JPH04107871U - flexible wiring board - Google Patents
flexible wiring boardInfo
- Publication number
- JPH04107871U JPH04107871U JP1872391U JP1872391U JPH04107871U JP H04107871 U JPH04107871 U JP H04107871U JP 1872391 U JP1872391 U JP 1872391U JP 1872391 U JP1872391 U JP 1872391U JP H04107871 U JPH04107871 U JP H04107871U
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- conductive paste
- wiring
- wiring board
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000005452 bending Methods 0.000 abstract description 6
- 239000011295 pitch Substances 0.000 description 10
- 238000007639 printing Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】配線基板上に組立てられた電子装置の高機能化
に伴い生じた各電子素子間を接続する配線パターンの低
ピッチ化に対し、配線パターンを構成する導電ラインの
低抵抗化をはかり、耐折曲げ性に優れた可撓性配線基板
を安価に提供する。
【構成】本考案の可撓性配線基板では、可撓絶縁性フィ
ルム１の表裏同一位置に、同形の配線パターン２、５が
導電ペーストにより形成され、前記同一位置にある両配
線パターン２、５の対応する各導電ライン３、６を接続
するよう可撓絶縁性フィルム１を貫通するスルーホール
に導電ペーストが流入され接続路４が形成されている。
(57) [Summary] [Purpose] The pitch of the wiring patterns that connect each electronic element has become lower due to the higher functionality of electronic devices assembled on wiring boards. To provide a flexible wiring board with low resistance and excellent bending resistance at low cost. [Structure] In the flexible wiring board of the present invention, wiring patterns 2 and 5 of the same shape are formed using conductive paste at the same positions on the front and back sides of a flexible insulating film 1, and both wiring patterns 2 and 5 at the same positions are formed using conductive paste. A conductive paste is flowed into the through hole penetrating the flexible insulating film 1 to connect the corresponding conductive lines 3 and 6 to form a connection path 4.
Description
【０００１】0001
本考案は、電子素子を取付けて電子装置を組み立てる可撓性配線基板の改良に 関する。 This invention is useful for improving flexible wiring boards on which electronic elements are attached and used to assemble electronic devices. related.
【０００２】0002
電子装置を構成する回路基板は、絶縁性基板に導電ペーストで配線パターンを 印刷等により形成し、これにトランジスタ、抵抗、コンデンサ、ＩＣ回路等の電 子素子を取付けたものであるが、近年電子装置の小型化、高機能化が進む中で、 液晶表示パネル（ＬＣＤ）、プラズマディスプレイ（ＰＤＰ）等のディスプレイ 装置が大型化、カラー化するに伴い、配線基板上に形成された配線パターンのピ ッチは０．３ｍｍ台から０．２ｍｍ台さらに０．１ｍｍ台へと細密化してきた。 従来の配線基板は可撓絶縁性有機高分子フィルムの片面に、導電ペーストによ り配線パターンを形成したものであるが、上記のような配線ピッチの細密化につ れ、導電ラインの幅も極度に狭くすることを強いられる結果となった。 The circuit boards that make up electronic devices are made by forming wiring patterns on an insulating board using conductive paste. It is formed by printing, etc., and is used to attach electrical components such as transistors, resistors, capacitors, and IC circuits. It is a device with an attached element, but as electronic devices have become smaller and more sophisticated in recent years, Displays such as liquid crystal display panels (LCD) and plasma displays (PDP) As equipment becomes larger and more colorful, the pins of the wiring pattern formed on the wiring board become smaller. The pitch has become finer from the 0.3 mm level to the 0.2 mm level and further to the 0.1 mm level. Conventional wiring boards have conductive paste on one side of a flexible insulating organic polymer film. However, due to the miniaturization of the wiring pitch as mentioned above, As a result, the width of the conductive line was forced to be extremely narrow.
【０００３】0003
このような配線パターンを構成する幅の狭い導電ラインは断線、剥離し易く、 さらに抵抗が増大して電子装置の機能に悪影響を及ぼすこととなった。これを解 決するため、紙、不織布等の絶縁性シートの表裏に導電ペーストで配線パターン を印刷し、ペーストの浸透力を利用して表裏の対応する導電ラインを導通させて 導電ラインの抵抗の低下をはかる試みもなされたが、隣接導電ライン間に絶縁不 良を生じ易く、またシートの強度に起因して折り曲げによる抵抗値の増大、導通 不良を招くという不利があった。 また紙、不織布に代えて、絶縁性弾性マトリックス中に厚み方向にのみ導電性 を有するよう導電性繊維を配向、分散させた異方導電シートを使用した例もある が、シートがシリコーンゴム等の弾性体であるため、配線パターン形成時の伸縮 によるピッチ不良、導電ペーストの密着不良を生じ易いうえ、製造工程が煩雑で コスト高となることを避けられなかった。 The narrow conductive lines that make up such wiring patterns are easily disconnected and peeled off. Furthermore, the resistance increased, which adversely affected the functionality of the electronic device. solve this In order to is printed, and the corresponding conductive lines on the front and back sides are made conductive using the penetrating power of the paste. Attempts have been made to reduce the resistance of conductive lines, but there is no insulation between adjacent conductive lines. Also, due to the strength of the sheet, the resistance value increases due to bending and conduction. This had the disadvantage of inviting defects. In addition, instead of paper or non-woven fabric, conductive material is provided only in the thickness direction in an insulating elastic matrix. There are also examples of using anisotropic conductive sheets in which conductive fibers are oriented and dispersed to have However, since the sheet is made of an elastic material such as silicone rubber, it expands and contracts when forming the wiring pattern. In addition to easily causing poor pitch and poor adhesion of conductive paste, the manufacturing process is complicated. Higher costs could not be avoided.
【０００４】0004
本考案は、前記従来の課題を解決するもので、配線基板の絶縁性を損なわず、 導電ラインの低抵抗を保持して配線パターンの低ピッチ化を実現し、しかも耐折 り曲げ性に優れた配線基板を安価に提供することを目的とするもので、これは可 撓絶縁性フィルムの表裏同一位置に、同形の配線パターンが導電ペーストにより 形成され、前記同一位置にある両配線パターンの対応する各導電ラインを接続す るよう可撓絶縁性フィルムを貫通するスルーホールに導電ペーストが流入され接 続路が形成されてなることを特徴とする可撓性配線基板である。 The present invention solves the above-mentioned conventional problems, and does not impair the insulation properties of the wiring board. It maintains the low resistance of the conductive line, realizes a low pitch wiring pattern, and is durable. The purpose is to provide wiring boards with excellent bendability at low cost. A wiring pattern of the same shape is placed at the same position on the front and back sides of the flexible insulating film using conductive paste. connecting the corresponding conductive lines of both wiring patterns formed and located at the same position. Conductive paste is flowed into the through hole penetrating the flexible insulating film to make the connection. This is a flexible wiring board characterized in that a connecting path is formed.
【０００５】 以下図面によって本考案の配線基板を説明すると、図１（ａ）は、可撓絶縁性 フィルム１の表側に導電ペーストで印刷された配線パターン２を例示するもので 、配線パターン２を構成する表側の各導電ライン３上にほぼ等ピッチでスルーホ ールが可撓絶縁性フィルム１を貫通してあけられ、これに導電ペーストが流入さ れて接続路４が形成されている。（ｂ）は（ａ）のＸ−Ｘ線に沿う縦断面図で、 可撓絶縁性フィルム１の表側の導電ライン３と裏側の配線パターン５を構成する 裏側の導電ライン６が接続路４で接続されている。[0005] The wiring board of the present invention will be explained below with reference to the drawings. Figure 1(a) shows a flexible insulating board. This is an example of the wiring pattern 2 printed with conductive paste on the front side of the film 1. , through holes are placed at approximately equal pitches on each conductive line 3 on the front side constituting the wiring pattern 2. A conductive paste is poured into the flexible insulating film 1. A connecting path 4 is formed. (b) is a longitudinal cross-sectional view taken along the line X-X of (a), Constructs a conductive line 3 on the front side of the flexible insulating film 1 and a wiring pattern 5 on the back side. The conductive lines 6 on the back side are connected by connection paths 4.
【０００６】 使用される可撓絶縁性フィルムとしては、ポリエチレンテレフタレート（ＰＥ Ｔ）、ポリブチレンテレフタレート（ＰＢＴ）、ポリエチレンナフタレート（Ｐ ＥＮ）等のポリエステル、ポリイミド、ポリカーボネート、ポリフェニレンサル ファイド等が例示されるが、耐折曲げ性や温度変化、外力に対する寸法安定性お よび導電ペーストの密着性の点から、ポリエステルフィルムが好ましく、厚みは １０〜５０μｍとするのがよい。[0006] The flexible insulating film used is polyethylene terephthalate (PE T), polybutylene terephthalate (PBT), polyethylene naphthalate (P EN), polyester, polyimide, polycarbonate, polyphenylene salt, etc. Fido is an example, but it has excellent bending resistance, temperature change, dimensional stability against external force, and Polyester film is preferable from the viewpoint of adhesion of conductive paste and the thickness of The thickness is preferably 10 to 50 μm.
【０００７】 導電ペーストは、カーボン、金、銀等の導電性粉末を、ポリエステル樹脂、ポ リウレタン樹脂、エポキシ樹脂等のバインダーに４０〜９５重量パーセント含有 させたもので、体積固有抵抗は１０-5〜１０0 Ωｃｍであることが好ましい。 配線基板の表裏に使用される導電ペーストは同一でも異なるものいずれでもよ いが、スルーホールに流入させる導電ペーストは、相溶性による導通安定性の点 から、表裏の導電ペーストのバインダーと同一成分とするのがよい。[0007] The conductive paste is made by containing 40 to 95 weight percent of conductive powder such as carbon, gold, or silver in a binder such as polyester resin, polyurethane resin, or epoxy resin, and has a volume resistivity of 10 -5 to 10 -5 . It is preferably 10 0 Ωcm. The conductive pastes used on the front and back sides of the wiring board may be the same or different, but the conductive paste that flows into the through-holes should have the same composition as the binder of the conductive paste on the front and back sides from the viewpoint of continuity stability due to compatibility. It is better.
【０００８】 スルーホールは１本の導電ラインに最低２本必要であるが、これより多いほど 配線パターンの耐折曲げ性の向上と断線防止には好ましく、スルーホールのピッ チは可能な限り小さく、１０ｍｍ以下がよく、またスルーホール径は導電ライン の１／２以下とするのが好ましい。 図１（ａ）におけるＹ−Ｙ線に沿う縦断面図である図１（ｃ）に示すように、 スルーホールが１本の導電ラインに２個の場合は、導電ラインの両端から遠く設 けるほど抵抗値を下げる効果は低下するので、少なくとも両端から全長の２５％ 以内、好ましくは１０％以内とするのがよい。[0008] At least two through holes are required for one conductive line, but the more It is preferable to improve the bending resistance of the wiring pattern and prevent wire breakage. The hole should be as small as possible, preferably 10 mm or less, and the diameter of the through hole should be as small as possible for the conductive line. It is preferable to set it to 1/2 or less. As shown in FIG. 1(c), which is a longitudinal cross-sectional view taken along the Y-Y line in FIG. 1(a), If there are two through holes on one conductive line, make sure to install them far from both ends of the conductive line. The effect of lowering the resistance value decreases as the length increases, so at least 25% of the total length from both ends. It is preferably within 10%.
【０００９】 接続路を作製するには、まず絶縁性の有機高分子フィルムの片面に、スクリー ン印刷、グラビア印刷等により導電ペーストで配線パターンを印刷し乾燥させた 後、配線パターンを構成する導電ライン上から針、レーザー等により、フィルム を貫通してスルーホールを等ピッチで設け、ついで表面の配線パターンと同形の 配線パターンを裏面の同位置に印刷した後、スルーホール内に導電ペーストを流 入させて表裏の導電ラインを導通させる接続路を形成する。またはあらかじめ針 、レーザー、抜き型等により、穴あけ加工された前記フィルムの両面にスクリー ン印刷、グラビア印刷等により配線パターンを印刷し、スルーホール内に導電ペ ーストを流入させる方法が例示される。スルーホールは導電ライン以外の部分に 設けられても何ら問題はない。[0009] To create a connection path, first place a screen on one side of an insulating organic polymer film. A wiring pattern is printed using conductive paste using printing, gravure printing, etc., and then dried. After that, use a needle, laser, etc. to remove the film from above the conductive lines that make up the wiring pattern. Through holes are provided at equal pitches through the After printing the wiring pattern at the same position on the back side, pour conductive paste into the through hole. A connection path is formed to connect the conductive lines on the front and back sides. or pre-needle , laser, cutting die, etc., on both sides of the perforated film. Print the wiring pattern by printing, gravure printing, etc., and place conductive paste inside the through hole. A method for inflowing a host is exemplified. Through holes are placed in areas other than conductive lines. There is no problem if it is installed.
【００１０】 本考案の配線基板の両面に異方導電接着剤、例えば熱可塑性成分および／また は熱硬化性成分からなる絶縁性バインダー中に導電性粒子を分散したもの、など を塗布することにより、基板間のヒートコネクターとして使用可能で、これによ れば回路設計の自由度が広がる。 接続路の端面は配線基板、導電ペースト、導電性粉末の材質の組合せにより、 図１（ｂ）に示すように、導電ラインの表面より突出したり、図１（ｃ）に示す ように面一になったり、あるいは図示しないが、凹んだものとすることができ、 用途、目的により適宜選択できる。0010 An anisotropic conductive adhesive, such as a thermoplastic component and/or is a material in which conductive particles are dispersed in an insulating binder made of a thermosetting component, etc. By coating it, it can be used as a heat connector between boards. This increases the degree of freedom in circuit design. The end surface of the connection path is made of a combination of materials such as wiring board, conductive paste, and conductive powder. As shown in Figure 1(b), it protrudes from the surface of the conductive line, or as shown in Figure 1(c). It can be flat as shown in the figure, or it can be concave (not shown), It can be selected as appropriate depending on the use and purpose.
【００１１】[0011]
絶縁性の有機高分子フィルムである、厚み２５μｍのＰＥＴフィルムの片面に 、導電性粉末が銀で、バインダーがポリエステル樹脂である導電ペーストにより 、配線ピッチ０．３ｍｍ、線幅０．１５ｍｍ、長さ１００ｍｍの導電ラインを、 スクリーン印刷によって印刷し、乾燥後、直径０．０６ｍｍの針により、５ｍｍ のピッチで導電ラインにスルーホールを設け、裏面にも表面と同形の配線パター ンを同位置に印刷し、各スルーホールに導電ペーストを流入させ接続路を形成し 、本考案の可撓性配線基板を得た。これに対し片面のみに配線パターンを印刷し た点だけが実施例と異なる従来の配線基板を作り、両者の導電ラインの抵抗を測 定したところ、前者は１４Ω、後者は２５Ωで約１／２に減少した。 折曲げ試験においても片面のみ印刷した基板が５往復で断線したのに比べ、本 考案の表裏に印刷した配線基板は折曲げ２２往復まで断線しなかった。 また基板に紙を用いて配線パターンを印刷した場合は、パターンがにじんでし まい配線ピッチを０．６ｍｍとするのが限界であった。 on one side of a 25 μm thick PET film, which is an insulating organic polymer film. , by a conductive paste where the conductive powder is silver and the binder is polyester resin. , a conductive line with a wiring pitch of 0.3 mm, a line width of 0.15 mm, and a length of 100 mm, Printed by screen printing, and after drying, 5 mm with a needle of 0.06 mm in diameter. Through-holes are provided in the conductive lines at a pitch of printed at the same position, and flowed conductive paste into each through hole to form a connection path. , a flexible wiring board of the present invention was obtained. In contrast, the wiring pattern is printed on only one side. We created a conventional wiring board that differs from the example in the following points, and measured the resistance of the conductive lines of both. As a result, the former was 14 Ω and the latter was 25 Ω, which was reduced to about 1/2. In the bending test, the board printed on only one side broke after 5 reciprocations; The wiring board printed on the front and back sides of the device did not break until it was bent 22 times. Also, if you print the wiring pattern on the board using paper, the pattern may bleed. The limit was a narrow wiring pitch of 0.6 mm.
【００１２】0012
上記したように、本考案の配線基板は、配線パターンが低ピッチ化されても、 印刷不良による導電ラインの断線も、抵抗の増加も少なく、耐折曲げ性において も優れ、歩留まり向上によるコストダウンにいちじるしい効果がある。 As mentioned above, the wiring board of the present invention has a low pitch wiring pattern. There is little disconnection of conductive lines due to printing defects, little increase in resistance, and excellent bending resistance. It has excellent performance and has a significant effect on cost reduction by improving yield.
【図１】（ａ）は本考案の可撓性配線基板の部分拡大平
面図、（ｂ）は（ａ）のＸ−Ｘ線に沿う縦断面図、
（ｃ）は（ａ）のＹ−Ｙ線に沿う縦断面図である。FIG. 1 (a) is a partially enlarged plan view of a flexible wiring board of the present invention, (b) is a vertical cross-sectional view taken along line X-X in (a),
(c) is a longitudinal cross-sectional view taken along the YY line in (a).
１ 可撓絶縁性フィルム ２ 表側の配線パターン ３ 表側の導電ライン ４ 接続路 ５ 裏側の配線パターン ６ 裏側の導電ライン 1 Flexible insulating film 2 Front wiring pattern 3 Conductive line on the front side 4 Connecting path 5 Wiring pattern on the back side 6 Conductive line on the back side
Claims (1)
同形の配線パターンが導電ペーストにより形成され、前
記同一位置にある両配線パターンの対応する各導電ライ
ンを接続するよう可撓絶縁性フィルムを貫通するスルー
ホールに導電ペーストが流入され接続路が形成されてな
ることを特徴とする可撓性配線基板。[Claim 1] At the same position on both sides of the flexible insulating film,
Wiring patterns of the same shape are formed using conductive paste, and the conductive paste is flowed into the through holes penetrating the flexible insulating film to connect the corresponding conductive lines of both wiring patterns at the same position to form a connection path. A flexible wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1872391U JPH085576Y2 (en) | 1991-03-04 | 1991-03-04 | Flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1872391U JPH085576Y2 (en) | 1991-03-04 | 1991-03-04 | Flexible wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04107871U true JPH04107871U (en) | 1992-09-17 |
| JPH085576Y2 JPH085576Y2 (en) | 1996-02-14 |
Family
ID=31905177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1872391U Expired - Lifetime JPH085576Y2 (en) | 1991-03-04 | 1991-03-04 | Flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085576Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650376U (en) * | 1992-12-02 | 1994-07-08 | 小島プレス工業株式会社 | Printed board |
| WO2013190604A1 (en) * | 2012-06-18 | 2013-12-27 | 三洋電機株式会社 | Circuit substrate |
-
1991
- 1991-03-04 JP JP1872391U patent/JPH085576Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650376U (en) * | 1992-12-02 | 1994-07-08 | 小島プレス工業株式会社 | Printed board |
| WO2013190604A1 (en) * | 2012-06-18 | 2013-12-27 | 三洋電機株式会社 | Circuit substrate |
| JPWO2013190604A1 (en) * | 2012-06-18 | 2016-02-08 | パナソニックＩｐマネジメント株式会社 | Wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085576Y2 (en) | 1996-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |