JPH039619B2 - - Google Patents
Info
- Publication number
- JPH039619B2 JPH039619B2 JP60155383A JP15538385A JPH039619B2 JP H039619 B2 JPH039619 B2 JP H039619B2 JP 60155383 A JP60155383 A JP 60155383A JP 15538385 A JP15538385 A JP 15538385A JP H039619 B2 JPH039619 B2 JP H039619B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- air
- wire guide
- spool
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005611 electricity Effects 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60155383A JPS6216536A (ja) | 1985-07-15 | 1985-07-15 | ワイヤボンダ用スプ−ル機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60155383A JPS6216536A (ja) | 1985-07-15 | 1985-07-15 | ワイヤボンダ用スプ−ル機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6216536A JPS6216536A (ja) | 1987-01-24 |
| JPH039619B2 true JPH039619B2 (enrdf_load_stackoverflow) | 1991-02-08 |
Family
ID=15604745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60155383A Granted JPS6216536A (ja) | 1985-07-15 | 1985-07-15 | ワイヤボンダ用スプ−ル機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6216536A (enrdf_load_stackoverflow) |
-
1985
- 1985-07-15 JP JP60155383A patent/JPS6216536A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6216536A (ja) | 1987-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4600138A (en) | Bonding tool and clamp assembly and wire handling method | |
| US7628307B2 (en) | Apparatus for delivering shielding gas during wire bonding | |
| TW201132439A (en) | Automatic wire feeding system for wire bonders | |
| US7407079B2 (en) | Automated filament attachment system for vacuum fluorescent display | |
| US20170190002A1 (en) | Bonding Method and Bonding Device | |
| US20080210740A1 (en) | Low-profile capillary for wire bonding | |
| JPH039619B2 (enrdf_load_stackoverflow) | ||
| US6641025B2 (en) | Threading tool and method for bond wire capillary tubes | |
| JPH0225044A (ja) | ワイヤーボンダーの酸化防止システム | |
| US4172544A (en) | Wire tensioning and feeding device | |
| US6325269B1 (en) | Wire bonding capillary | |
| JPS61229776A (ja) | 細線の送給装置 | |
| JPS58218131A (ja) | ネイルヘツドワイヤボンダのワイヤ供給装置 | |
| JP2682146B2 (ja) | ワイヤボンディング方法 | |
| JPS6178131A (ja) | ワイヤボンデイング装置 | |
| JPS6366055B2 (enrdf_load_stackoverflow) | ||
| JPS5925232A (ja) | ワイヤボンディング装置 | |
| JPH0675739B2 (ja) | 極細線条体固定用チャック | |
| JPH0697213A (ja) | 工具の取付構造 | |
| JPH0310228B2 (enrdf_load_stackoverflow) | ||
| JPS6141231Y2 (enrdf_load_stackoverflow) | ||
| JPH02122639A (ja) | ワイヤーボンディング装置 | |
| US20020139830A1 (en) | Wire tensioning apparatus | |
| JP2894344B1 (ja) | ワイヤボンディング方法 | |
| JP2806711B2 (ja) | Ｉｃワイヤボンダ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |