JPH0397992U - - Google Patents
Info
- Publication number
- JPH0397992U JPH0397992U JP1990007173U JP717390U JPH0397992U JP H0397992 U JPH0397992 U JP H0397992U JP 1990007173 U JP1990007173 U JP 1990007173U JP 717390 U JP717390 U JP 717390U JP H0397992 U JPH0397992 U JP H0397992U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- integrated circuit
- hybrid integrated
- motherboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａ，ｂ，ｃは本考案に係わる混成集積回
路基板の放熱板実装構造の実施例を示す断面図、
第２図は混成集積回路基板が搭載された放熱板が
マザーボードに実装された状態を示す斜視図、第
３図は従来の混成集積回路基板の放熱板実装構造
を示す断面図である。
２０……放熱板実装構造、２１……混成集積回
路基板、２５……放熱板、２６ａ，２６ｂ……取
付部、２７ａ，２７ｂ……曲部、２８……マザー
ボード、３０……非プレス面、３１……プレス面
。
1a, b, and c are cross-sectional views showing an embodiment of a heat sink mounting structure of a hybrid integrated circuit board according to the present invention;
FIG. 2 is a perspective view showing a state in which a heat sink on which a hybrid integrated circuit board is mounted is mounted on a motherboard, and FIG. 3 is a sectional view showing a conventional heat sink mounting structure for a hybrid integrated circuit board. 20... Heat sink mounting structure, 21... Hybrid integrated circuit board, 25... Heat sink, 26a, 26b... Mounting part, 27a, 27b... Curved part, 28... Motherboard, 30... Non-press surface, 31...Press surface.
Claims (1)
成された放熱板に、電子部品が実装された混成集
積回路基板が搭載されるとともに、該取付部によ
り前記放熱板がマザーボードへ実装されるように
構成された混成集積回路基板の放熱板実装構造に
おいて、前記放熱板のプレス面に混成集積回路基
板を搭載するとともに、放熱板の非プレス面にマ
ザーボードを密着実装するように構成したことを
特徴とする混成集積回路基板の放熱板実装構造。 A hybrid integrated circuit board on which electronic components are mounted is mounted on a heat sink in which a mounting portion to a motherboard is formed by press molding, and the heat sink is configured to be mounted on the motherboard by the mounting portion. A hybrid integrated circuit board mounting structure for a hybrid integrated circuit board, characterized in that the hybrid integrated circuit board is mounted on the pressed surface of the heat sink, and a motherboard is closely mounted on the non-pressed surface of the heat sink. Heat sink mounting structure of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990007173U JPH0397992U (en) | 1990-01-29 | 1990-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990007173U JPH0397992U (en) | 1990-01-29 | 1990-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397992U true JPH0397992U (en) | 1991-10-09 |
Family
ID=31510834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990007173U Pending JPH0397992U (en) | 1990-01-29 | 1990-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397992U (en) |
-
1990
- 1990-01-29 JP JP1990007173U patent/JPH0397992U/ja active Pending
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