer head provided on the rotary rad. It is designed to be transferred and mounted on the board placed on the child table.

The coordinate position for mounting the electronic component on the board is given in advance by the program, and by driving the XY child table and moving the board in the XY force direction, the electronic component is mounted at the predetermined coordinate position. There is.

(Problem to be Solved by the Invention) The amount of movement of the substrate is related to the length of the takt time, and the larger the amount of movement, the longer the time required for movement and the longer the mounting time. Therefore, in order to increase the speed of mounting, it is advantageous to minimize the amount of movement of the substrate.

By the way, the transfer head generally has multiple nozzles, and depending on the type of electronic component, the nozzle can be selected by rotating the transfer head by θ around its axis. There is.

Therefore, the present invention focuses on the θ rotation function of such a multi-nozzle type transfer head, and aims to provide a means for increasing the speed of mounting by utilizing this θ rotation function.

(Means for Solving the Problems) The present invention provides for ticking up electronic components of a parts feeder by adsorbing them to the nozzles of a multi-nozzle type transfer head provided on the rotary head while index-rotating the rotary head. In order to transfer and mount this electronic component onto the board placed on the XY child table, the transfer head is driven by a motor and rotated by θ around its axis, so that the nozzle that has absorbed the electronic component is moved in the X direction. , and in the Y direction, to bear part of the amount of movement of the XY child table in the X and Y directions.

(Function) In the above configuration, the transfer head is rotated by θ around its axis.
When the nozzle is rotated, the nozzle that has picked up the electronic component also rotates around this axial line, so the nozzle moves in the X and Y directions. Therefore, it is possible to shorten the amount of movement of the board in the X and Y directions by the amount of movement of the nozzle in the X and Y directions, thereby shortening the time required to move the board and speeding up the mounting of electronic components.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of a rotary head type electronic component mounting apparatus. 1 is a rotary head, and a plurality of transfer heads 2 are provided. Reference numeral 4 denotes an electronic component supply device, which includes a table 6, a plurality of parts feeders 5 such as tape units and tube feeders provided on the table 6, and a feed screw for moving the parts feeder 5 in the X direction. It consists of 7 mag.

Reference numeral 9 denotes an XY child table provided on the opposite side of the electronic component supply device 40, on which the board 8 is placed. When this XY child table is driven, the substrate 8 moves in the xyx directions, and the mounting position of the electronic component is positioned directly below the nozzle of the transfer head 2.

As shown in FIG. 2, this transfer head 2 is a multi-nozzle type transfer head, and has a plurality of nozzles l1a-1i.
It has d. 3 points this transfer head 2 along its axis O.
This is a motor that rotates θ around . Nozzle lla~l
There are various shapes and dimensions of the nozzle l, and depending on the type of electronic component P, the nozzle l can be adjusted by rotating the transfer head 2 by θ.
Select la~lid. In this device, the rotary head 1 index-rotates in the N direction, so that the electronic components P of the parts feeder 5 are attracted to the nozzles lla to lld, ticked up, and transferred and mounted on the board 8.

FIG. 2 shows how the electronic component P2 adsorbed by the nozzle lla is mounted on the board 8.

In the figure, Pl is an electronic component previously mounted on the board 8, a
is the coordinate position, b is the coordinate position where the electronic component P2 is mounted, and Yl is the distance in the Y direction from the coordinate a to the coordinate.

In such a case, the conventional means drives the XY child table to move the substrate 8 by a distance Y1 in the Y direction. In contrast, the present means drives the motor 3 to
Rotate by 180°θ. Then, the nozzle Ila moves in the Y direction by a distance d, which is the rotational diameter of the nozzle Ila. Therefore, part of the movement amount Y1 from the coordinate a to the coordinate is borne by the movement of the nozzle lla, and the substrate 8
need only be moved by Yl-d, the amount of movement of the base 1i8 can be shortened by that much, the time required to move the board 8 can be shortened, and the mounting speed of the electronic component P2 can be increased.

This θ rotation of the transfer head 2 is performed from when the nozzle lla picks up the electronic component until it is mounted on the board 8. By rotating the transfer head 2 by 180 degrees,
Electronic component P2 is also rotated 180 degrees and reversed left and right, so
This method is applicable only to mounting means for electronic components such as resistor knobs and rectangular capacitor chips that have no left-right polarity directionality.

(Example 2) In FIG. 3, when mounting the electronic component P from the coordinate a1 to the coordinate b1, the transfer head 2 is rotated 90'' in the θR direction. Also, when mounting the electronic component P from the coordinate a2 to the coordinate b2, θL
Rotate 90° in the force direction. In this way, move the transfer head 2 to 9
By rotating the substrate 8 by 0'', the amount of movement of the substrate 8 in the X direction can be shortened by d/2.

(Effects of the Invention) As explained above, the present invention index-rotates the rotary head and picks up the electronic components of the parts feeder by adsorbing them to the nozzles of the multi-nozzle transfer head provided on the rotary head. In order to transfer and mount this electronic component onto a board placed on an Since the XY child table is moved in the X and Y directions to bear part of the movement of the XY child table in the X and Y directions, the movement of the board in the X and Y directions is shortened.
Since the moving time of the board can be shortened or the moving distance within the same tact can be increased by the amount of movement of the nozzle, the mounting speed of electronic components can be increased accordingly.

[Brief explanation of the drawing]

The figures show embodiments of the present invention, in which Fig. 1 is a plan view of a rotary head type electronic component mounting apparatus, Fig. 2 is a plan view of the device being mounted on a board, and Fig. 3 is a plan view of another embodiment. FIG. ■Rotary head 2 Multi-nozzle transfer head 3 Motor 5 Parts feeder 8 Substrate 9

Claims (1)

[Claims] While index-rotating the rotary head, the electronic components of the parts feeder are sucked and taken up by the nozzles of the multi-nozzle type transfer head provided on the rotary head, and the electronic components are placed on the XY table. When transferring and mounting the electronic components onto the mounted board, the transfer head is driven by a motor and rotated by θ around its axis, thereby moving the nozzle that has picked up the electronic components in the X and Y directions. A method for mounting an electronic component, characterized in that part of the amount of movement of the XY table in the X and Y directions is borne by the XY table.