JPS61117886A - Carrying of tape part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method of adsorbing electronic components attached to a tape with a nozzle and mounting them on a substrate, and in particular, relates to a method for reliably attaching electronic components from an adhesive tape. Concerning a preferred method of peeling.

[Background of the invention]

As shown in FIG. 1, electronic components 3 that cannot generally be accommodated in a standard tape (8XX width tape) are pasted on a wide tape (for example, 12 inch width tape). That is, a tape 2 is wound around the reel 1, and an adhesive tape 5 is attached to the back surface of the tape 2. Further, the electronic component 3 is attached to an adhesive tape 5 marked with J. Here, FIG. 2 is a sectional view taken along the line AA in FIG. 1, and a hole is made in the tape 2 at the portion where the adhesive tape 5 is attached to the electronic component 3. Note that the hole 4 in Figures @1 and 2 is a feeding hole used when pitch feeding the tape.

A conventional example will be explained with reference to FIGS. 3 and 4. First, the configuration of the device will be described.

Reel 1 has base 6)1. It is supported so that it can freely rotate once around the bottle 7 as a fulcrum.

Ten protrusions are provided on the outer periphery of the ratchet wheel 9, and the holes 4 shown in FIG. 1 fit into the protrusions 10. An arm 11 is provided with the center of the ratchet wheel 9 as a fulcrum, and when this arm 11 is swung by a feed lever 8 with a bin 19 as a fulcrum, the electronic component 3 attached to the tape 2 is pitched. The prick bar 12 to be fed is a bar for peeling off the electronic component 3 from the adhesive tape 5, and is slidably supported by a guide 13. The push-up rod 12 has a compression spring 14.
Although it is always receiving downward force, the push-up rod 12 also moves up and down by pushing the button up and down the rod 15. The nozzle 16 is a nozzle for suctioning one component. On table 17,
A board 18 is set.

Next, let's talk about action nine. When the feed lever 8 is swung in the A direction, the electronic component 3 is pitch-fed toward the mouth. Next, by moving the rod 15 in the convex direction (the driving source is omitted), the push-up rod 12 is moved in the convex direction, and the electronic component 3
Bring it to the state shown in Figure @4. Almost simultaneously with the movement of the push-up rod 12 in the convex direction, the nozzle 16 descends in two directions.

After the nozzle 16 adsorbs the electronic component 3, the nozzle 16 is moved in the direction (G).

The electronic component 3 is mounted on the board 18 by moving in the direction A and the direction A and R, respectively. Meanwhile, during this time, the feed lever 8° rod 15 and the pusher rod 12 are moved in the small direction.

It moves in the direction to and the direction to ' to prepare for pitch feeding of the primary electronic component 3.

The conventional example described above has the following problems.

As shown in FIG. 4, when the push-up bar 12 breaks through the adhesive tape 5 and tries to peel off the electronic component 3 from the adhesive tape 5, the push-up bar 12 also lifts up the adhesive tape 5. I couldn't break through.

Therefore, even if the electronic component 3 stuck to the adhesive tape 5 is attracted by the nozzle 16 and the nozzle 16 is raised, the attraction force is weaker than the adhesive force, so the electronic component 3 cannot be peeled off from the adhesive tape 5. I couldn't do it. In order to increase the suction force, the nozzle diameter can be increased, but electronic components 3
On the other hand, if the adhesive force is reduced, there is a problem that the electronic component 3 may peel off from the adhesive tape 12 when the tape 2 wound around the reel 1 is fed in pitch.

A related known example is JP-A-57-188900 (electronic component assembly covering tape winding device).

[Purpose of the invention]

SUMMARY OF THE INVENTION It is an object of the present invention to overcome the drawbacks of the prior art and provide a method for reliably removing electronic components from adhesive tape.

[Summary of the invention]

The basic method for peeling off electronic components from adhesive tape is to use a push-up stick. however.

Conventionally, the tape would lift up, making it impossible to pierce the adhesive tape with the thorn bar. However, the present invention allows the adhesive tape to press around or part of the part before removing the part. The feature is that the part is peeled off from the adhesive tape by pressing the side to which the adhesive tape is attached.

[Embodiments of the invention]

An embodiment of the present invention will be described with reference to FIGS. 5 and 6.

The structure of the tape used is as shown in FIGS. 1 and 2. (Details will be omitted because the configuration is the same as that of the tape used in the conventional example.) First, the overall configuration will be explained with reference to FIGS. 5 and 6.

The reel 1 is supported on a base 6 so as to be able to rotate once around a bin 7 as a fulcrum. A protrusion 10 is provided on the outer periphery of the ratchet wheel 9, and a hole 4 shown in FIG. 741 fits into this protrusion 10. An arm 11 is provided with the center of the ratchet wheel 9 as a fulcrum, and by swinging this arm 11 by a feed lever 8 with a pin 19 as a fulcrum, the electronic component 3 attached to the tape 2 is sent in pitch. be done. The push-up rod 12 is slidably supported by a guide 13.

Although it receives a downward force from a compression spring, it can be moved up and down through the movement of the rod 15.

The tape presser 20 , which is slidably supported by the guide 11 , receives a downward force from a tension spring 24 .

There are 22 bins, and these pins 22 and 23
Because of this, the tape presser 2o remains at the position shown in FIG. The lever 23 is supported so as to be able to rotate once about the pin 25 as a fulcrum.

One end of the E-marked bar 230 is U-shaped and fits tightly into the pin 26 provided on the prick rod 12. FIG. 5 shows a state in which the tape presser 20 and the tape 2 are separated. That is, the lever 23.

By the compression spring 14, via the push-up rod 12,
On the other hand, the tension spring 24 receives a force in the direction R via the bottle 22, but since the force of the compression spring 14 is set larger than the force of the tension spring 24, the tape presser The tip of tape 20 is held above the edge of tape 2 to the extent that electronic component 3 can pass through. On the other hand, figure @6 shows the tape presser 20.
This is an enlarged view of the tip of the tape retainer 20.
is shown in a state where it has descended to the upper surface of the tape 2. As shown in FIG. 6, the tip of the tape holder 2o is.

A hole is provided so that the nozzle 16 and the electronic component 3 can pass through. Further, a substrate 18 is set on the table 17.

Next, the operation will be explained. When the feed lever 8 is swung in the A direction, the ratchet wheel 9 rotates by one pitch.
The electronic component 3 is pitch-fed toward the mouth. Then, when the rod 15 is moved in the direction C (the driving source is omitted), the rod 15
The upper end touches the lower end of the push-up rod 12, and the rod 1
By moving 5, the push-up rod 12 is raised in the direction C.

At this time, the lever 23 swings in the direction, and then the tape presser 20 descends toward the mouth. Here, the timing is set so that the push-up rod 12 hits the adhesive tape 5 and the electronic component 3 after the tape presser 20 holds the tape 2. Also, almost simultaneously with the movement of the push-up rod 12 in the C direction, the nozzle 16 descends in two directions.

Push-up rod 12. The nozzles 16 are in the C direction.

Figure wc6 shows the state in which the movement in two directions has been completed. Next, the nozzle 16 sequentially moves in the A direction, the A direction, and the A direction to mount the board 18 (the electronic component 3). Width direction.

It moves in the forward direction, forward direction, and force direction to return to the state of pitch-feeding the next electronic component 3.

According to the embodiment of the present invention, the following first-order effects can be obtained.

1. As shown in Fig. 6, the tape is pressed down with a button and a tape presser, and then the push-up rod is used to break through the adhesive tape, so electronic components can be reliably peeled off from the adhesive tape.

〔Effect of the invention〕

According to the present invention, the tape around the electronic component is held down by the tape presser, and the push-up rod pierces the adhesive tape, so that the electronic component can be reliably peeled off from the adhesive tape. Therefore, the nozzle can pick up electronic components without mistakes.
Improves installation reliability.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the state in which the tape is wound on a reel;
@Figure 2 is a sectional view taken along the line A-A in Figure 1, Figure 3 is a front view showing the conventional example, Figure 4 is a partially enlarged view showing the conventional state in which electronic components are pushed up with a push-up rod, and Figure 5. 6 is a front view showing an embodiment of the present invention, and FIG. 6 is a partially enlarged view showing a state in which an electronic component is peeled off from an adhesive tape with a prick in the embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Reel, 2... Tape 3... Electronic component, 5... Adhesive tape 8... Feed lever 9... Ratchet wheel 10... Protrusion, 11... Arm 12...・Punching bar, 13...Guide 14...Spring, 15...Rod 16...Nozzle,
17... Table 18... Board, 20... Tape holder 24... Spring.

Claims (1)

[Claims] 1. In the method of mounting a component attached to an adhesive tape on a board, press the periphery or part of the component attached to the adhesive tape, and then press the side of the component attached to the adhesive tape. A method for mounting tape parts, characterized by peeling off the parts from the adhesive tape by pressing the surface.