JPH0394506A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To simplify the manufacture process of an electronic component and to reduce the cost by imparting a mold releasing agent in advance to a connection part of a ground terminal. CONSTITUTION:A mold releasing agent 36 is imparted to a projection 32 of a ground terminal 34. Then an insulation layer 38 is formed so as to cover part of a filter element 10, lead terminals 30a, 30b and the earth terminal 34 and to expose the projection 32. Then the mold releasing agent 36 imparted to the projection 32 is removed so as to expose the projection 32 externally. Then a conductive layer 40 made of a dip conductive resin such as an acrylic- copper group is coated from on the insulation layer 38. In this case, the projection 32 and the conductive layer 40 are connected electrically and the conductive layer 40 serves a shield function.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing electronic components, and particularly to a method for manufacturing electronic components such as piezoelectric filters.

[Prior art] For example, in a surface wave device, a device in which the ground terminal is connected to a conductive layer formed outside the resin sheath and further coated with an insulating sheath to improve frequency characteristics has been put into practice. It is disclosed in JP-A-63-138724.

[Problem to be solved by the invention]

In such electronic components, the process of shaping the resin casing so that the ground terminal is exposed outside the resin casing is extremely complicated. In other words, after shaping the resin sheath, it is necessary to remove the resin sheath located on the surface of the ground terminal and then form the conductive layer, but it is said that it is extremely difficult to remove the resin sheath once it has been shaped. There was a problem.

Therefore, the main object of the present invention is to provide a method of manufacturing an electronic component that can more easily manufacture an electronic component in which a ground terminal is connected to a conductive layer outside the resin sheath.

[Means to solve the problem]

The present invention provides a method for manufacturing an electronic component in which a resin sheath is applied over an element to which a ground terminal is connected, a conductive layer is further coated on top of the resin sheath, and the ground terminal is electrically connected to the conductive layer. This method of manufacturing an electronic part is characterized by applying a mold release agent to the connection part in advance and applying a resin sheath, and then removing the mold release agent and covering the conductive layer.

[Effect]

Apply a resin sheath over the element to which the ground terminal is connected.

At this time, since a mold release agent is applied to the connection part of the ground terminal, the resin sheath does not adhere to this connection part. Therefore, after that, the ground terminal is exposed outside the resin sheath simply by removing the mold release agent applied to the connecting portion of the ground terminal. Then, by covering the resin exterior with a conductive layer, the ground terminal and the conductor tN are electrically connected.

〔Effect of the invention〕

According to this invention, by applying a mold release agent to the connection part of the ground terminal in advance, this connection part can be easily exposed outside the resin casing. The terminal and the conductive layer can be easily connected.

Therefore, the manufacturing process of electronic components is simplified and costs can be reduced.

The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

Embodiment] With reference to FIG. IA and FIGS. 1B to 6, a method for manufacturing an electronic component according to this embodiment will be explained in sequence. In this embodiment, the electronic component will be described as a three-terminal piezoelectric filter.

First, as shown in FIG. 1A and FIG. IB, a filter element 10 is prepared. The filter element 10 includes a piezoelectric substrate 12 made of ceramic or the like, and a piezoelectric substrate l2
Two opposing vibrating electrodes 16 are formed on one principal surface of the electrodes 14a and 14b in the form of strips facing each other.

A capacitor electrode I8 is commonly connected to the two electrodes 14a. Further, a connection electrode 20 is connected to each of the two electrodes 14b. On the other hand, piezoelectric substrate l
On the other main surface of 2, two back electrodes 22 are formed at positions corresponding to the opposing vibrating electrodes 16, and a ground electrode 24 is formed at a position corresponding to the capacitor electrode 18. It is connected to two back electrodes 22 .

Note that such a three-terminal piezoelectric filter is well known and is not a main part of this invention, so further detailed explanation will be omitted. A lead frame 26 shown in FIG. 2 is connected to this filter element 10. Lead frame 26 is frame 2
8, the frame 28 is integrally formed in the vertical direction with an input lead terminal part 30a, an output lead terminal part 30b, and a ground terminal part 34 having a substantially L-shaped protrusion 32 at the tip thereof. It is formed as follows. Finally, the lead terminal parts 30a and 30b become lead terminals, and the ground terminal part 34 becomes a ground terminal.As shown in FIGS. 2 and 3, this lead frame 26 The tips are connected to the ground electrode 24, and the tips of the two lead terminal portions 30a and 30b are connected to the connection electrode 20, for example, by soldering. Then, a mold release agent 36 is applied to the protruding portion 32 of the ground terminal portion 34.

After that, the filter element 10 and the lead terminal portion 30a+30
An insulating layer 38 is formed, for example, by dipping with an insulating resin such as epoxy resin, so as to cover the insulating layer b and a part of the ground terminal portion 34, and to expose the protruding portion 32 to the outside. At this time, since the mold release agent 36 is applied to the protrusion 32, the resin does not adhere to that part.

Thereafter, the mold release agent 36 applied to the protrusion 32 is removed to expose the protrusion 32 to the outside, as shown in FIG.

Then, as shown in FIG. 5, a conductive layer 40 made of a dip-shaped conductive resin such as acrylic-copper type resin is coated over the insulating layer N38. At this time, the protrusion 32 and the conductive layer 40 are electrically connected, and the conductive layer 1i40 functions as a shield.

Note that the lead terminal portions 30a and 30 are connected via the conductive layer 40.
An insulating film or the like is formed on the outer surfaces of the lead terminal parts 30a and 30b in advance so that the conductive layer 40 is not electrically connected to the lead terminal parts 30a and 30b.
Make sure that they do not come in contact with each other.

Thereafter, as shown in FIG. 6, an insulating sheath 42 made of a dip-shaped insulating resin is formed on the conductive layer 40. Although not shown, the frame 2 of the lead frame 26
8, lead terminal parts 30a, 30b and ground terminal part 3
A three-terminal piezoelectric filter is completed by cutting the four terminals separately.

When manufacturing this three-terminal piezoelectric filter, the mold release agent 36 is applied to the protrusion 32 in advance, so even if the insulating layer 38 is formed on the filter element 10, the insulating layer 38
is repelled by the mold release agent 36, and the insulating layer 38 is not formed on the protrusion 32.

Therefore, the protrusions 32 can be easily exposed to the outside simply by removing the mold release agent 36, and electrical connection with the conductive layer 40 can be easily established.

Furthermore, in the above embodiments, a three-terminal piezoelectric filter was used as the electronic component, but the present invention is not limited to this, and the same applies to other electronic components such as surface wave devices using interdigital transducers. applicable.

[Brief explanation of drawings]

FIG. IA and FIG. IB to FIG. 6 are illustrative views showing one embodiment of the present invention in the order of steps, FIG. IA and FIG. IB are a plan view and a bottom view showing a filter element,
The figure is a perspective view showing the process of preparing the lead frame, FIG. 3 is a perspective view showing the process of connecting the lead frame to the filter element and applying a mold release agent, and FIG. 4 is a perspective view showing the process of forming the insulating layer. FIG. 5 is a perspective view showing a state in which a mold release agent has been removed; FIG. 5 is a perspective view showing a state in which a conductive layer has been formed;
The figure is a perspective view showing a state in which an insulating exterior is formed. In the figure, 10 is a filter element, 12 is a piezoelectric substrate, 2
4 is a ground electrode, 32 is a projection, 34 is a ground terminal,
36 is a mold release agent, 38 is an insulating layer, 40 is a conductive layer, and 42 is an insulating exterior.

Claims (1)

[Claims] A method for manufacturing an electronic component, in which a resin sheath is applied over an element to which a ground terminal is connected, a conductive layer is further coated on top of the resin sheath, and the ground terminal is electrically connected to the conductive layer. A method of manufacturing an electronic component, characterized in that a mold release agent is applied in advance to the connecting portion of the ground terminal to apply the resin sheathing, and then the mold release agent is removed to cover the conductive layer.