JPH04104286U - Optical metal coating removal device - Google Patents
Optical metal coating removal deviceInfo
- Publication number
- JPH04104286U JPH04104286U JP1991072171U JP7217191U JPH04104286U JP H04104286 U JPH04104286 U JP H04104286U JP 1991072171 U JP1991072171 U JP 1991072171U JP 7217191 U JP7217191 U JP 7217191U JP H04104286 U JPH04104286 U JP H04104286U
- Authority
- JP
- Japan
- Prior art keywords
- metal coating
- base material
- substrate
- vector
- beams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 25
- 239000002184 metal Substances 0.000 title claims abstract description 25
- 239000011248 coating agent Substances 0.000 title claims abstract description 22
- 230000003287 optical effect Effects 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 claims description 2
- 230000003111 delayed effect Effects 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】
【目的】 一方向に移動する基材上の金属被膜を、移動
方向に沿った筋（すじ）状に除去することを高能率に行
なう。
【構成】 光源装置１２からの単一のレーザ光１４を分
割装置１６，２８，３８で強さが等しい複数の平行な分
割レーザ光３３，３５，４３，４９にし、この各分割レ
ーザ光をレンズ装置５４により基材５６の移動方向に長
軸が向いた楕円形にし、基材上の金属被膜６０に照射す
る。
(57) [Summary] [Purpose] To efficiently remove a metal coating on a substrate moving in one direction in the form of streaks along the direction of movement. [Structure] A single laser beam 14 from a light source device 12 is divided into a plurality of parallel divided laser beams 33, 35, 43, 49 with equal intensity by splitting devices 16, 28, 38, and each divided laser beam is divided into a plurality of parallel divided laser beams 33, 35, 43, 49 using a lens. The device 54 forms the base material 56 into an elliptical shape with its major axis facing the moving direction, and irradiates the metal coating 60 on the base material.
Description
【０００１】0001
この考案は、誘電性基材上に設けられた金属被膜を、光エネルギーによってほ ゞ同じ幅の、平行な複数の筋（すじ）状に除去する光学式金属膜除去装置に関す る。 This idea uses light energy to create a metal coating on a dielectric substrate. Concerning an optical metal film removal device that removes multiple parallel stripes of the same width. Ru.
【０００２】0002
このように金属被膜を平行な複数の筋状に除去した誘電性基材は、コンデンサ ーなどの容量性装置の製造に使用するのであって、本出願人はそのコンデンサを 米国特許出願番号第４７５５７０号（１９８３年３月１５出願、米国特許第４４ ６２０６２号）で提案し、又、誘電性基材上に設けられた金属被膜を、光エネル ギーで複数の筋状に除去することを米国特許出願第４７５５６９号（１９８３年 ３月１５日出願、米国特許第４５３１２６８号）で提案した。 上記先行提案の第８図では、移動する基材の上方に、基材の移動方向に交叉し てレーザ光の投射装置を配置し、該投射装置に設けた複数の光線出口からレーザ 光を基材に向けて投射し、基材上の金属被膜を、平行な複数の筋状に除去してい る。 The dielectric base material from which the metal coating has been removed in multiple parallel stripes is used for capacitors. capacitors, such as capacitors, and the applicant is U.S. Patent Application No. 475,570 (filed March 15, 1983, U.S. Patent No. 44 62062), and the metal coating provided on the dielectric substrate was U.S. Patent Application No. 475,569 (1983) This was proposed in U.S. Patent No. 4,531,268, filed on March 15th. In Fig. 8 of the above-mentioned prior proposal, there is a line above the moving base material, crossing the direction of movement of the base material. A laser beam projection device is arranged at the The metal coating on the substrate is removed in multiple parallel stripes by projecting light toward the substrate. Ru.
【０００３】0003
しかし、上記装置によると、除去する筋の数に対応した複数のレーザ発振器を 投射装置に備えさせ、各筋の幅を同じにするために、複数のレーザ発振器の出力 を一定に制御しなければならない。 However, according to the above device, multiple laser oscillators corresponding to the number of streaks to be removed are used. The output of multiple laser oscillators is provided in the projection device to ensure that each stripe has the same width. must be controlled at a constant level.
【０００４】0004
そこで、本考案は一つの光源光を強さが等しい複数のビームに分割し、この分 割したビームによって基材上の金属被膜をほゞ同じ幅の、平行な複数の筋状に除 去すると共に、併せて、分割した各ビームを、長軸が基材の移動方向に向いた楕 円形にすることで基材の移動速度を早めても、金属被膜を筋状に確実に除去でき るようにし、これにより加工能率を高めたのであり、金属被膜の光学式除去装置 として、一次ビームを発生する光源装置と、該一次ビームを拡大するエキスパン ダーと、拡大した一次ビームを夫々エネルギーが等しい複数のビームに分割する 分割装置と、前記基材を移動させる装置と、移動する基材上の幅方向に異なった 位置に向かって設けられ、上記分割装置で分割されたビームの各々を基材に集中 して金属被膜を除去する作用ビームにする複数のビーム集中組立体と、前記分割 装置で分割されたビームを各ビーム集中組立体に導入する反射器とを備え、上記 各ビーム集中組立体に、基材上に集中する作用ビームの形状を、長軸が基材の移 動方向に向いた楕円形にするレンズ装置を設けたのである。 Therefore, the present invention divides one light source light into multiple beams of equal intensity, and The split beam cuts the metal coating on the base material into multiple parallel stripes of approximately the same width. At the same time, each divided beam is transformed into an ellipse with its long axis facing the direction of movement of the base material. By making it circular, even if the moving speed of the base material is increased, the metal coating can be removed reliably in streaks. This improved processing efficiency and enabled optical removal equipment for metal coatings. A light source device that generates a primary beam and an expander that expands the primary beam. split the expanded primary beam into multiple beams, each with equal energy. a dividing device, a device for moving the base material, and a device for moving the base material that differs in the width direction on the moving base material; Each of the beams split by the splitting device is focused on the base material. a plurality of beam concentrating assemblies into working beams for removing metal coatings; a reflector for introducing the beam split by the device into each beam concentrating assembly; For each beam concentrator assembly, define the shape of the working beam that is concentrated on the substrate, with the long axis A lens device was provided that formed an ellipse oriented in the direction of motion.
【０００５】[0005]
以下、本考案の一実施例を図１、図２によって説明する。 １２は非偏光の一次ビーム１４、例えばレーザ光を発する光源装置で、その一 次ビーム１４を第１分割装置１６で偏光して二次ビーム１８と、２０とに分割す る。二次ビーム１８は図１に示すようにベクトルＰ方向に、二次ビーム２０はベ クトルＳ方向に偏光している。上記二次ビーム１８の光路には位相遅延装置２２ 、二次ビーム２０の光路には位相遅延装置２４が配置されている。 An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. 12 is a light source device that emits a non-polarized primary beam 14, for example a laser beam; The secondary beam 14 is polarized by the first splitting device 16 and split into secondary beams 18 and 20. Ru. The secondary beam 18 is directed in the vector P direction as shown in FIG. The light is polarized in the vector S direction. A phase delay device 22 is provided in the optical path of the secondary beam 18. , a phase delay device 24 is arranged in the optical path of the secondary beam 20.
【０００６】 位相遅延装置２２は二次ビーム１８のベクトルＰ方向を４５°遅らせて遅延ビ ーム２６にする。この位相遅延装置２２から出る遅延ビーム２６はベクトルＰ′ と、ベクトルＳ′との和の方向を有し、次の第２分割装置２８に入る。尚、ベク トルＰ′と、ベクトルＳ′との和の大きさは、光学要素の損失を無視すると、ベ クトルＰの１／√２に等しい。[0006] The phase delay device 22 delays the direction of the vector P of the secondary beam 18 by 45 degrees to create a delayed beam. 26. The delayed beam 26 coming out of this phase delay device 22 is a vector P' and vector S', and enters the next second dividing device 28. Furthermore, Baek The magnitude of the sum of the torque P' and the vector S' is equal to 1/√2 of vector P.
【０００７】 第２分割装置２８は遅延ビーム２６を偏光して三次ビーム３０と３２に分割す る。この三次ビーム３０はベクトルＰ′方向に偏光され、三次ビーム３２はベク トルＳ′方向に偏光されている。ベクトルＰ′の大きさは、ベクトルＳ′の大き さに等しい。ベクトルＰ′を有する三次ビーム３０は、反射器３４によって三次 ビーム３２と平行なビーム３６にされる。[0007] A second splitting device 28 polarizes the delayed beam 26 and splits it into tertiary beams 30 and 32. Ru. This tertiary beam 30 is polarized in the vector P' direction, and the tertiary beam 32 is polarized in the vector P' direction. The light is polarized in the direction of torque S'. The size of vector P' is the size of vector S' It's equal to that. The tertiary beam 30 with vector P' is transformed into a tertiary beam by a reflector 34. A beam 36 is made parallel to the beam 32.
【０００８】 又、前述の二次ビーム２０の光路に配置された位相遅延装置２４は、該ビーム ２０のベクトルＳ方向を４５°遅らせて遅延ビーム４０にする。この位相遅延装 置２４から出る遅延ビーム４０はベクトルＰ″と、ベクトルＳ″との和の方向を 有し、次の第２分割装置３８に入る。尚、ベクトルＰ″と、ベクトルＳ″との和 の大きさは、光学要素の損失を無視すると、ベクトルＳの１／√２に等しい。第 ２分割装置３８は遅延ビーム４０を偏光して三次ビーム４２と４４に分割する。 三次ビーム４２はベクトルＳ″方向に偏光され、三次ビーム４４はベクトルＰ″ 方向に偏光されている。そして、三次ビーム４４は、反射器４６で三次ビーム４ ２と平行なビーム４８にされる。 前述したようにベクトルＳと、ベクトルＰは大きさが等しいため最終のビーム ３６，３２，４２，４８のエネルギー密度の大きさは、総て等しい（ベクトルＰ の１／√２、ベクトルＳの１／√２）。[0008] Further, the phase delay device 24 disposed in the optical path of the secondary beam 20 described above The vector S direction of 20 is delayed by 45 degrees to form a delayed beam 40. This phase delay device The delayed beam 40 emerging from the station 24 follows the direction of the sum of the vector P'' and the vector S''. and enters the next second dividing device 38. Furthermore, the sum of vector P'' and vector S'' The magnitude of is equal to 1/√2 of the vector S, ignoring losses in the optical elements. No. Two-split device 38 polarizes delayed beam 40 and splits it into tertiary beams 42 and 44. Tertiary beam 42 is polarized in the direction of vector S'', and tertiary beam 44 is polarized in the direction of vector P'' polarized in the direction. Then, the tertiary beam 44 is converted into a tertiary beam 4 by a reflector 46. A beam 48 parallel to 2 is formed. As mentioned above, vector S and vector P have the same magnitude, so the final beam The energy densities of 36, 32, 42, and 48 are all equal (vector P 1/√2 of vector S, 1/√2 of vector S).
【０００９】 各ビーム３６，３２，４２，４８は、夫々四つのビーム集中組立体５２中の反 射器５０に入射してレンズ装置５４に向かい反射し、レンズ装置５４で基材の上 面に集中する作用ビーム３５，３３，４３，４９になる。[0009] Each beam 36, 32, 42, 48 is connected to one of the four beam concentrator assemblies 52, respectively. It enters the projector 50, is reflected toward the lens device 54, and is reflected onto the substrate by the lens device 54. This results in working beams 35, 33, 43, 49 concentrated on a plane.
【００１０】 基材５６は、上面に金属被膜６０が設けられた誘電材料の帯で、供給側ロール ７２から引き出され、アイドラ７４，７５を経てドラム７６の外周に巻き掛かり 、アイドラ８０，８１を経て巻取りロール７８に巻取られ、ドラム７６は矢印５ ８の方向に回転し、基材も同方向に移動する。0010 The substrate 56 is a strip of dielectric material with a metal coating 60 on its top surface, and is 72, passes through idlers 74 and 75, and wraps around the outer periphery of the drum 76. , through idlers 80 and 81, and is wound onto a winding roll 78, and the drum 76 is moved in the direction of arrow 5. 8, and the base material also moves in the same direction.
【００１１】 前記した四つのビーム集中体５２は、基材の、ドラム７６に巻き掛かった部分 に対し、基材の幅方向に異なった位置に向けて配置してある。従って、基材５６ がドラムの回転に伴って移動すると、各ビーム集中組立体５２からの作用ビーム ３５，３３，４３，４９によって金属被膜が除去されたほゞ同じ幅の、平行な筋 ６２，６４，６６，６８が形成されるのである。[0011] The four beam concentrators 52 described above are the portions of the base material wrapped around the drum 76. In contrast, they are arranged at different positions in the width direction of the base material. Therefore, the base material 56 moves with rotation of the drum, the working beam from each beam concentrator assembly 52 35, 33, 43, 49, parallel stripes of approximately the same width from which the metal coating was removed. 62, 64, 66, and 68 are formed.
【００１２】 光源装置１２から出て、作用ビーム３５，３３，４３，４９になるまで種々な 光学要素によってエネルギーは弱められるので、これを補うため光源装置１２に はビームエキスパンダー７０を設け、一次ビーム１４の径を拡大する。0012 Various beams are emitted from the light source device 12 until they become working beams 35, 33, 43, 49. Since the energy is weakened by the optical element, in order to compensate for this, the light source device 12 A beam expander 70 is provided to expand the diameter of the primary beam 14.
【００１３】 又、基材５６の上面に集中する作用ビーム３５，３３，４３，４９の形状を、 基材５６の移動方向に長軸がある楕円形にするため、各ビーム集中組立体５２中 のレンズ装置５４は、円柱レンズと、球面レンズの複合レンズになっている。こ れにより、作用ビーム３５，３３，４３，４９は基材の移動方向に長軸を有する 楕円形のパターンで移動する基材の上面の金属被膜を除去するので、除去長さが 長くなり、その分、基材の移動速度を早くすることができる。尚、各ビーム集中 組立体５２は、ドラム７６の軸方向に移動調節可能にし、基材に形成する平行な 筋の間隔を任意に調節できるようにする。[0013] Also, the shape of the action beams 35, 33, 43, 49 concentrated on the upper surface of the base material 56 is In order to create an elliptical shape with the long axis in the direction of movement of the substrate 56, The lens device 54 is a compound lens consisting of a cylindrical lens and a spherical lens. child As a result, the working beams 35, 33, 43, 49 have their long axes in the direction of movement of the substrate. The metal coating on the top surface of the substrate is removed in an oval pattern, so the removal length is The length increases, and the moving speed of the base material can be increased accordingly. In addition, each beam concentration The assembly 52 allows for adjustable axial movement of the drum 76 and forms parallel parallels to the substrate. Allows the spacing between muscles to be adjusted as desired.
【００１４】 又、各ビーム集中組立体には、作用ビームが基材の上面に突き当たる位置に隣 接した排気装置（図示せず）を設け、作用ビームが基材上面の金属被膜を除去す る際に発生する金属被膜の破片を吸引し、もうもうと立ちこめる破片で作用ビー ムが遮られたり、組立体中のレンズ装置５４に破片が付着するのを防止する。[0014] Each beam concentrator assembly also includes a An adjacent exhaust system (not shown) is provided so that the working beam removes the metal coating on the top surface of the substrate. The particles of the metal coating that are generated during the process are sucked up, and the working beam This prevents debris from being obstructed or attached to the lens assembly 54 in the assembly.
【００１５】[0015]
以上で明らかなように本考案によれば１つの光源からの一次ビームを強さが等 しい複数の作用ビームに分割し、この分割した複数の作用ビームで基材上の金属 被膜を、ほゞ同じ幅の、平行な複数の筋状に除去できる。そして、基材上に集中 する各作用ビームは、基材の移動方向に長軸を向けた楕円形であるため、基材の 移動方向の加工除去量は大きく、従って基材の移動速度を早めても除去が行なえ るので高能率に加工を行なうことができる。 As is clear from the above, according to the present invention, the primary beam from one light source has equal intensity. The metal on the substrate is divided into multiple working beams, and these divided working beams are used to The coating can be removed in parallel stripes of approximately the same width. Then concentrate on the base material Each working beam is elliptical with its long axis in the direction of substrate movement, so The amount removed by machining in the direction of movement is large, so removal cannot be achieved even if the movement speed of the base material is increased. This allows for highly efficient processing.
【図１】本考案の一実施例の概略の斜視図である。FIG. 1 is a schematic perspective view of an embodiment of the present invention.
【図２】図１の正面図である。FIG. 2 is a front view of FIG. 1.
１２ 光源装置 １４ 一次ビーム １６ 第１分割装置 １８ 二次ビーム ２０ 二次ビーム ２２ 位相遅延装置 ２４ 位相遅延装置 ２８ 第２分割装置 ３０ 三次ビーム ３２ 三次ビーム ３３ 作用ビーム ３５ 作用ビーム ３８ 第２分割装置 ４２ 三次ビーム ４３ 作用ビーム ４４ 三次ビーム ４９ 作用ビーム ５０ 反射器 ５２ ビーム集中組立体 ５４ レンズ装置 ５６ 基材 ６０ 金属被膜 ６２ 金属被膜を除去した筋 ６４ 金属被膜を除去した筋 ６６ 金属被膜を除去した筋 ６８ 金属被膜を除去した筋 ７６ 基材移動用のドラム 12 Light source device 14 Primary beam 16 First dividing device 18 Secondary beam 20 Secondary beam 22 Phase delay device 24 Phase delay device 28 Second dividing device 30 Tertiary beam 32 Tertiary beam 33 Action beam 35 Working beam 38 Second dividing device 42 Tertiary beam 43 Action beam 44 Tertiary beam 49 Action beam 50 reflector 52 Beam concentration assembly 54 Lens device 56 Base material 60 Metal coating 62 Stripes with metal coating removed 64 Stripes with metal coating removed 66 Stripes with metal coating removed 68 Stripes with metal coating removed 76 Drum for moving base material
───────────────────────────────────────────────────── フロントページの続き (72)考案者 ホワード アール． パツドジツト アメリカ合衆国 60068 イリノイ州 パ ーク リツジ バーノン アベニユウ 1040 (72)考案者 ヘンリー ジエー． フレアー アメリカ合衆国 60131 イリノイ州 フ ランクリン パーク サンセツト レン 3515 ──────────────────────────────────────────────── ─── Continuation of front page (72) Inventor: Howard R. Patsudojitsuto United States 60068 Illinois Pa Park Ritsuji Vernon Avenue 1040 (72) Inventor Henry J. flare United States 60131 Illinois F Ranklin Park Sunset Len 3515
Claims (1)
筋状に除去する金属被膜の光学式除去装置において、一
次ビームを発生する光源装置と、該一次ビームを拡大す
るエキスパンダーと、拡大した一次ビームを夫々エネル
ギーが等しい複数のビームに分割する分割装置と、前記
基材を移動させる装置と、移動する基材上の幅方向に異
なった位置に向かって設けられ、上記分割装置で分割さ
れたビームの各々を基材に集中して金属被膜を除去する
作用ビームにする複数のビーム集中組立体と、前記分割
装置で分割されたビームを各ビーム集中組立体に導入す
る反射器とを備え、上記各ビーム集中組立体に、基材上
に集中する作用ビームの形状を、長軸が基材の移動方向
に向いた楕円形にするレンズ装置を設けたことを特徴と
する金属被膜の光学式除去装置。1. An optical removal device for a metal coating that optically removes a metal coating provided on a substrate in the form of streaks, comprising: a light source device that generates a primary beam; an expander that expands the primary beam; a splitting device that splits the expanded primary beam into a plurality of beams each having equal energy; a device that moves the base material; and a splitting device that is provided toward different positions in the width direction on the moving base material; a plurality of beam concentrating assemblies that concentrate each of the split beams onto a substrate into a working beam for removing metal coatings; and a reflector that introduces the beam split by the splitting device into each beam concentrating assembly. , wherein each of the beam concentrating assemblies is provided with a lens device that makes the shape of the working beam concentrated on the substrate into an elliptical shape with the major axis oriented in the direction of movement of the substrate. optical removal device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/529,304 US4533813A (en) | 1983-09-06 | 1983-09-06 | Optical selective demetallization apparatus |
| US529304 | 1983-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04104286U true JPH04104286U (en) | 1992-09-08 |
Family
ID=24109350
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59168920A Pending JPS6061190A (en) | 1983-09-06 | 1984-08-14 | Optical type selective metallic film removing device |
| JP1991072171U Pending JPH04104286U (en) | 1983-09-06 | 1991-08-15 | Optical metal coating removal device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59168920A Pending JPS6061190A (en) | 1983-09-06 | 1984-08-14 | Optical type selective metallic film removing device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4533813A (en) |
| EP (1) | EP0136780B1 (en) |
| JP (2) | JPS6061190A (en) |
| CA (1) | CA1239668A (en) |
| DE (1) | DE3482246D1 (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0276078A1 (en) * | 1987-01-21 | 1988-07-27 | CMB Foodcan plc | Continuous seam welding |
| US4782208A (en) * | 1987-06-01 | 1988-11-01 | Withrow David A | Method and apparatus for slitting metal strips |
| DE69123937T2 (en) * | 1990-10-31 | 1997-07-31 | Dainippon Screen Mfg | Device for scanning an inner drum surface and associated scanning method |
| US5410123A (en) * | 1992-10-22 | 1995-04-25 | Rancourt; Yvon | Process and apparatus for welding annular bellows |
| US5055965A (en) * | 1990-12-26 | 1991-10-08 | Illinois Tool Works Inc. | Method and apparatus for making capacitive structure and laminate useful in making same |
| US5478983A (en) * | 1992-10-22 | 1995-12-26 | Rancourt; Yvon | Process and apparatus for welding or heat treating by laser |
| US6220878B1 (en) | 1995-10-04 | 2001-04-24 | Methode Electronics, Inc. | Optoelectronic module with grounding means |
| US5546281A (en) * | 1995-01-13 | 1996-08-13 | Methode Electronics, Inc. | Removable optoelectronic transceiver module with potting box |
| US5717533A (en) | 1995-01-13 | 1998-02-10 | Methode Electronics Inc. | Removable optoelectronic module |
| JP3159906B2 (en) * | 1995-10-23 | 2001-04-23 | アルプス電気株式会社 | Manufacturing method of liquid crystal display element |
| DE19634190C2 (en) * | 1996-08-23 | 2002-01-31 | Baasel Carl Lasertech | Multi-head laser engraving machine |
| US6059555A (en) * | 1996-09-04 | 2000-05-09 | International Business Machines Corporation | Optical apparatus for dual-beam laser texturing |
| US6179627B1 (en) | 1998-04-22 | 2001-01-30 | Stratos Lightwave, Inc. | High speed interface converter module |
| US6203333B1 (en) | 1998-04-22 | 2001-03-20 | Stratos Lightwave, Inc. | High speed interface converter module |
| US7090509B1 (en) | 1999-06-11 | 2006-08-15 | Stratos International, Inc. | Multi-port pluggable transceiver (MPPT) with multiple LC duplex optical receptacles |
| KR101407754B1 (en) * | 2005-10-26 | 2014-06-16 | 마이크로닉 마이데이터 아베 | Writing apparatuses and methods |
| US8122846B2 (en) * | 2005-10-26 | 2012-02-28 | Micronic Mydata AB | Platforms, apparatuses, systems and methods for processing and analyzing substrates |
| KR100654360B1 (en) * | 2005-10-27 | 2006-12-08 | 삼성전자주식회사 | Semiconductor integrated circuit device and fabrication method for the same |
| GB2437496A (en) * | 2006-04-28 | 2007-10-31 | Rolls Royce Plc | A laser shaping arrangement |
| WO2008014429A1 (en) * | 2006-07-28 | 2008-01-31 | Illinois Tool Works Inc. | Double layer capacitor using polymer electrolyte in multilayer construction |
| US20090266792A1 (en) * | 2008-04-24 | 2009-10-29 | Industrial Technology Research Institute | Fabrication methods for patterned structures |
| WO2014140047A2 (en) | 2013-03-12 | 2014-09-18 | Micronic Mydata AB | Method and device for writing photomasks with reduced mura errors |
| JP6453780B2 (en) | 2013-03-12 | 2019-01-16 | マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ | Method and apparatus for mechanically formed alignment reference body |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5373692A (en) * | 1976-12-13 | 1978-06-30 | Toshiba Corp | Laser processing device |
| JPS5794482A (en) * | 1980-12-05 | 1982-06-11 | Hitachi Ltd | Pattern forming device by laser |
| JPS57190794A (en) * | 1981-05-18 | 1982-11-24 | Toshiba Corp | Marking method by laser |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2976764A (en) * | 1958-12-04 | 1961-03-28 | American Optical Corp | Polarimeters |
| US3626141A (en) * | 1970-04-30 | 1971-12-07 | Quantronix Corp | Laser scribing apparatus |
| US3704997A (en) * | 1971-05-19 | 1972-12-05 | American Optical Corp | Variable amplitude polarizing beam splitter |
| US3778585A (en) * | 1972-04-21 | 1973-12-11 | Battelle Memorial Institute | Protection device for preventing damage to radiation source from backscatter |
| US3941973A (en) * | 1974-06-26 | 1976-03-02 | Raytheon Company | Laser material removal apparatus |
| US4015221A (en) * | 1975-01-22 | 1977-03-29 | Crosfield Electronics Limited | Preparation of gravure printing surfaces |
| US4081654A (en) * | 1976-12-27 | 1978-03-28 | Western Electric Co., Inc. | Methods and apparatus for selectively removing a metallic film from a metallized substrate |
| DE2853258A1 (en) * | 1978-12-09 | 1980-06-12 | Hoesch Werke Ag | METHOD AND ARRANGEMENT FOR APPLYING A MARKING ON THE SURFACE OF MOVING TABLES AND TAPES |
| LU80792A1 (en) * | 1979-01-15 | 1980-08-08 | Ntre De Rech Metallurg Ct Voor | DISPSITIVE AND METHOD FOR PERFORMING PERFORATIONS ON THE SURFACE OF ROLLING MILLS |
| DE3127213A1 (en) * | 1981-07-10 | 1983-01-27 | Hauni-Werke Körber & Co KG, 2050 Hamburg | DEVICE FOR PERFORATING A HELLOW MATERIAL STRIP FOR ARTICLES OF THE TOBACCO PROCESSING INDUSTRY |
| GB2074493B (en) * | 1980-04-25 | 1984-06-20 | Hauni Werke Koerber & Co Kg | Apparatus for perforating webs of wrapping material for tobacco or the like |
| CA1173123A (en) * | 1981-02-27 | 1984-08-21 | Charles C. Rayburn | Capacitor and method for making the same |
-
1983
- 1983-09-06 US US06/529,304 patent/US4533813A/en not_active Expired - Lifetime
-
1984
- 1984-06-14 CA CA000456600A patent/CA1239668A/en not_active Expired
- 1984-07-26 DE DE8484305105T patent/DE3482246D1/en not_active Expired - Fee Related
- 1984-07-26 EP EP84305105A patent/EP0136780B1/en not_active Expired
- 1984-08-14 JP JP59168920A patent/JPS6061190A/en active Pending
-
1991
- 1991-08-15 JP JP1991072171U patent/JPH04104286U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5373692A (en) * | 1976-12-13 | 1978-06-30 | Toshiba Corp | Laser processing device |
| JPS5794482A (en) * | 1980-12-05 | 1982-06-11 | Hitachi Ltd | Pattern forming device by laser |
| JPS57190794A (en) * | 1981-05-18 | 1982-11-24 | Toshiba Corp | Marking method by laser |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3482246D1 (en) | 1990-06-21 |
| EP0136780B1 (en) | 1990-05-16 |
| CA1239668A (en) | 1988-07-26 |
| EP0136780A2 (en) | 1985-04-10 |
| US4533813A (en) | 1985-08-06 |
| EP0136780A3 (en) | 1987-04-01 |
| JPS6061190A (en) | 1985-04-08 |
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