JPH0391219A - Manufacture of laminated ceramic electronic component - Google Patents
Manufacture of laminated ceramic electronic componentInfo
- Publication number
- JPH0391219A JPH0391219A JP1227715A JP22771589A JPH0391219A JP H0391219 A JPH0391219 A JP H0391219A JP 1227715 A JP1227715 A JP 1227715A JP 22771589 A JP22771589 A JP 22771589A JP H0391219 A JPH0391219 A JP H0391219A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- support
- laminated
- laminated layer
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000919 ceramic Substances 0.000 title claims description 18
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 12
- 238000000926 separation method Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は積層セラミック電子部品の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a multilayer ceramic electronic component.
従来の技術
近年、電子部品の分野において、回路の高密度化に伴い
積層セラミック部品も！すます微小化および高性能化が
望まれている。Conventional technology In recent years, in the field of electronic components, multilayer ceramic components are also being used as circuit density has increased! Further miniaturization and higher performance are desired.
これらの要望を満足すべく積層コンデンサ、積２べ
層バリスタ、積層圧電体、積層チップコイルなどの数多
くの積層と名のつくセラミック電子部品の開発が活発に
行われている。ここでは、積層セラミック電子部品の代
表として積層セラミックコンデンサを採ジ上げ、従来の
技術を述べることにする。In order to satisfy these demands, a large number of multilayer ceramic electronic components such as multilayer capacitors, multilayer varistors, multilayer piezoelectric bodies, and multilayer chip coils are being actively developed. Here, we will focus on multilayer ceramic capacitors as a representative example of multilayer ceramic electronic components, and discuss conventional techniques.
この積層セラミックコンデンサの製造は、一般には以下
のような方法で行われる。This multilayer ceramic capacitor is generally manufactured by the following method.
會ず、誘電体となる金属酸化物粉末と、有機バイングー
、可塑剤唄よび有機溶剤からなるスラリーを用いて、ド
クターブレード法などにようプラスチックフィルム上に
数十ミクロンの厚みのセラミックグリーンシートを作製
する。次に、このシートを所定の大きさに切□断した後
、電極をセラミックグリーンシート上に印刷し、この印
刷したセラミックグリーンシートを複数枚、積層支持体
上に積層圧着して積層成型体を得る。この成型体をチッ
プ状に切断し、積層支持体から分離した後、焼成の工程
を経て内部電極が交互に積層された焼結体が作製される
こととなる。最近、積層成型体３・・
をチップ状に切断後、成型体を積層支持体から容易に分
離するため、積層支持体と成型体の間に加熱すると発泡
するシートを挿入し、積層成型体をチップ状に切断した
後、加熱することによジンートを発泡させ、シートとチ
ップ状成型体の密着性を弱めて積層支持体からチップ状
の積層成型体を容易に分離することも提案されている（
特開昭６３−３０２０５号公報）。Using a slurry consisting of metal oxide powder as a dielectric, organic binder, plasticizer, and organic solvent, we fabricated a ceramic green sheet several tens of microns thick on a plastic film using the doctor blade method. do. Next, after cutting this sheet into a predetermined size, electrodes are printed on the ceramic green sheet, and a plurality of printed ceramic green sheets are laminated and pressure-bonded onto a laminated support to form a laminated molded body. obtain. After this molded body is cut into chips and separated from the laminated support, a sintered body in which internal electrodes are alternately laminated is produced through a firing process. Recently, after cutting the laminate molded body 3 into chips, in order to easily separate the molded body from the laminate support, a sheet that foams when heated is inserted between the laminate support and the molded body to separate the laminate molded body. It has also been proposed that after cutting into chips, the ZINTO is foamed by heating to weaken the adhesion between the sheet and the chip-like molded product, thereby easily separating the chip-like laminate molded product from the laminate support. (
(Japanese Unexamined Patent Publication No. 63-30205).
発明が解決しようとする課題
しかしながら、前記のような積層セラミックコンデンサ
の製造方法では、−度この発泡シートを利用すると、こ
のノートは再び発泡効果がなくなシ、繰り返しこの発泡
シートを使用することができないという課題を有してい
た。Problems to be Solved by the Invention However, in the method for manufacturing a multilayer ceramic capacitor as described above, once this foam sheet is used, the foaming effect is lost again, and the foam sheet cannot be used repeatedly. The problem was that it could not be done.
本発明は前記課題に鑑み、積層支持体とチップ状積層成
型体を加熱処理により容易に分離でき、かつ繰り返し使
用できるシートを用いることにより、製造コストを低減
できる積層セラミック電子部品の製造方法を提供しよう
とするものである。In view of the above-mentioned problems, the present invention provides a method for manufacturing a laminated ceramic electronic component that can easily separate the laminated support body and the chip-like laminated molded body by heat treatment, and can reduce manufacturing costs by using a sheet that can be used repeatedly. This is what I am trying to do.
課題を解決するための手段
前記課題を解決するために本発明の積層セラミック電子
部品の製造は、積層工程にかいて積層支持体面上に形状
記憶合金からなる分離シートを設けた後、前記分離シー
ト面上にセラミックグリーンシートを重ね合わせて積層
成型体を作製し、チップ状に切断後、加熱処理すること
にようチップ状成型体を前記積層支持体から分離する工
程を有するものである。Means for Solving the Problems In order to solve the above-mentioned problems, the manufacturing of the laminated ceramic electronic component of the present invention includes providing a separation sheet made of a shape memory alloy on the surface of the laminated support in the lamination process, and then disposing the separation sheet. This method includes the steps of producing a laminate molded body by overlapping ceramic green sheets on a surface, cutting it into chips, and then separating the chip-shaped molded body from the laminate support by heat treatment.
作用
本発明の分離シートは、従来の発泡シートとは異なう、
形状記憶合金からなるものを用いる。この分離シートは
、加熱すると波状となるよう、また冷却すると平面状シ
ートとなるように形状記憶処理させておき、積層使用時
には平面状態で使用し、積層支持体と積層成型体の間に
挿入する。そして、この分離シート面上に積層成型体を
作製し、チップ状に切断後、温度を上げるとシートは波
状となることによシチップ状成型体は容易に積層支持体
から分離できる。會た、このシートは再び冷却すると平
面状シートに戻るため、繰ジ返しの使６ 、
用が可能となる。Function: The separation sheet of the present invention is different from conventional foam sheets.
A material made of shape memory alloy is used. This separation sheet is subjected to shape memory treatment so that it becomes wavy when heated and becomes a flat sheet when cooled, and when used as a laminate, it is used in a flat state and inserted between the laminate support and the laminate molded body. . Then, a laminate molded product is produced on the surface of the separation sheet, and after cutting into chips, the sheet becomes wavy when the temperature is raised, so that the chip-shaped molded product can be easily separated from the laminate support. When the sheet is cooled again, it returns to a flat sheet and can be used repeatedly.
実施例
以下、本発明の一実施例を積層セラミック電子部品の代
表として積層セラミックコンデンサを採り上げ、詳細に
説明する。EXAMPLE Hereinafter, an example of the present invention will be described in detail by taking a multilayer ceramic capacitor as a representative multilayer ceramic electronic component.
１ず、形状記憶合金からなる分離シートとしては、チタ
ン−５０原子パ一セントニツケル合金を使用した。この
シートの形状記憶処理は第２図ａに示すような波状の形
にし、９００℃で３０分間真空中に保持して行った。そ
の後、トレーニング法により冷却すると第２図すに示す
平面状になるように処理を行った。なお、この分離シー
ト１の厚みは０．１ｍｍのものを使用した。First, a titanium-50 atom per cent nickel alloy was used as a separation sheet made of a shape memory alloy. The sheet was shaped into a wavy shape as shown in FIG. 2a and held in vacuum at 900° C. for 30 minutes. Thereafter, when it was cooled by a training method, it was processed to have a flat shape as shown in FIG. Note that the separation sheet 1 used had a thickness of 0.1 mm.
次に、積層に用いる誘電体グリーンシートは次のように
して作製した。１ず、チタン酸バリウムを主成分とする
セラミック粉体、バインダーとしてブチラール樹脂、可
塑剤としてフタル酸−ジ−ノルマルブチルを、酢酸ノル
マルブチルを溶剤として用いて混合し、粘度２００００
ｐＳのスラリを得る。このスラリーをドクターブレード
法によ６ベ
り、厚み５０ミクロンのポリエチレンテレフタレートフ
ィルム上に厚み４０ミクロンの誘電体層を形成し、その
後スクリーン印刷により前記誘電体層上にパラジウム電
極を形成し、誘電体グリーンシートを得た。そして、前
記誘電体グリーンシートを第１図に示すような積層方式
で積層成型体を作製した。すなわち、積層支持体２の上
に前記の形状記憶合金からなる分離シート１を置き、こ
の上に前記誘電体グリーンシート３をプレスを用いて圧
着することによう、３０層からなる積層成型体を作製し
た。このときの積層圧力はＳｏｏｋｇ／ｃｉである。な
お、第１図において、４は電極、５はプレス上盤、６は
プレス下盤である。その後、第３図のように積層成型体
７をチップ状に切断した。Next, dielectric green sheets used for lamination were produced as follows. 1. First, ceramic powder containing barium titanate as a main component, butyral resin as a binder, di-n-butyl phthalate as a plasticizer, and n-butyl acetate as a solvent are mixed to obtain a viscosity of 20,000.
Obtain a slurry of pS. A dielectric layer with a thickness of 40 microns was formed on a polyethylene terephthalate film with a thickness of 50 microns by applying this slurry six times using a doctor blade method, and then a palladium electrode was formed on the dielectric layer by screen printing. Got a green sheet. Then, a laminate molded body was produced using the dielectric green sheets in a laminate manner as shown in FIG. That is, the separation sheet 1 made of the shape memory alloy is placed on the laminate support 2, and the dielectric green sheet 3 is pressure-bonded thereon using a press to form a 30-layer laminate. Created. The lamination pressure at this time is Sookg/ci. In FIG. 1, 4 is an electrode, 5 is an upper press plate, and 6 is a lower press plate. Thereafter, the laminated molded body 7 was cut into chips as shown in FIG.
なお、８は切断線である。次に、この分離シート１ごと
積層成型体７を１００℃で１分間保持すると、第４図の
ように形状記憶合金からなる分離シート１は波状となう
、積層成型体７は積層支持体２から容易に分離できる。Note that 8 is a cutting line. Next, when the molded laminate 7 together with the separation sheet 1 is held at 100° C. for 1 minute, the molded laminate 7 becomes wavy as shown in FIG. can be easily separated from
そして、２５℃に冷却することにより、元の平坦シート
の形に戻る。以７・′・−７
後、このシートは繰り返し使用することができる。Then, by cooling to 25° C., it returns to its original flat sheet shape. After 7・′・−7, this sheet can be used repeatedly.
なか、本発明の形状記憶合金からなる分離シートはチタ
ンニッケル系の合金を使用したが、他にも銅系、鉄系の
形状記憶合金を使用しても同様の効果を得ることができ
る。Although titanium-nickel alloy is used for the separation sheet made of the shape memory alloy of the present invention, similar effects can be obtained by using other copper-based or iron-based shape memory alloys.
會た、本実施例では積層セラミックコンデンサを採シ上
げたが、積層バリスタ、積層圧電体、積層チップコイル
などの積層セラミック電子部品の製造に卦いても、全く
同様の効果が得られるのは言う會でもない。Although a multilayer ceramic capacitor was used in this example, the same effect can be obtained even when manufacturing multilayer ceramic electronic components such as multilayer varistors, multilayer piezoelectric bodies, and multilayer chip coils. Not even a meeting.
発明の効果
以上のように本発明の積層セラミック電子部品の製造方
法としては、積層成型体を積層支持体から分離するシー
トとして形状記憶合金シートを使用することによう、温
度処理だけで容易にチップ状積層成型体を積層支持体か
ら分離することができ、かつ分離後シートの再利用が可
能であることから、製造コストを著しく軽減することが
できる。Effects of the Invention As described above, the method for manufacturing a laminated ceramic electronic component of the present invention uses a shape memory alloy sheet as a sheet for separating the laminated molded body from the laminated support. Since the shaped laminate molded product can be separated from the laminate support and the sheet can be reused after separation, manufacturing costs can be significantly reduced.
第１図は本発明の分離シートを用いて積層セラミンクコ
ンデンサの積層を説明する図、第２図ａは本発明におい
て使用する形状記憶合金シートの加温時の形状を示す図
、第２図すは同シートの室温時での形状を示す図、第３
図は本発明において積層成型体を切断した様子を示す図
、第４図は同じく加熱処理して分離する様子を示した図
である。
１・・・・・・形状記憶合金からなる分離シート、２・
・・・・・積層支持体、３・・・・・・誘電体グリーン
シート（セラミックグリーンシート）、４・・・・・・
電極、７・・・・・・積層成型体。Figure 1 is a diagram illustrating the lamination of a multilayer ceramic capacitor using the separation sheet of the present invention, Figure 2a is a diagram showing the shape of the shape memory alloy sheet used in the present invention upon heating, Figure 2 Figure 3 shows the shape of the same sheet at room temperature.
The figure shows how the laminated molded body is cut in the present invention, and FIG. 4 is a diagram showing how it is separated by heat treatment. 1... Separation sheet made of shape memory alloy, 2.
... Laminated support, 3 ... Dielectric green sheet (ceramic green sheet), 4 ...
Electrode, 7...Laminated molded body.
Claims (1)
なる分離シートを設けた後、前記分離シート面上にセラ
ミックグリーンシートを重ね合わせ積層成型体を作製し
、チップ状に切断後、加熱処理することによりチップ状
成型体を前記積層支持体から分離する工程を有すること
を特徴とする積層セラミック電子部品の製造方法。In the lamination process, after providing a separation sheet made of a shape memory alloy on the surface of the laminated support, a ceramic green sheet is laminated on the surface of the separation sheet to produce a laminate molded body, which is cut into chips and then heat treated. A method for manufacturing a laminated ceramic electronic component, comprising the step of separating a chip-shaped molded body from the laminated support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1227715A JPH0391219A (en) | 1989-09-01 | 1989-09-01 | Manufacture of laminated ceramic electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1227715A JPH0391219A (en) | 1989-09-01 | 1989-09-01 | Manufacture of laminated ceramic electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0391219A true JPH0391219A (en) | 1991-04-16 |
Family
ID=16865219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1227715A Pending JPH0391219A (en) | 1989-09-01 | 1989-09-01 | Manufacture of laminated ceramic electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0391219A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2506487A (en) * | 2012-07-31 | 2014-04-02 | Porsche Ag | Removable roof and seal arrangement for a motor vehicle |
-
1989
- 1989-09-01 JP JP1227715A patent/JPH0391219A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2506487A (en) * | 2012-07-31 | 2014-04-02 | Porsche Ag | Removable roof and seal arrangement for a motor vehicle |
| GB2506487B (en) * | 2012-07-31 | 2014-12-10 | Porsche Ag | Removable roof for a motor vehicle, and motor vehicle |
| US8979183B2 (en) | 2012-07-31 | 2015-03-17 | Dr. Ing. H.C.F. Porsche Aktiengesellschaft | Removable roof for a motor vehicle, and motor vehicle |
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