JPH0389600A - Chip parts mounting apparatus - Google Patents

Abstract

PURPOSE:To obtain a chip parts mounting apparatus having a ramming up mechanism which produces a smaller amount of bottom tape break dust and having a long-abrasion-life ramming up pin by installing a ramming up pin which rams up chip-shaped electronic parts from the supporting part of a tape- shaped supporter and has a hard alloy tip. CONSTITUTION:A vacuum nozzle 7 to take out chip-shaped electronic parts 5 by sucking is on the upper side of a container recess 1 to contain said chip- shaped electronic parts 5 and a ramming up pin 8 to ram up said chip-shaped electronic parts 5 is at the bottom side of said container recess 1. The tip of the pin is made of hard alloy especially hard and wear resistant among the tool materials and thereby a thinner needle-shaped tip hard to wear can be made, producing a smaller amount of broken dust.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a chip component mounting device that automatically mounts a chip-shaped electronic component supported by a tape-like support onto a printed circuit board, and particularly relates to a chip-shaped electronic component mounting device that automatically mounts a chip-shaped electronic component supported on a tape-like support onto a printed circuit board. The present invention relates to an improvement in a chip-shaped component pushing up mechanism that supplies the chip-shaped electronic component to a suction nozzle for taking out the chip-shaped electronic component from the tape-shaped support.

[Conventional technology]

Chip-type electronic components such as chip-type resistors and chip-type capacitors are encapsulated and supported in tape-shaped supports in the form shown in Figures 6 (a) and (b), and chip-type electronic components are Chip component mounting devices that receive a supply of components are well known. For example, there is a carrier tape 2 in which recesses 1 are provided at regular intervals, and a chip-shaped electronic component 5 is housed in the recesses 1 and sealed by pasting a bottom tape 4 on the bottom surface and a top tape 3 on the top surface.

For example, in the conventional chip component mounting apparatus known from Japanese Unexamined Patent Publication No. 62-165994, the first
As shown in FIG.
At the same time, the chip-shaped electronic component 5 is sucked by bringing the suction nozzle 7 close to it, and at the same time, the push-up pin 8 having a needle-like tip pierces the bottom tape 4 from the bottom side to remove the chip-shaped electronic component 5.
By pushing up the suction nozzle 7, it is suctioned and held at the end of the suction nozzle 7, and is mounted, for example, at a predetermined position on a printed circuit board.

However, if the chip-shaped electronic component 5 made of ceramic or the like is continuously pushed with the push-up pin 8 having the needle-shaped tip, the tip becomes deformed and crushed due to wear, as shown in FIG. come. Then, bottom tape 4
When tearing the bottom tape 4, the push-up pin 8 may pinch the bottom tape 4 and push it up, resulting in tearing debris 10. The size of this torn debris 10 is that the tip of the push-up pin 8 is crushed due to wear and its diameter is 0.0.
It has been found that when it is 8 mm or more, it becomes abnormally large and even the bottom tape 4 becomes fibrous. Such torn debris lO will adhere to the suction nozzle 7 together with the chip-shaped electronic component 5, and the adsorbed chip component shape recognition unit (not shown) may determine the shape of the chip to be defective or detect the chip. There have been cases where debris is attracted to the suction nozzle, resulting in poor suction and holding of chip-shaped electronic components, resulting in errors in the chip transfer process.

[Problem to be solved by the invention]

An object of the present invention is to solve the problems faced by conventional push-up mechanisms and to provide a chip component mounting device that reliably supplies chip-shaped electronic components to a suction nozzle.

[Means for solving problems]

For this reason, the present invention provides a chip component mounting apparatus having a mechanism for taking out a chip-shaped electronic component, which includes a push-up pin that pushes up the chip-shaped electronic component from the support portion of the tape-shaped support, and the tip part of the push-up pin is made of a material. is made of cemented carbide.

In the present invention, the tip of the push-up pin has a knife shape.

[Effect]

In the present invention, since the material of the tip of the push-up pin is made of cemented carbide, wear of the push-up pin is reduced, and tape tear debris from the bottom tape is less likely to occur.

In the present invention, the tip of the push-up pin has a knife shape, so that it not only pierces the bottom tape but also cuts it and tears it, which not only makes it difficult for tape torn from the bottom tape to occur. Furthermore, since the push-up contact portion with the chip-shaped electronic component has a larger area from the point to the line, wear of the tip portion is reduced.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1A and 1B are explanatory diagrams of the operation of the push-up pin and vacuum suction nozzle in the chip component mounting apparatus according to the embodiment of the present invention, and are cutaway side views of the mechanism for taking out the chip-shaped electronic component 5 from the tape-shaped support. It is shown by . Here, a vacuum suction nozzle 7 for taking out the chip-type electronic component 5 by suction is located on the upper surface side of the storage recess 1 that stores the chip-type electronic component 5, and a push-up pin that pushes up the chip-type electronic component 5 to the bottom surface of the storage recess 1. The configuration is such that there are 8.

The operation of taking out the chip type electronic component 5 with the above configuration will be explained.

As shown in FIG. 1(a), the vacuum suction nozzle 7 descends near the surface of the chip-shaped electronic component 5 in the storage recess 1 from which the top tape 3 has been peeled off and begins suction. At the same time, the push-up pin 8 also rises, breaks through the bottom tape 4 on the bottom surface, and comes into contact with the back surface of the chip-shaped electronic component 5. and,
As shown in FIG. 1(b), the chip-shaped electronic component 5 is pushed up until it is sucked and held by the vacuum suction nozzle 7. Thereafter, the suction nozzle 7 moves while holding the chip-shaped electronic component 5 at its tip and mounts it on a predetermined position on the printed circuit board. On the other hand, after the lifting process is completed, the push-up bottle descends to prepare for the next push-up operation of the recess.

In the case of the conventional needle-shaped push-up pin shown in Fig. 4, the action of the push-up pin breaking through the bottom tape is caused by
This is achieved by first making a small hole by piercing it with the tip, and then pushing the hole wider as the push-up bottle advances. The smaller the hole created by this piercing, the less likely it is that debris will occur. In the case of the present invention, the material of the tip is a cemented carbide, which has both hardness and wear resistance among tool materials. Therefore, since the needle-like tip can be made thinner, it is resistant to wear and tear and debris is less likely to occur.

Further, in the case of the present invention, as shown in FIG. 5, since the incision is made with the tip of a sharp knife, an incision can be obtained in which the fibers do not protrude, and the part of the tip that comes into contact with the chip component can be widened. Therefore, the wear rate is slow and the generation of debris is less likely to occur.

〔Effect of the invention〕

As described above, by implementing the present invention, it is possible to obtain a chimp component mounting device in which the occurrence of bottom tape tear debris due to the push-up mechanism is reduced, and the wear life of the push-up pin is long. In addition, by using this device, errors can occur in the shape recognition unit that recognizes whether a chip-shaped electronic component with a normal shape is suctioned and held in a normal posture by the suction nozzle, and torn pieces can be sucked into the suction nozzle. This reduces the number of cases in which the original chip adsorption cannot be achieved due to such a problem, and the mounting rate on the printed circuit board improves.

[Brief explanation of drawings]

Figures 1 (a) and (b) are diagrams explaining the operation of the push-up pin and vacuum suction nozzle according to the present invention, Figure 2 is a diagram explaining wear of the push-up pin, Figure 3 is a diagram explaining the operation of the knife push-up pin, and Figure 4 is a perspective view of the tip of the needle-shaped push-up bottle, No. 5
The figure is a perspective view of the knife push-up bottle, Figure 6 (a)
, (b) are a plan view and a sectional view showing a part of a tape-shaped support for a chip-shaped electronic component. 1... Storage recess, 5... Chip type electronic component, 7...
・Vacuum suction nozzle, 8.9... push-up bottle. (A) (B) An explanatory diagram of the operation of the push-up pin and vacuum suction nozzle according to the present invention. Fig. 1 Diagram of wear theory of the push-up pin and vacuum suction nozzle. Figure 2: First production of the knife push-up pin. Explanatory diagram Figure 3 Figure 4 Figure 5 (A) Plan view (B) A-Aim view of (A)

Claims (2)

[Claims] 1. A chip component mounting device having a mechanism for taking out a chip-shaped electronic component supported by a tape-shaped support, which includes a push-up pin that pushes up the chip-shaped electronic component from the support portion of the tape-shaped support, A chip component mounting device characterized in that the tip member is made of cemented carbide. 2. A chip component mounting device having a mechanism for taking out a chip-shaped electronic component supported by a tape-shaped support, which includes a push-up pin that pushes up the chip-shaped electronic component from the support portion of the tape-shaped support, A chip component mounting device characterized by a tip having a knife edge shape.