JPH0391293A - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JPH0391293A JPH0391293A JP1227716A JP22771689A JPH0391293A JP H0391293 A JPH0391293 A JP H0391293A JP 1227716 A JP1227716 A JP 1227716A JP 22771689 A JP22771689 A JP 22771689A JP H0391293 A JPH0391293 A JP H0391293A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- photo solder
- circuit
- photo
- conductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 238000013007 heat curing Methods 0.000 abstract description 3
- 238000001723 curing Methods 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract description 2
- 238000011282 treatment Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 3
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical class CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器等に使用されるプリント配線板の製
造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing printed wiring boards used in electronic equipment and the like.
従来の技術
従来、高密度のプリント配線板のンルダレジストの形成
方法は一般的に、フォト法による形成力２ベーノ
法で行われている。すなわち、第２図に示すように、絶
縁基板１上に導体回路２を形威し、その上に、フォトレ
ジスト３金塗布し、溶剤の一部を除去し乾燥被膜を形成
する（第２図ａ）。次に、マスクフィルム６を密着させ
紫外光４を照射して露光した後（第２図ｂ）、所定の現
像液で未露光部分を溶解除去する（第２図Ｃ）。そして
、残部の露光部のフォトレジスト膜の溶剤除去及び重合
硬化のため熱硬化を行う。BACKGROUND OF THE INVENTION Conventionally, a method for forming a resist for high-density printed wiring boards has generally been carried out by a two-bene process using a photo method. That is, as shown in Fig. 2, a conductive circuit 2 is formed on an insulating substrate 1, a photoresist 3 gold is applied thereon, and a part of the solvent is removed to form a dry film (Fig. 2). a). Next, the mask film 6 is brought into close contact and exposed to ultraviolet light 4 (FIG. 2B), after which the unexposed portions are dissolved and removed using a predetermined developer (FIG. 2C). Then, heat curing is performed to remove the solvent and polymerize and harden the photoresist film in the remaining exposed areas.
発明が解決しようとする課題
このようなプリント配線板の製造方法においては、露光
の際、マスクフィルムと絶縁基板との位置合わせが通常
片側０．０５〜Ｑ、１ ｍｍと極めて高い精度を要する
工程であシ、また、光の回シ込み及び解像性向上のため
、フィルムと基板とを密着させるのに、一般には真空吸
着を用いておジ、露光前のセツティングに３０〜６０秒
、真空密着に１０〜２０秒、露光に２０〜４０秒の時間
を要し、生産性を著しく悪くするものである。Problems to be Solved by the Invention In this method of manufacturing printed wiring boards, during exposure, alignment between the mask film and the insulating substrate is a process that requires extremely high precision, usually 0.05 to Q, 1 mm on one side. In addition, in order to improve light penetration and resolution, vacuum suction is generally used to bring the film and substrate into close contact. It takes 10 to 20 seconds for vacuum contact and 20 to 40 seconds for exposure, which significantly impairs productivity.
本発明は、これらの課題を解決するため、露光３ベーノ
゛
の際、マスクフィルムを必要とせず、マスクフィルムと
絶縁基板の位置合わせ、及び真空吸着を省略することに
よって、生産性、精度を飛躍的に向上させることを目的
としたものである。In order to solve these problems, the present invention dramatically improves productivity and accuracy by eliminating the need for a mask film, the alignment of the mask film and the insulating substrate, and the vacuum suction during the 3-vane exposure process. The purpose is to improve the
課題を解決するための手段
この課題を解決するために本発明は、導体回路を形成し
た絶縁基板上の一部又は全面にフォトソルダレジストを
塗布し、フォトソルダレジストの硬化に適する波長を有
する光線を絶縁基板端面より入射し、絶縁基板中より絶
縁基板表面へ伝わった光線で、表面のフォトソルダレジ
ストを硬化させ、導体回路上の未露光のフォトソルダレ
ジストを現像にて溶解・除去し、フォトソルダレジスト
膜を形成する方法とするものである。Means for Solving the Problem In order to solve this problem, the present invention applies a photo solder resist to a part or the entire surface of an insulating substrate on which a conductive circuit is formed, and then applies a light beam having a wavelength suitable for curing the photo solder resist. The light enters from the end face of the insulating substrate and is transmitted from inside the insulating substrate to the surface of the insulating substrate, hardening the photo solder resist on the surface, dissolving and removing the unexposed photo solder resist on the conductor circuit by developing, and This is a method for forming a solder resist film.
作用
この製造方法によれば、フォトソルダレジスト塗布面の
導体回路がマスクフィルムの遮光部の役目をなし、導体
回路のない部分のフォトソルダレジストを硬化させマス
クフィルムを用いず、しかも真空吸着、位置合わせ、も
することなく、高速で、高精度なソルダレジストヲ形成
することができる。Function: According to this manufacturing method, the conductor circuit on the surface coated with the photo solder resist serves as a light-shielding part of the mask film, and the photo solder resist in the area where there is no conductor circuit is cured, and no mask film is used. High-speed, high-precision solder resist can be formed without the need for alignment.
実施例
以下、本発明の一実施例を第１図ｈ −ｄの図面を用い
て説明する。EXAMPLE Hereinafter, an example of the present invention will be described using the drawings of FIGS. 1 h to d.
３６５ｎｍの波長の紫外線透過率が４０％〜６０％で、
かつ一定の厚みを保ったガラス−エポキシ基材（以下、
基材という）１１上に導体回路１２ｔ−形成する。その
基材１１の回路形ｒｆｃ面側に適正露光量ｓｏｏ 〜ｅ
ｏｏｍＪ／ｃＪ（塗膜厚：２０〜３０μｍ）で、しかも
、３６５ ｎｉｌの感光波長ピーク金有するフォトソル
ダレジスト１３ｆ：、塗布し、仮乾燥等の所定の処理を
行う（第１図ａ）。その後、４方向の基板端面から、３
６５ｎｍの波長を有する紫外線１４を入射し、基材１１
中を透過させ、表面のフォトソルダレジスト１３を光重
合により硬化させてフォトソルダレジスト１３を形ｇす
る（第１図ｂ）。この際、入射する露光量は基材１１の
紫外線透過率に応じて、フォトソルダレジスト１３の適
正露光量に達するように設定する。Ultraviolet transmittance of 365 nm wavelength is 40% to 60%,
A glass-epoxy base material (hereinafter referred to as
A conductor circuit 12t- is formed on the substrate 11 (referred to as a base material). Appropriate exposure amount soo to e on the circuit type RFC side of the base material 11
oomJ/cJ (coating film thickness: 20 to 30 μm) and a photo-solder resist 13f having a photosensitive wavelength peak of 365 nil is applied and predetermined treatments such as temporary drying are performed (FIG. 1a). Then, from the end face of the board in four directions, 3
Ultraviolet light 14 having a wavelength of 65 nm is incident on the base material 11.
The photo solder resist 13 on the surface is cured by photopolymerization to form the photo solder resist 13 (FIG. 1b). At this time, the amount of incident exposure light is set according to the ultraviolet transmittance of the base material 11 so as to reach the appropriate exposure amount of the photo solder resist 13.
６ページ
次に、硬化後の基板を所定の現像液（変性１−１−１ト
リクロロエタン）を有する現像槽にて、１．５〜２．６
ｋｇ／ｃｄのスプレー圧力で３０〜６０秒の条件で現像
する。このとき導体回路１２上のフォトソルダレジスト
１３は導体回路２に遮光されて未硬化となるため、現像
にて溶解・除去され、第１図Ｇに示したようなソルダレ
ジストの被膜を形成する。そして、露出した導体１２′
ヲ被覆するため、スクリーン印刷法を用いて、第１図ｄ
に示したような熱硬化型ソルダレジスト１６を形成し、
フォトソルダレジスト１３′とともに熱硬化を行う。Page 6 Next, the cured substrate was heated in a developer tank containing a specified developer (modified 1-1-1 trichloroethane) for 1.5 to 2.6 hours.
Develop at a spray pressure of kg/cd for 30 to 60 seconds. At this time, the photo solder resist 13 on the conductive circuit 12 is shielded from light by the conductive circuit 2 and becomes uncured, so it is dissolved and removed by development to form a solder resist film as shown in FIG. 1G. Then, the exposed conductor 12'
1d using a screen printing method to coat the
A thermosetting solder resist 16 as shown in is formed,
Heat curing is performed together with the photo solder resist 13'.
熱硬化型ソルダレジスト１５の形状においては、本発明
のフォトソルダレジスト１３によって、高密度部分の形
成が終了しているため、スクリーンと基板の合致精度は
、片側０．１６〜０．２５ｍｍ程度となり、一般のソル
ダレジストの印刷条件で容易に形成することができる。In the shape of the thermosetting solder resist 15, since the formation of the high-density portion is completed by the photo solder resist 13 of the present invention, the matching accuracy between the screen and the substrate is approximately 0.16 to 0.25 mm on one side. , can be easily formed under general solder resist printing conditions.
なか、本発明に使用するフォトソルダレジストは、従来
のものようも露光感度金高くしたものを用いることが望
ましく、また、基材の紫外線透過６ページ
率を高くすることによって一層生産性の向上を図ること
ができる。さらに、熱硬化型ソルダレジスト１６は、ス
クリーン印刷法の紫外線硬化型ソルダレジストに置き換
えることもできる。The photo solder resist used in the present invention is preferably one with higher exposure sensitivity than conventional ones, and productivity can be further improved by increasing the UV transmittance of the base material. can be achieved. Furthermore, the thermosetting solder resist 16 can be replaced with an ultraviolet curable solder resist using a screen printing method.
発明の効果
以上のように、本発明によれば、従来のフォト法による
プリント配線板のソルダレジストの形成で、マスクフィ
ルムや基板との位置合わせ金必要とせず、また接触露光
型における真空吸着も必要としないことから、生産性は
２倍以上向上させることができる。さらに、導体が露光
の際の遮光部を形成していることから、導体回路とソル
ダレジストの合わせズレは皆無となジ、極めて精度の高
いソルダレジストを容易に形成することができる。Effects of the Invention As described above, according to the present invention, a solder resist for a printed wiring board can be formed using the conventional photo method without requiring a mask film or an alignment metal with the substrate, and vacuum suction in a contact exposure type is also possible. Since this is not necessary, productivity can be more than doubled. Furthermore, since the conductor forms a light-shielding portion during exposure, there is no misalignment between the conductor circuit and the solder resist, and a solder resist with extremely high precision can be easily formed.
レジストの製造方法を示す断面図である。
１１・・・・・・ガラス−エポキシ基材、１２・・・・
・・導体回路、１３・・・・・・フォトソルダレジスト
、１４・・・・・・紫７７゜
外光、
６・・・・・・熱硬化型ソルダレジスト。FIG. 2 is a cross-sectional view showing a method for manufacturing a resist. 11...Glass-epoxy base material, 12...
...Conductor circuit, 13...Photo solder resist, 14...Purple 77° external light, 6...Thermosetting solder resist.
Claims (1)
又は全面にフォトソルダレジストを塗布し、フォトソル
ダレジストの硬化に適する波長を有する光線を絶縁基板
端面より入射し、絶縁基板中より絶縁基板表面へ伝わっ
た光線で、表面のフォトソルダレジストを硬化させ、導
体回路上の未露光のフォトソルダレジストを現像にて溶
解・除去してフォトソルダレジスト膜を形成するプリン
ト配線板の製造方法。A photo solder resist is applied to a part or the entire surface including the circuit on an insulating substrate on which a conductive circuit is formed, and a light beam having a wavelength suitable for curing the photo solder resist is incident from the end surface of the insulating substrate, and the insulating substrate is removed from inside the insulating substrate. A method for manufacturing printed wiring boards in which the photo solder resist on the surface is hardened by the light beam transmitted to the surface, and the unexposed photo solder resist on the conductor circuit is dissolved and removed by development to form a photo solder resist film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1227716A JP2687616B2 (en) | 1989-09-01 | 1989-09-01 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1227716A JP2687616B2 (en) | 1989-09-01 | 1989-09-01 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0391293A true JPH0391293A (en) | 1991-04-16 |
| JP2687616B2 JP2687616B2 (en) | 1997-12-08 |
Family
ID=16865234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1227716A Expired - Fee Related JP2687616B2 (en) | 1989-09-01 | 1989-09-01 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2687616B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246265A (en) * | 2015-11-06 | 2016-01-13 | 高德（江苏）电子科技有限公司 | Manufacturing method for rigid-flex board photosensitive film productive flexible board |
-
1989
- 1989-09-01 JP JP1227716A patent/JP2687616B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246265A (en) * | 2015-11-06 | 2016-01-13 | 高德（江苏）电子科技有限公司 | Manufacturing method for rigid-flex board photosensitive film productive flexible board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2687616B2 (en) | 1997-12-08 |
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