JPH0392055U - - Google Patents
Info
- Publication number
- JPH0392055U JPH0392055U JP1989153032U JP15303289U JPH0392055U JP H0392055 U JPH0392055 U JP H0392055U JP 1989153032 U JP1989153032 U JP 1989153032U JP 15303289 U JP15303289 U JP 15303289U JP H0392055 U JPH0392055 U JP H0392055U
- Authority
- JP
- Japan
- Prior art keywords
- rectifier circuit
- bridge type
- circuit device
- arms
- diodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000011084 recovery Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Rectifiers (AREA)
Description
第1図は本考案の実施例であつて、aは平面構
造図、bは側面構造図、cは内部結線図、第2図
は回路図、第3図は電圧・電流波形図、第4図は
整流電流波形図であり、1a,1b,1c,1d
は端子、2a,2bは接続子、3は封止用樹脂ケ
ース、D1,D2,D3,D4は半導体整流ダイ
オード、C1,C2,C3はコンデンサ、R1,
R2は抵抗、L1,L2はインダクタンス、a,
b,c,dは入出力端子、IRPは逆回路電流で
ある。
造図、bは側面構造図、cは内部結線図、第2図
は回路図、第3図は電圧・電流波形図、第4図は
整流電流波形図であり、1a,1b,1c,1d
は端子、2a,2bは接続子、3は封止用樹脂ケ
ース、D1,D2,D3,D4は半導体整流ダイ
オード、C1,C2,C3はコンデンサ、R1,
R2は抵抗、L1,L2はインダクタンス、a,
b,c,dは入出力端子、IRPは逆回路電流で
ある。
Claims (1)
- 半導体整流ダイオードにより構成されるブリツ
ジ型整流回路装置において、整流回路を構成する
各アームの内、整流動作時に順方向電流が同時に
流れる2アームの各整流ダイオードの一方を他方
に比して、逆回復時間の小なるものとしたことを
特長とするブリツジ型整流回路装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989153032U JPH0636591Y2 (ja) | 1989-12-29 | 1989-12-29 | ブリッジ型整流回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989153032U JPH0636591Y2 (ja) | 1989-12-29 | 1989-12-29 | ブリッジ型整流回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0392055U true JPH0392055U (ja) | 1991-09-19 |
JPH0636591Y2 JPH0636591Y2 (ja) | 1994-09-21 |
Family
ID=31699261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989153032U Expired - Lifetime JPH0636591Y2 (ja) | 1989-12-29 | 1989-12-29 | ブリッジ型整流回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0636591Y2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011048818A1 (ja) * | 2009-10-23 | 2011-04-28 | パナソニック株式会社 | 直流電源装置およびこれを用いた電動機駆動用インバータ装置 |
JP2011091947A (ja) * | 2009-10-23 | 2011-05-06 | Panasonic Corp | 直流電源装置 |
JP2011125102A (ja) * | 2009-12-09 | 2011-06-23 | Panasonic Corp | 電動機駆動用インバータ装置 |
-
1989
- 1989-12-29 JP JP1989153032U patent/JPH0636591Y2/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011048818A1 (ja) * | 2009-10-23 | 2011-04-28 | パナソニック株式会社 | 直流電源装置およびこれを用いた電動機駆動用インバータ装置 |
JP2011091947A (ja) * | 2009-10-23 | 2011-05-06 | Panasonic Corp | 直流電源装置 |
JP2011125102A (ja) * | 2009-12-09 | 2011-06-23 | Panasonic Corp | 電動機駆動用インバータ装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0636591Y2 (ja) | 1994-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |