JPH04357928A - Slid-state image pickup element module for endoscope - Google Patents

Abstract

PURPOSE:To shorten the tip part of an endoscope and to thin it diameter by bending a wiring board, arranging a solid-state image pickup element in the outside of an area surrounded by a bending part, and attaching circuit parts and a signal line to the board in the area surrounded by the bending part. CONSTITUTION:In a flexible printed circuit board (called as FPC) 13, both end parts in a transverse direction (the diameter direction of the tip hard part 1) are bent in a longitudinal direction and in the direction perpendicular to a center surface. Subsequently, the solid-state image pickup element 12 is arranged in the outside of an area 13A surrounded by the bending part of the FPC 13. Also, in the area 13A, circuit parts 14 such as a noise limiter capacitor for processing an electric signal fetched from the solid-state image pickup element 12, a buffer amplifier, and a buffer amplifier and a signal line between the solid-state image pickup element 12 and an endoscope device main body are soldered and attached, and the connecting part of the signal line 15 is subjected to bonding by a resin 16.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a flexible printed circuit board (hereinafter referred to as FPC) which is installed in the tip of an endoscope for observing the inside of a living body's body pores, and which is attached to a solid-state imaging device such as a CCD device.
This invention relates to a solid-state image sensor module for an endoscope, which is connected to a wiring board such as the following.

0002

2. Description of the Related Art Conventionally, as this type of solid-state image sensor module, there is one shown in FIG. 7, for example. In the figure, reference numeral 100 indicates a rigid tip section provided at the tip of the endoscope insertion section introduced into the body cavity, and a solid-state image sensor module 101 is installed inside the rigid tip section 100. . In this solid-state image sensor module 101, an FPC 103 is connected to a solid-state image sensor 102 such as a CCD that converts an optical image of an examination site within a body cavity into an electrical signal.

[0003] A solid-state image sensor 102 is mounted on the FPC 103.
A wiring pattern for extracting electrical signals from the solid-state image sensor 102 is printed, and circuit components 104 such as a noise limiter capacitor and a buffer amplifier for processing the electrical signals extracted from the solid-state image sensor 102 are attached. Also,
A signal line 105 is connected to the FPC 103 for transmitting and receiving signals between the solid-state image sensor 102 and the endoscope main body (not shown). And signal line 105
Resin 106 is potted at the connection portion of the signal line 105 of the FPC 103 in order to protect the FPC 103 and insulate it from the surroundings.

The rigid tip section 100 includes an objective optical system 107 that receives illumination reflected light from the inspection site and forms an optical image thereof, a prism 108 that sends this optical image to the solid-state image sensor 102, and the like. These internal organs of the endoscope are incorporated into the tip structure material 109 and housed in the tip cap 110 together with the tip structure material 109. An angle connection pipe 111 for connecting an endoscope angle section (not shown) and the rigid distal end section 100 is attached to the rear end of the distal end cap 110. The above solid-state image sensor 1
02 is glued to the light exit surface of the prism 108,
The back side of this solid-state image sensor 102 (opposite side to the light incidence surface)
The above FPC 103 is connected to.

FIG. 8 shows A in FIG. 7 of the rigid tip portion 100.
- A sectional view, FIG. 9 is B in FIG. 7 of the tip rigid part 100
-B sectional view. As shown in these figures, inside the tip cap 110 and the angle connection pipe 111, there are a light guide 112 for illuminating the examination site, an air channel 113 for supplying air and water into the body cavity, and a water supply. Channel 114, air supply nozzle 1 provided at its tip
13A, a water supply nozzle 114A, and a forceps channel 115 for inserting a treatment tool such as forceps into the body cavity.

In the solid-state image sensor module 101, in order to shorten the FPC 103 and shorten the rigid tip portion 100, the signal line 105 is connected to the surface (
The mounting surface of the circuit component 104) and the back surface thereof are connected separately. However, for this purpose, it is necessary to pot the resin 106 on both sides of the FPC 103, and this
The tip rigid portion 100 was enlarged in the radial direction due to the potting portion on the back side of the PC 103. Also, FPC
Since the resin 106 is also potted on the back side of the FPC 103, the FPC 103 is placed bent from the connection part with the solid-state image sensor 102 inside the rigid tip part 100, and a load is placed on the wiring pattern of the FPC 103. This can easily lead to disconnection or poor connections.

On the other hand, as disclosed in Japanese Patent Application Laid-Open No. 62-255913, it is possible to shorten the length of the rigid end portion by bending and mounting a wiring board such as an FPC so as to surround a solid-state image sensor. Proposed. However, in this case, the bent portion of the wiring board is placed around the solid-state image sensor, and the solid-state image sensor module becomes larger in its width direction (radial direction of the rigid tip), making it difficult to increase the diameter of the rigid tip. It had the disadvantage of inviting people.

[0008]

[Problems to be Solved by the Invention] By the way, if the rigid distal end of an endoscope is long, the rigid distal end will move in a large radius during angle operation, and this will cause the problem that the rigid distal end will come too close to the stomach wall when viewing the gastric angle from the front. arise. On the other hand, if the diameter of the rigid tip portion is large, there will be problems such as poor operability and great pain for the subject when the endoscope insertion portion is introduced into the body cavity. However, as mentioned above, in the case of the conventional technology,
It is difficult to miniaturize solid-state image sensor modules for endoscopes without any problems in both the width and length directions, and this is an obstacle to shortening and reducing the diameter of the rigid tip end of the endoscope. There was the issue of being present.

The present invention has been made to solve the problems of the prior art described above, and its purpose is to provide an endoscope that can shorten and reduce the diameter of the distal end of the endoscope. An object of the present invention is to provide a solid-state image sensor module for use in the present invention.

0010

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a solid-state imaging device that converts an optical image into an electrical signal, a wiring for extracting an electrical signal from the solid-state imaging device, and a wiring for extracting the electrical signal from the solid-state imaging device. A solid-state imaging device module for an endoscope, which includes a wiring board that is provided with circuit components for processing signals and to which a signal line that transmits an electric signal extracted from the solid-state imaging device in a predetermined direction is connected, wherein the wiring board is The solid-state imaging device is provided in a bent manner, and the solid-state image sensor is disposed outside a region surrounded by the bent portion, and the circuit components and signal lines are mounted on the wiring board within the region surrounded by the bent portion. shall be.

[0011]

[Operation] In the solid-state image sensor module for an endoscope according to the present invention having the above configuration, the wiring board is provided in a bent manner. The length of the wiring board can be shortened by bending the wiring board in this direction and using the bent portion as a mounting surface for circuit components and signal lines. That is, it is possible to shorten the length of this solid-state image sensor module.

On the other hand, since the solid-state image sensor is disposed outside the area surrounded by the bent portion, the wiring board surrounds the solid-state image sensor and reduces the width of the solid-state image sensor module (the radial size of the endoscope tip). ) will never get bigger. Also,
Since circuit components and signal lines are mounted on the wiring board within the area surrounded by this bent part, potting material for signal line protection and insulation is potted only within this area, and the back side of the wiring board (circuit components) is potted only within this area. (Side opposite to mounting surface)
will not be potted. Therefore, it is also possible to make the tip end of the endoscope that accommodates this solid-state image sensor module smaller in the radial direction.

As described above, the solid-state image sensor module of the present invention can be made small in both the length direction (longitudinal direction of the endoscope tip) and the width direction, and the solid-state image sensor module can be If it is provided within the distal end of the endoscope, the endoscope can be made shorter and smaller in diameter.

[0014]

[Embodiments] Examples of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a rigid tip end portion of an endoscope provided with a solid-state image sensor module for an endoscope according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the rigid tip end portion A-- A sectional view, FIG. 3 is a BB sectional view of the rigid tip portion in FIG. 1, and FIG. 4 is a CC sectional view of the rigid tip portion in FIG. 1. In these figures, 1 is an unillustrated subject (living body).
The rigid distal portion provided at the distal end of the endoscope insertion portion introduced into the body pore of the patient is shown.

Inside the rigid tip portion 1, there are a light guide 2 for irradiating illumination light onto a test site approximately inside the body cavity, and an objective for forming an optical image of the test site by making the illumination reflected light incident thereon. an optical system 3, a prism 4 that bends the traveling direction of light emitted from the objective optical system 3 in the perpendicular direction thereof, and an air supply channel for supplying air and water into the body cavity to clean the distal end surface of the objective optical system 3. 5. A water supply channel 6 and a forceps channel 7 for inserting a treatment instrument such as forceps into the body pore are incorporated into the tip structure member 8.

These internal organs of the endoscope are housed together with the tip structure member 8 in an annular tip cap 9, and the rear end of the tip cap 9 has a rigid tip portion 1 and an angle portion ( An angle connection tube 10 is attached for connecting to the main body (not shown). An air nozzle 5A and a water nozzle 6A attached to the tips of the air channel 5 and the water channel 6 are provided on the tip surface of the tip cap 9.
is provided.

A solid-state image sensor module 11 is installed inside the rigid tip portion 1 . The solid-state image sensor module 11 includes a solid-state image sensor 12 such as a CCD element that converts an optical image of an inspection site into an electrical signal, and an F as a wiring board that extracts electrical signals from the solid-state image sensor 12.
It is equipped with PC13. This solid-state image sensor 12 has its light incident surface bonded to the light exit surface of the prism 4, and the optical image of the inspection site formed by the objective optical system 3 enters the solid-state image sensor 12 through the prism 4. It is supposed to be done. The back surface (the surface opposite to the light incident surface) of the solid-state image sensor 12 is fixed to a ceramic substrate (not shown) and electrically connected to this substrate by wire bonding.

The FPC 13 is connected to the ceramic substrate, and as shown in FIG. 4, both ends of the FPC 13 in the width direction (radial direction of the rigid tip portion 1)
length direction (longitudinal direction of tip rigid part 1) and FPC13
It is bent in a direction perpendicular to the central plane of the The solid-state image sensor 12 is arranged outside the region 13A surrounded by this bent portion, and the FPC 13 within this region 13A
On the surface, circuit components 14 such as a noise limiter capacitor and a buffer amplifier for processing electrical signals extracted from the solid-state image sensor 12 are mounted, and the solid-state image sensor 1
A signal line 15 for transmitting and receiving signals between the endoscope 2 and the endoscope main body (not shown) is connected by soldering. In order to protect and insulate this signal line 15, resin 16
is potted at the connection portion of the signal line 15 in the region 13A.

In this embodiment, as described above, the FP
The length of the FPC 13 can be shortened by forming the FPC 13 in a three-dimensional manner by bending the C 13 and using the bent portion as a mounting surface for the circuit components 14 and the signal line 15. On the other hand, since the solid-state image sensor 12 is arranged outside the region 13A surrounded by this bent portion, the FPC 13
surrounds the solid-state image sensor 12 and solid-state image sensor module 1
The width of 1 never increases.

Furthermore, since the circuit components 14 and signal lines 15 are attached only to the surface of the FPC 13 within this area 13A, the resin 16 is filled only within this area 13A, and the FP
No resin is potted on the back surface of C13 (the surface opposite to the surface on which the circuit component 14 is mounted). Therefore, the tip hard part 1
The diameter can be reduced.

As described above, the solid-state image sensor module 1 of this embodiment can be made smaller in both the length direction (the longitudinal direction of the rigid tip portion 1) and the width direction (the radial direction of the rigid tip portion 1). This solid-state image sensor module 1
It is possible to shorten the length and reduce the diameter of the rigid tip portion 1 provided with the above. Further, in this embodiment, since the signal line 15 and the potting resin 16 are not provided on the back surface of the FPC 13, the FPC 13 is connected to the solid-state image sensor 1 within the rigid tip portion 1.
It will not be arranged in a bent state from the connection part with 2, and as a result, disconnection or poor connection will not occur. Furthermore, in this embodiment, the area 1 surrounded by the bent portion of the FPC 13 is
Since the circuit components 14 and signal lines 15 are housed within 3A,
Another effect is that this part can be easily insulated from the outside.

As described above, the solid-state image sensor module 11 of this embodiment can be downsized in both the length and width directions, so that the rigid tip portion 1 can be made shorter and thinner. diameter. As a result, the movement of the rigid distal end portion 1 during angle operation becomes small, and a good frontal view of the gastric angle can be achieved. Furthermore, it is possible to improve the operability when introducing the endoscope insertion portion including the rigid tip portion 1 into the body cavity, and to reduce the pain of the subject.

FIG. 5 is a sectional view showing a rigid tip end portion of an endoscope provided with a solid-state image sensor module for an endoscope according to another embodiment of the present invention, and FIG. 6 is a cross-sectional view showing the rigid tip portion D in FIG. 5. -D
FIG. In these figures, parts similar to those of the above embodiment shown in FIGS. 1 to 4 are designated by the same reference numerals, and explanations thereof will be omitted.

In the solid-state image sensor module 21 within the rigid tip portion 20, the FPC 23 connected to the back side of the solid-state image sensor 22 has a rectangular cross-sectional shape in a direction perpendicular to its length direction. It is bent. The solid-state image sensor 22 is arranged outside the region 23A surrounded by this bent portion, and includes a noise limiter capacitor,
A circuit component 24 such as a buffer amplifier and a signal line 25 are fixed on the inner peripheral surface of the FPC 23 within the region 23A. A resin 26 is potted at the connection portion of the signal line 25 in this region 23A. Since the other components are the same as those of the above embodiment shown in FIG. 1, their explanations will be omitted.

In this embodiment as well, the FPC 23 is bent in a direction perpendicular to its length direction and the FPC 23 portion is provided three-dimensionally, so that the solid-state image sensor module 21 in its length direction,
The rigid tip portion 20 is made smaller in both width directions.
can be made shorter and smaller in diameter. Therefore, this embodiment also provides the same effects as those of the above embodiment. Furthermore, in this embodiment, since the FPC 23 is bent into a rectangular shape, the area of the bent portion, that is, the area of the mounting portion of the circuit component 24 and the signal line 25 can be increased compared to the above embodiment. Therefore, F
By shortening the length of PC 23, it becomes possible to further shorten the rigid tip portion 20.

Although the embodiments of the present invention have been described above,
The present invention is not limited to this, and various modifications can be made. For example, in the above embodiment, the FPCs 13 and 23 are bent so that the bending angles are approximately right angles, but the FPC (wiring board) may be bent into a curved shape.

[0028]

[Effects of the Invention] The solid-state image sensor module for an endoscope according to the present invention has the above-described structure and function, and the solid-state image sensor module can be made smaller in both the length direction and the width direction. Therefore, by providing this solid-state image sensor module within the endoscope tip, it is possible to shorten the length and reduce the diameter of the endoscope tip. As a result, it becomes possible to improve the operability of the endoscope and reduce the pain of the subject.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a rigid distal end portion of an endoscope provided with a solid-state image sensor module for an endoscope according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA in FIG. 1 of the rigid tip end portion.

FIG. 3 is a sectional view taken along line BB in FIG. 1 of the rigid tip end portion.

FIG. 4 is a sectional view taken along line CC in FIG. 1 of the rigid tip end portion.

FIG. 5 is a cross-sectional view showing a rigid distal end portion of an endoscope provided with a solid-state image sensor module for an endoscope according to another embodiment of the present invention.

FIG. 6 is a sectional view taken along line DD in FIG. 5 of the rigid tip end portion.

FIG. 7 is a sectional view showing a rigid distal end portion of an endoscope provided with a conventional solid-state image sensor module for an endoscope.

8 is a sectional view taken along line AA in FIG. 7 of the rigid tip end portion.

9 is a sectional view taken along line BB in FIG. 7 of the rigid tip end portion.

[Explanation of symbols]

1 Rigid tip part 2 Light guide 3 Objective optical system 4 Prism 5 Air supply tube 6 Water supply tube 7 Forceps channel 11 Endoscope solid-state image sensor module 12 Solid-state image sensor 13 FPC (flexible printed circuit board, wiring board) 14 Circuit component 15 Signal line 16 resin

Claims (1)

[Claims] 1. A solid-state image sensor that converts an optical image into an electrical signal, a wiring that extracts an electrical signal from the solid-state image sensor, and a circuit component that processes the electrical signal, and an electric signal drawn from the solid-state image sensor. In a solid-state imaging device module for an endoscope, the wiring board is provided in a bent manner, and the solid-state imaging device is provided outside an area surrounded by the bent portion. A solid-state image sensor module for an endoscope, wherein an element is arranged, and the circuit component and the signal line are mounted on the wiring board within a region surrounded by the bent portion.