JPH0390471U - - Google Patents
Info
- Publication number
- JPH0390471U JPH0390471U JP15106089U JP15106089U JPH0390471U JP H0390471 U JPH0390471 U JP H0390471U JP 15106089 U JP15106089 U JP 15106089U JP 15106089 U JP15106089 U JP 15106089U JP H0390471 U JPH0390471 U JP H0390471U
- Authority
- JP
- Japan
- Prior art keywords
- board
- soldering
- solder
- transported
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 230000004907 flux Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 3
- 238000003303 reheating Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15106089U JPH0390471U (enExample) | 1989-12-28 | 1989-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15106089U JPH0390471U (enExample) | 1989-12-28 | 1989-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390471U true JPH0390471U (enExample) | 1991-09-13 |
Family
ID=31697377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15106089U Pending JPH0390471U (enExample) | 1989-12-28 | 1989-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390471U (enExample) |
-
1989
- 1989-12-28 JP JP15106089U patent/JPH0390471U/ja active Pending
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