JPH0392039U - - Google Patents
Info
- Publication number
- JPH0392039U JPH0392039U JP1989151702U JP15170289U JPH0392039U JP H0392039 U JPH0392039 U JP H0392039U JP 1989151702 U JP1989151702 U JP 1989151702U JP 15170289 U JP15170289 U JP 15170289U JP H0392039 U JPH0392039 U JP H0392039U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- sealant
- electrode
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989151702U JPH0392039U (enExample) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989151702U JPH0392039U (enExample) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392039U true JPH0392039U (enExample) | 1991-09-19 |
Family
ID=31697989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989151702U Pending JPH0392039U (enExample) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392039U (enExample) |
-
1989
- 1989-12-29 JP JP1989151702U patent/JPH0392039U/ja active Pending