JPH04104118A - Solid-state image pickup element module for endoscope - Google Patents

Abstract

PURPOSE:To securely prevent a signal line from breaking and to obtain the solid-state image pickup element which has superior weather resistance by coating the connection part between a substrate and the signal line with hard resin and also coating other signal line parts with soft resin. CONSTITUTION:The connection part between the above circuit board 26 and signal 12 is coated with the hard resin to fix the connection part of the signal line, and the hard resin end surface and the signal part nearby the end surface which is not coated with the hard resin are covered with the soft resin. Thus, the signal line is fixed with the hard resin, so stress included in the signal line when the endoscope is in angle operation is not applied to the connection part of the signal line, but is applied to the signal part nearby the hard resin end surface, but this signal line part is coated with the soft resin, so the stress which is applied to the signal line part is dispersed and never concentrated on part of the signal line. The signal line is therefore prevented from breaking and the circuit board part is sealed with the hard resin to securely prevent water from entering the solid-state image pickup element.

Description

Detailed Description of the Invention [Object of the Invention] (Industrial Field of Application) The present invention relates to an endoscopy system that is provided in the distal end of an endoscope of an electronic endoscope device and captures an image using a solid-state imaging device such as a CCD. The present invention relates to a mirror solid-state image sensor module.

(Prior Art) Conventionally, as this type of solid-state image sensor module for an endoscope, there is one shown in FIG. 3, for example. In the figure 1
00 is a solid-state image sensor module, in which a solid-state image sensor 101 such as a CCD is attached to a chip carrier 102,
A bonding wire 103 connects the solid-state imaging device 1.1 to a wiring pattern (not shown) formed on a chip carrier 102. On the back side of the chip carrier 102 (the side opposite to the solid-state image sensor 101), a circuit board 104 on which a buffer amplifier and the like are provided is connected to the lead wire 10.
5.

These solid-state image sensors 101. The chip carrier 102 and the circuit board 104 are housed in an outer frame 106, and the optical glass 10 is bonded to the imaging surface of the solid-state imaging device 101.
7 is fixed to the outer frame 106. On the back surface of the circuit board 104 (the surface opposite to the chip carrier 102), signals are provided for transmitting and receiving signals between the solid-state image sensor 101 and the information processing section (not shown) of the electronic endoscope device. Line 108 is connected. Here, this solid-state image sensor module 1
00 is installed in the distal end of the endoscope insertion section, but when the angle section connected to the distal end is bent by the angle operation, the signal wire 108 is pulled and moves, causing the circuit board 104 to Stress is applied to the signal line at the connection part 110 to the signal line 108, and if the signal line at the connection part 110 is not fixed, there is a high possibility that the signal line 108 will break at the connection part. Therefore, in order to prevent wire breakage, the outer frame 10
A resin 111 is filled on the side of the circuit board 104 in the circuit board 6, and the connection portion 110 is covered with the resin 111, and the connection portion of the signal line 10g is fixed.

(Problem to be Solved by the Invention) However, in the above-mentioned prior art, if the resin 111 is hard such as epoxy resin, stress concentrates on the signal line portion near the end surface of the resin 111 during angle operation, and this There is a problem that wire breakage is likely to occur in some parts. On the other hand, if the resin 111 is a silicone-based soft resin, the signal wire of the connecting portion 110 is not completely fixed, so stress is applied to the connecting portion of the signal wire 108 during angle operation.
There is a problem that disconnection cannot be reliably prevented. Further, in this case, since the silicon-based resin passes water vapor, there is a high possibility that the solid-state image sensor 101 will be corroded by the water vapor, and there is also a problem that the environmental resistance is poor.

The present invention has been made to solve the problems of the prior art described above, and its purpose is to provide a solid-state image sensor module for endoscopes that reliably prevents signal line disconnection and has excellent environmental resistance. It is about providing.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention provides a circuit board to which the solid-state image sensor and the information processing device are electrically connected. In a solid-state image sensor module for an endoscope, the connection part between the circuit board and the signal line is covered with a hard resin, and the connection part of the circuit board and the signal line is covered with a hard resin to connect the signal. The signal line portion is fixed, and the hard resin end face and the signal line portion near the end face that is not covered with the hard resin are covered with a soft resin.

(Function) In the solid-state image sensor module for an endoscope according to the present invention having the above configuration, the signal line at the connection part is fixed with hard resin, so stress generated in the signal line when the endoscope is angled is does not join the connection part of the signal line,
The stress applied to the signal line near the hard resin end face is applied to the signal line, but since this signal line is covered with soft resin, the stress applied to this signal line is dispersed and stress does not concentrate on one part of the signal line. do not have. Therefore, if the signal line is prevented from being disconnected, and if the circuit board portion is sealed with a hard resin, it is possible to reliably prevent moisture from entering the solid-state image sensor.

(Example) Below, an example of the present invention will be described based on the drawings. 1st
The figure is a longitudinal sectional view showing the configuration of a solid-state image sensor module for an endoscope according to an embodiment of the present invention, and FIG. 2 schematically shows the structure of an electronic endoscope device equipped with the solid-state image sensor module. It is a block diagram.

In FIG. 2, an endoscope 1 is connected to an apparatus main body 2 as an information processing section, and a solid-state image sensor module 5 is installed in a rigid section 4 that is the distal end of an insertion section 3 that is introduced into a body cavity. has been done. The insertion section 3 is connected to a guiding tube (soft part) 6 made of a flexible tube body, an angle section 7 connected to the tip of the guiding tube 6 and provided so as to be bendable, and the tip of the angle section 7. An operating section 8 for performing scope operations such as angle operations is provided at the proximal end of the guiding tube 6.

The distal end surface of the rigid part 4 is provided with an illumination lens 9 for diffusing illumination light and an objective lens 1o into which illumination reflected light from the examination site in the body cavity enters, and the insertion part 3 and the operation part 8 Inside, a light ID 11 for sending illumination light into the body cavity and a signal line 12 for transmitting and receiving signals between the solid-state image sensor module 5 and the main body 2 of the apparatus are provided.

When observing the inside of a body cavity, the insertion section 3 is introduced into the body cavity, and the illumination light generated from the light source 13 installed in the device main body 2 is transmitted to the light guide 11. Irradiation is applied to the examination site within the body cavity through the illumination lens 9. The reflected illumination light is the objective lens 1.
0 to the solid-state image sensor module 5, and the optical image of the inspection site is converted into an electrical signal. This signal is signal line 1
2 into the device body 2, and the video processing circuit 14
After being converted into a video signal, it is sent to the television monitor 16 via the memory 15, and the surface condition of the inspection site is displayed as an image on the screen of the television monitor 16. In addition, the operation section 8
By operating (angle operation) the operating handle (not shown), the angle portion 7 can be curved and the distal end surface of the rigid portion 4 can be directed in a desired direction, thereby making it possible to observe a desired inspection site. can. Reference numeral 17 in FIG. 2 is a controller for controlling each part of the apparatus.

In the solid-state image sensor module 5, as shown in FIG. 1, a solid-state image sensor 20 such as a CCD is attached to a chip carrier 21 made of ceramic.
The side surface of 1 is fixed to the inner circumferential surface of a box-shaped outer frame 22.

The solid-state image sensor 20 is connected to a wiring pattern (not shown) formed on a chip carrier 21 by a bonding wire 23, and an optical glass 24 is bonded to the imaging surface of the solid-state image sensor 20. A window 25 for light incidence is formed on the light receiving side surface of the outer frame 22, and the optical glass 2
4 is fused or adhered to the peripheral portion of the window 2-5 of the outer frame 22.

On the back surface of the chip carrier 21 (the surface opposite to the solid-state image sensor 20), there is a circuit board 2 provided with a buffer amplifier, etc.
6 are connected by a wire 27, and the circuit board 26
The signal line 12 is connected to the back side (on the opposite side from the chip carrier 21). The solid-state image sensor 20 converts the optical image incident through the optical glass 24 into an electrical signal as an image information signal in accordance with a drive signal sent from the device main body 2 via the signal line 12, and converts this signal into an electrical signal as an image information signal.
The signal is sent to the video processing circuit 14 of the apparatus main body via the buffer amplifier and the signal line 12. The circuit board 26 side inside the outer frame 22 is filled with a hard resin 28 such as epoxy resin, and the connection part 30 between the circuit board 26 and the signal line 12 is covered with this resin 28, so that the connection part of the signal line 12 is Fixed.

Furthermore, a soft resin 29 such as a silicone resin is filled into the outer frame 22 from above the resin 28, and the signal line portion 1 not covered by the resin 28 near the end surface 28a and the end surface 28a of the resin 28 is filled.
2a is covered with this resin 29.

In this solid-state image sensor module 5, the signal line 12
Since the connecting portion is securely fixed by the hard resin 28 at the connecting portion 30, the stress generated in the signal line 12 during angle operation is not applied to the connecting portion of the signal line 12, and the signal near the hard resin end surface 28a is It is added to the line section 12. Since the signal line portion 12a is covered with a soft resin 29, it is not completely fixed, but the stress generated during angle operation is not concentrated on a portion of the signal line portion 12a but is dispersed. Therefore, the signal line 12 will not be disconnected at the connection portion 30 or the end face of the resin 28, 29, etc. Also,
Since the back surface of the chip carrier 21 is sealed with a hard resin 28, water vapor is reliably prevented from entering the solid-state image sensor 20, and the solid-state image sensor module 5 has excellent environmental resistance.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be implemented in various modifications.

[Effects of the Invention] The solid-state image sensor module for an endoscope according to the present invention has the above-described configuration and function, and can reliably prevent signal wire breakage during angle manipulation of the endoscope, and also prevent the solid-state image sensor module from Excellent environmental resistance can be obtained by preventing water vapor from entering the structure using a hard resin.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view showing the configuration of a solid-state image sensor module for an endoscope according to an embodiment of the present invention. FIG. The block diagram shown in FIG. 3 is a vertical cross-sectional view showing the configuration of a conventional solid-state imaging device module for an endoscope. 1... Endoscope 2... Device body (information processing section) 5.
...Solid-state image sensor module for endoscope 12...Signal line 20...Solid-state image sensor 26...Circuit board 28.
...Hard resin 28a...Hard resin end surface 29...
・Soft resin 30...Connection part

Claims (1)

[Scope of Claims] For an endoscope, a circuit board to which a solid-state image sensor is electrically connected is connected to a signal line for transmitting and receiving signals between the solid-state image sensor and an information processing section. In the solid-state image sensor module, a connection portion between the circuit board and the signal line is covered with a hard resin to fix the connection portion of the signal line, and an end surface of the hard resin and a portion near the end surface are covered with the hard resin. What is claimed is: 1. A solid-state image sensor module for an endoscope, characterized in that a signal line portion that is not present is covered with a soft resin.