JPH0410333U - - Google Patents
Info
- Publication number
- JPH0410333U JPH0410333U JP5135890U JP5135890U JPH0410333U JP H0410333 U JPH0410333 U JP H0410333U JP 5135890 U JP5135890 U JP 5135890U JP 5135890 U JP5135890 U JP 5135890U JP H0410333 U JPH0410333 U JP H0410333U
- Authority
- JP
- Japan
- Prior art keywords
- susceptor
- cover
- cvd
- wafer
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Description
第１図は本考案カバーの実施例を用いたＣＶＤ
装置の構成を示す縦断面図、第２図及び第３図は
それぞれ本考案におけるリング状外周カバーとリ
ング状内周カバーの構成例を示す斜視図、第４図
は本考案カバーを用いた場合のサセプタ半径方向
の温度分布の時間経過を示す図、第５図は従来の
ＣＶＤ装置の構成を示す図、第６図は従来例によ
るサセプタ半径方向の温度分布の時間経過を示す
図である。
１……ワークコイル、２……サセプタ、３……
ウエーハ、４……ガスノズル、５……リング状外
周カバー、６……リング状内周カバー。
Figure 1 shows CVD using an embodiment of the cover of the present invention.
FIGS. 2 and 3 are longitudinal cross-sectional views showing the configuration of the device; FIGS. 2 and 3 are perspective views showing configuration examples of the ring-shaped outer circumferential cover and ring-shaped inner circumferential cover of the present invention, respectively; and FIG. 4 is a diagram showing the case where the present invention cover is used. FIG. 5 is a diagram showing the configuration of a conventional CVD apparatus, and FIG. 6 is a diagram showing the temperature distribution in the radial direction of a susceptor over time according to the conventional example. 1... Work coil, 2... Susceptor, 3...
Wafer, 4...Gas nozzle, 5...Ring-shaped outer periphery cover, 6...Ring-shaped inner periphery cover.
Claims (1)
タ２を高温に加熱してウエーハ３上にＣＶＤ膜を
生成するＣＶＤ装置において、サセプタ２の外周
、内周端部をそれぞれリング状外周、内周カバー
５，６で被うことを特徴とするＣＶＤ用サセプタ
カバー。 (2) サセプタカバー５，６の材質はＳｉＣ、Ｓ
ｉＣコート・カーボン、石英であることを特徴と
するＣＶＤ用サセプタカバー。[Claims for Utility Model Registration] (1) In a CVD apparatus that places a wafer 3 on a susceptor 2 and heats the susceptor 2 to a high temperature to generate a CVD film on the wafer 3, the outer circumference and inner circumference of the susceptor 2 A susceptor cover for CVD, which is covered with a ring-shaped outer circumference and an inner circumference cover 5 and 6, respectively. (2) The material of the susceptor covers 5 and 6 is SiC and S.
A CVD susceptor cover characterized by being made of iC coated carbon and quartz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5135890U JPH0410333U (en) | 1990-05-16 | 1990-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5135890U JPH0410333U (en) | 1990-05-16 | 1990-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410333U true JPH0410333U (en) | 1992-01-29 |
Family
ID=31570730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5135890U Pending JPH0410333U (en) | 1990-05-16 | 1990-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410333U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011077315A (en) * | 2009-09-30 | 2011-04-14 | Oki Electric Industry Co Ltd | Nitride thin-film depositing apparatus |
| JP4970683B2 (en) * | 2000-01-31 | 2012-07-11 | マットソン テクノロジー インコーポレイテッド | Apparatus and method for epitaxially treating a substrate |
| JP2016025309A (en) * | 2014-07-24 | 2016-02-08 | 株式会社ニューフレアテクノロジー | Deposition device, susceptor, and deposition method |
-
1990
- 1990-05-16 JP JP5135890U patent/JPH0410333U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4970683B2 (en) * | 2000-01-31 | 2012-07-11 | マットソン テクノロジー インコーポレイテッド | Apparatus and method for epitaxially treating a substrate |
| JP2011077315A (en) * | 2009-09-30 | 2011-04-14 | Oki Electric Industry Co Ltd | Nitride thin-film depositing apparatus |
| JP2016025309A (en) * | 2014-07-24 | 2016-02-08 | 株式会社ニューフレアテクノロジー | Deposition device, susceptor, and deposition method |