JPH0392001A - Microwave integrated circuit - Google Patents

Abstract

PURPOSE:To eliminate the need for the soldering process between a microwave integrated circuit(MIC) substrate and a carrier by using the MIC board reinforced with other dielectric substance in advance and connecting the periphery of MIC patterns to ground with throughholes. CONSTITUTION:One MIC board 20 is formed by pressing and connecting a metallic foil 11, a 1st dielectric material (e.g. a 'Teflon(R)' glass substrate) 12, metallic foils 13, 15 forming a ground face of the MIC, and a dielectric material (e.g. glass epoxy resin substrate) 14 to reinforce the MIC. Plural MIC patterns 22 each comprising a microstrip circuit 21 formed on the metallic foil 11 are arranged to the substrate 12 and lots of throughholes 23 are provided around each MIC pattern 22 to make the metallic foils 11, 13, 15 conductive. Thus, both sides of the dielectric material 14 are equi-potential electrically to form a carrier. Thus, the soldering between the MIC board and the carrier is not required.

Description

DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION (Industrial Field of Application) The present invention relates to microwave integrated circuits, and more particularly to a structure with improved strength.

(Prior Art) Conventionally, microwave integrated circuits (hereinafter abbreviated as MIC) have generally been manufactured using an alumina substrate or a glass-based fluororesin steel-clad laminate (
A microstrip line is formed on a dielectric substrate using a Teflon glass substrate (hereinafter abbreviated as a Teflon glass substrate) or the like.

Among the above, the Teflon glass substrate itself is soft and thin, so the metal foil that forms the ground plane of the microstrip line is replaced with a plate-shaped metal plate (hereinafter referred to as a carrier) to reinforce the structure of the substrate. (abbreviated as )) is generally used by adhesively fixing it by soldering or the like. The above carrier not only reinforces the MIC. It acts as a ground plane for the MIC, and when converting the MIC into a coaxial circuit, etc., it also serves as a height adjustment to match the height of the microstrip line formed on the dielectric substrate and the coaxial inner conductor. It has become.

A conventional microwave integrated circuit in which a dielectric substrate on which a microstrip line is formed is fixed to a metal plate is shown in No. 5@. In the figure, reference numeral 101 denotes a Teflon glass substrate formed into a thin plate. A microstrip line 102 (only a part of which is shown) is formed on the surface of this Teflon glass substrate 101, and a ground plane of the microstrip line 102 is formed on the back side. A metal foil 103 made of steel or the like is formed on the entire surface to form an MI
It consists of CIQ4. Further, 105 is a carrier formed of a metal plate having strength for reinforcing the MIC 104, and the carrier 105 and the metal fil03 on the ground plane are soldered together (not shown) using solder cream, flow technique, etc. It is designed to be connected and fixed by. In addition, 106 is the above-mentioned MIC 104 and carrier 105
Mounting holes drilled at the four corners of the mounting holes 106 facing each other.
By soldering in accordance with the above MIC10
4 and the carrier 105 are positioned. Next, the manufacturing and assembly process of the above MIC will be explained. First, a carrier 105 is punched out by pressing or the like to have the same external dimensions as the MIC104, and Sn. Ni,
The entire surface of the carrier 105 is plated using a conductive material such as Au. On the other hand, microstrip lines 102 are patterned on one side of a Teflon glass substrate material (not shown) with copper coating on both sides using a well-known photographic technique, and a plurality of MICs 104 are formed on one Teflon glass substrate. Next, the Teflon glass substrate material is 104 in FIG.
Each sheet is cut out using a punching technique according to the size of the MIC shown in the figure, and fixed onto the carrier 105 by soldering or the like. In such a conventional manufacturing method, each IC is separated and then soldered onto the carrier 105.
Work efficiency is extremely poor. In addition, the old C
When they are soldered onto carriers 105 of the same external dimensions, they are bonded over a wide area, so air spaces may be formed in some areas during bonding, resulting in poor grounding. Furthermore, it has the disadvantage that variations in electrical characteristics are likely to occur, especially at high frequencies, due to misalignment between the carrier 105 and the MICl04. (Problem to be solved by the invention) As mentioned above, in the past, the MIC was separated into individual pieces.
Since the MIC 104 was fixed on the carrier 105 with adhesive, work efficiency was poor, air layers were partially formed on the adhesive surface, causing poor grounding, and misalignment between the carrier 105 and the MIC 104 caused each MIC 104 to However, each had drawbacks such as variations in electrical characteristics. The present invention was made to solve the above-mentioned drawbacks, and after forming an MIC using an MIC substrate material in which a dielectric material having strength for reinforcing the MIC104 is adhesively fixed to the ground plane of a Teflon glass substrate material. , the purpose is to provide a MIC that can be separated one by one. [Structure of the Invention] (Means for Solving the Problems) A microwave integrated circuit of the present invention includes a plate-shaped first dielectric body on which a main part of the microwave integrated circuit is formed, and a first dielectric body of the first dielectric body. a first metal foil on which a pattern of a microwave integrated circuit is formed in contact with a first main surface; and a first metal foil on a second main surface of the first dielectric;
a second metal foil that contacts at its main surface and forms a ground plane of the microwave integrated circuit; and a second dielectric that contacts the second main surface of the second metal foil at its first main surface and mechanically reinforces the first dielectric. The microwave integrated circuit is characterized by having a through hole for electrically connecting the body and each of the first to third metal foils provided around the microwave integrated circuit.

(Function) By having the above configuration, the present invention has the MIC connected to the first dielectric, whereas conventionally the MIC was soldered and fixed on the carrier after being separated one by one. By forming a plurality of microwave integrated circuits using the first metal foil and connecting the periphery of each MIC to the second and third metal foils through through holes, it is possible to form a ground plane.
Construction work efficiency has been greatly improved, and when soldering,
It is also possible to prevent the conventional drawbacks such as poor grounding due to air layers that occur in some areas. Furthermore, when dividing into individual MICs, it is now possible to improve the positional accuracy of each MIC. or. MI (1: FE on top
After connecting elements such as T diodes, resistors, and capacitors, it is possible to separate them into individual circuits, further improving manufacturing efficiency. (Example) Hereinafter, one example of the present invention will be described with reference to the drawings.

Figure 1 shows the MIC used to realize the MIC of the present invention.
FIG. 2 is a perspective view for explaining the structure of a substrate material.

That is, 11 is the first metal M (e.g. copper foil) that forms the MIC, l2 is the first dielectric material (e.g. Teflon glass substrate) that forms the MIC, and l3 is the metal foil (e.g. l4 is a dielectric material (e.g. glass epoxy resin board) that has the strength to reinforce the MIC, l5 is a metal foil (copper foil) that forms the ground plane, similar to 13.
For example, copper foil). These are crimped and connected using crimping technology to form one MIC board material. Next, a method for forming an MIC using the above-mentioned κIC substrate material will be described.

FIG. 2 shows an MIC circuit using the MIC substrate material 20 described in FIG. 1, which is an embodiment of the present invention. In the figure, a plurality of MIC patterns 22 (8 in the figure) are arranged vertically and horizontally on a Teflon glass substrate 12, each consisting of a microstrip circuit 21 (only a portion of which is shown) made of a first metal foil 11.
Further, a large number of through holes 23 are provided in the vertical and horizontal directions around each MIC pattern 22, and the through holes 23 are formed by a well-known metal plating technique to form each metal foil 11, 1.
3. Make 15 conductive. Therefore, both sides of the dielectric 14 have the same electrical potential, and have the same electrical structure as the conventional carrier 105. The number, size, pitch, and position of the through holes 23 at this time are determined by the NIC pattern and the frequency used. FIG. 3 is a perspective view showing a state in which one MIC pattern 22 is punched out and separated from FIG. 2. That is, punching is performed at the center of the through hole 23. If you punch out the center part, the punching area will be small, so it will be easier to punch out. The punched MIC patterns 22 can be arranged again in the state shown in FIG. 2 by a well-known extraction technique. and,
For each MIC pattern 22C, parts (not shown) such as FETs, resistors, and capacitors can be placed and soldered using a well-known automatic mounting device. After that, each MIC is separated again as shown in Figure 3.
Each pattern can include a complete list of MICs to which each component is connected.

FIG. 4 shows another embodiment of the present invention, in which the through hole 23 is located inside the punching position and cannot be seen from the side, but like FIG. 3, it satisfies the performance required for the present invention. ing. Note that 24 is a mounting hole for the MIC.

In the above embodiment, a Teflon glass substrate is used as the first dielectric 12 in which the MIC 22 is formed, and a glass dielectric substrate 14 is used as the second dielectric 14, but the present invention is not limited to this. There is no problem as long as the structure is such that the first and second dielectric substrates are electrically connected through a through hole.

Furthermore, since the present invention is achieved by making the two metal foils 13 and 15 forming the ground plane of the MIC the same potential, the third
The metal ill shown in Figures and Figure 4 may be omitted. In this case, the manufacturing method of the through hole is different, but the metal foil l
3 and 15 are the same in that they are connected through a through hole.

〔Effect of the invention〕

As described above, according to the present invention, conventionally, individual AIC patterns are separated from an AIC substrate and then soldered to a carrier. In order to strengthen the strength of the MIC, it is now possible to ground the MIC by using a material that has been reinforced with another dielectric material and connecting the periphery with a through hole, which reduces the solder connection process between the MIC board and the carrier. No longer needed.

Also, FETs are placed on many MIC patterns. This has the advantage that parts such as resistors can be connected at the same time, the work process is greatly shortened, and automatic assembly machines can be used.

Additionally, since there is no soldering connection process, it has excellent effects such as precision machining.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the structure of a substrate material for A-C used in the present invention, FIG. 2 is a perspective view showing a state in which a plurality of MIC patterns are formed according to an embodiment of the present invention, and FIG. The figure is the second
A perspective view showing a state in which one MIC pattern is punched and separated from a plurality of MIC patterns shown in the figure.
A perspective view showing other MIC patterns separated by punching from a plurality of MIC patterns shown in the figure, and Figure 5 shows individual MIC patterns.
1 is a perspective view showing a conventional MIC device that fixes a pattern to a carrier. 11,13. 15... Metal foil, 12, 14... Dielectric, 21... Microstrip line, 22...
MIC23...Through hole

Claims (1)

[Claims] a plate-shaped first dielectric on which a main part of a microwave integrated circuit is formed; a first metal foil in contact with a first main surface of the first dielectric and on which a pattern of a microwave integrated circuit is formed; 1
a second metal foil whose first principal surface is in contact with the second principal surface of the dielectric and forms a ground plane of the microwave integrated circuit; and a first dielectric foil whose first principal surface is in contact with the second principal surface of the second metal foil. A microwave integrated circuit comprising: a second dielectric for mechanically reinforcing the body; and a through hole provided around the microwave integrated circuit to electrically connect each of the first to third metal foils.