JPH0388780A - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPH0388780A JPH0388780A JP22539289A JP22539289A JPH0388780A JP H0388780 A JPH0388780 A JP H0388780A JP 22539289 A JP22539289 A JP 22539289A JP 22539289 A JP22539289 A JP 22539289A JP H0388780 A JPH0388780 A JP H0388780A
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- material layer
- metal
- brazing
- average thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 21
- 239000000463 material Substances 0.000 claims abstract description 70
- 238000005219 brazing Methods 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 239000010409 thin film Substances 0.000 claims abstract description 8
- 238000005304 joining Methods 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 230000008018 melting Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 238000007711 solidification Methods 0.000 description 7
- 230000008023 solidification Effects 0.000 description 7
- 230000006378 damage Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 239000012300 argon atmosphere Substances 0.000 description 5
- -1 argon ion Chemical class 0.000 description 5
- 230000008014 freezing Effects 0.000 description 5
- 238000007710 freezing Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- 229910001007 Tl alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、セラミックスと金属の接合方法に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a method for joining ceramics and metal.
（従来の技術）
材料の接合方法には、固相接合、融接、焼きばめ、ろう
付は等の種々の方法が知られている。(Prior Art) Various methods are known for joining materials, such as solid phase joining, fusion welding, shrink fitting, and brazing.
このうち、ろう付は方法は接合面にろう材層を形成、し
、該ろう材層を溶融させて材料同志を接合させるもので
ある。特に、セラミックスと金属の接合に有効な活性金
属法も前記ろう付は法の一つである。活性金属法は、Ｔ
ｉｓ Ｚ ｒ ｓ Ｈｆなどの酸素又は窒素等と非常
に活性である元素を含有するろう材を使用し、Ｔｉ、Ｚ
ｒ、Ｈｆなどのセラミックス表面への活性作用を利用し
て材料同志を接合させる方法で、電子デバイスから構造
材料まで幅広く利用されている。Among these methods, brazing is a method in which a layer of brazing material is formed on the joint surface, and the layer of brazing material is melted to join the materials together. In particular, brazing is one of the active metal methods that are effective for joining ceramics and metals. The active metal method is T
Using a brazing filler metal containing elements that are highly active with oxygen or nitrogen, such as
It is a method of bonding materials together using the active effects of r, Hf, etc. on the surface of ceramics, and is widely used in everything from electronic devices to structural materials.
ところで、従来の活性金属法を含むろう付は方法は箔又
はペースト状のろう材を接合部に挿入して真空又は不活
性雰囲気中で加熱して接合するものである。しかしなが
ら、かかる箔又はペースト状のろう材を用いる方法では
セラミックスと金属のように異種材料を接合させる場合
、ろう材の溶融の際に生じる熱膨張によって接合部に応
力が残留し、該残留応力によって接合部材が破壊される
という問題があった。前記残留応力は、接合温度が高い
程、接合後の冷却過程でのろう材の凝固温度高い程、大
きくなり、接合部材の破壊がより起こり易くする。特に
、ろう材の凝固時に異種部材間の接合がなされるため、
凝固温度が残留応力の大小に及ぼす影響は極めて大きく
なる。By the way, the conventional brazing method including the active metal method involves inserting a foil or paste-like brazing material into the joint part and heating it in a vacuum or an inert atmosphere to join the parts. However, when using such foil or paste brazing filler metals to join dissimilar materials such as ceramics and metals, stress remains in the joint due to thermal expansion that occurs when the brazing filler metal melts, and this residual stress causes There was a problem that the joining member was destroyed. The higher the bonding temperature and the higher the solidification temperature of the brazing filler metal during the cooling process after bonding, the greater the residual stress becomes, making it more likely that the bonded member will break. In particular, since the joining between dissimilar parts is done when the brazing filler metal solidifies,
The effect of solidification temperature on the magnitude of residual stress is extremely large.
（発明が解決しようとする課題）
本発明は、上記従来の課題を解決するためになされたも
ので、セラミックス、金属からなる部材間の接合に際し
て接合温度及び冷却過程での凝固温度を低減して部材間
に生じる残留応力を抑制した接合方法を提供しようとす
るものである。(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned conventional problems, and it reduces the joining temperature and solidification temperature during the cooling process when joining members made of ceramics and metals. The present invention aims to provide a joining method that suppresses residual stress generated between members.
［発明の構成］
（課題を解決するための手段）
本発明は、セラミックス又は金属からなる一方の部材の
接合面に平均厚さ１０００Å以下のろう材層又は平均厚
さ１０００Å以下の金属薄膜を複数積層したろう材層を
形成し、このろう材層に前記部材と異なる金属又はセラ
ミックスからなる他方の部材を当接させた後、加熱して
前記ろう材層を溶融、接合することを特徴とする接合方
法である。[Structure of the Invention] (Means for Solving the Problems) The present invention provides a plurality of brazing filler metal layers with an average thickness of 1000 Å or less or a plurality of metal thin films with an average thickness of 1000 Å or less on the joint surface of one member made of ceramic or metal. It is characterized by forming a laminated brazing material layer, bringing another member made of a metal or ceramic different from the above member into contact with the brazing material layer, and then heating to melt and join the brazing material layer. This is a joining method.
上記セラミックスとしては、例えばアルミナ、ジルコニ
アなどの酸化物系セラミックス、窒化アルミニウム、窒
化ケイ素、窒化硼素などの窒化物系セラミックス、炭化
ケイ素等の炭化物系セラミックスを挙げることができる
。Examples of the ceramics include oxide ceramics such as alumina and zirconia, nitride ceramics such as aluminum nitride, silicon nitride, and boron nitride, and carbide ceramics such as silicon carbide.
上記金属としては、種々の金属、合金を用いることがで
き、例えばＣｕ ＳＦ ｅ ｓ Ｎ ｌ ％ Ｃｏ ｓ
Ｍｏ、’ｆＢ等を挙げることができる。Various metals and alloys can be used as the above-mentioned metal, for example, Cu SF e s N l % Co s
Mo, 'fB, etc. can be mentioned.
上記単一のろう材層こしては、例えばＴｉ−Ｃｕ合金、
Ｚｒ−Ｃｕ合金又はＣｕ単体等を挙げることができる。The single brazing material layer may be made of, for example, a Ti-Cu alloy,
Examples include a Zr-Cu alloy or Cu alone.
かかるろう材層の平均厚さを限定した理由は、その平均
厚さが１０００人を越えると接合温度及び凝固温度の低
減化を達成できないからである。より好ましいろう材層
の平均厚さは、５Ｇ−１０００大の範囲である。The reason why the average thickness of the brazing material layer is limited is that if the average thickness exceeds 1,000 layers, it will not be possible to reduce the bonding temperature and solidification temperature. A more preferable average thickness of the brazing material layer is in the range of 5G-1000.
上記金属薄膜を複数積層したろう材層としては、例えば
Ｔ ｉ ／ Ｐ ｂ 、 Ｚ ｒ ／ Ｐ ｂ ％Ｔ
ｊ ／ Ｂ ｉ、Ｚ ｒ ／ Ｂ ｆ 、 Ｔ
ｉ ／ Ｓ ｎ ｓ Ｚ ｒ ／ Ｓ
ｎ 、 Ｔ ｉ ／（：ｕ、Ｚｒ／Ｃｕの二層積層
物等を挙げることができる。かかるろう材層を構成する
金属薄膜の平均厚さを限定した理由は、その平均厚さが
Ｌ０００λを越えると接合温度及び凝固温度の低減化を
達成できないからである。より好ましい金属薄膜の平均
厚さは、５０〜１０００大の範囲である。For example, the brazing material layer formed by laminating a plurality of the metal thin films is T i /P b , Z r /P b %T
j / B i, Z r / B f, T
i/S n s Z r/S
n, T i /(:u, Zr/Cu two-layer laminate, etc.).The reason for limiting the average thickness of the metal thin film constituting the brazing material layer is that the average thickness is less than L000λ. This is because, if it exceeds, it is impossible to reduce the bonding temperature and solidification temperature.A more preferable average thickness of the metal thin film is in the range of 50 to 1000 mm.
上記ろう材層又はろう材層を構成する金属薄膜は、厚さ
制御が容易で良好な層形成が可能なスパッタリング法、
イオンブレーティング法、電子ビーム蒸着法により前記
セラミックス又は金属からなる一方の部材に被覆するこ
とが望ましい。The brazing material layer or the metal thin film constituting the brazing material layer can be formed by sputtering, which allows for easy thickness control and good layer formation.
It is preferable to coat one of the ceramic or metal members by an ion blating method or an electron beam evaporation method.
上記加熱処理は、減圧下又は不活性雰囲気下で行うこと
が望ましい。The above heat treatment is preferably performed under reduced pressure or an inert atmosphere.
（作用）
本発明によれば、セラミックス又は金属からなる２種の
部材の接合面に平均厚さ１０００Å以下のろう材層又は
平均厚さ１０００Å以下の金属薄膜を複数積層したろう
材層を形成して加熱することによって、従来法のように
箔又はペースト状のろう材層を用いる場合に比べてろう
材層を溶融させる接合温度及び冷却過程での凝固温度を
低減できる。(Function) According to the present invention, a brazing material layer having an average thickness of 1000 Å or less or a plurality of laminated metal thin films having an average thickness of 1000 Å or less is formed on the joining surface of two types of members made of ceramic or metal. By heating, the bonding temperature at which the brazing material layer is melted and the solidification temperature during the cooling process can be lowered compared to when a foil or paste brazing material layer is used as in the conventional method.
その結果、接合時での異種材料からなる部材間の熱膨脂
差に伴って接合部に生じる残留応力を低減できるため、
接合後の接合部材への熱影響による亀裂、破壊等を防止
するこεができる。As a result, it is possible to reduce the residual stress that occurs in the joint due to the difference in thermal expansion and fat between members made of different materials during joining.
It is possible to prevent cracks, destruction, etc. due to thermal effects on the joined members after joining.
（実施例） 以下、本発明の実施例を詳細に説明する。(Example) Examples of the present invention will be described in detail below.
実施例１
純度９９．９％のα型アルミナ基材の表面をアセトンで
超音波洗浄した後、この基材上にアルゴンイオンスパッ
タリング装置により ５ｘ １Ｏ−３ｔｏｒｒのアルゴ
ン雰囲気中にて平均厚さ ５００人のγ２ｖｔ％Ｃｕ−
Ｔｌ合金からなるろう材層を形成した。Example 1 After the surface of an α-type alumina base material with a purity of 99.9% was ultrasonically cleaned with acetone, an average thickness of 500 people was applied to the base material in an argon atmosphere of 5 x 1O-3 torr using an argon ion sputtering device. γ2vt%Cu-
A brazing material layer made of Tl alloy was formed.
次いで、前記α型アルミナ基材を真空炉中に移し、該基
材のろう材層にＭｏ板を当接させた後、１０−’ 〜１
０−” ＬＯｒｒｓ ８７５℃の条件で１０分間熱処
理したところ、ろう材層は溶融し、＄７０”Ｃで凝固し
た。これにより、融点が８８０℃のバルクの７２ｖｔ％
Ｃｕ−Ｔｉ合金に比べて融点で５℃、凝固点で１゜℃低
減化することができた。Next, the α-type alumina base material was transferred to a vacuum furnace, and after a Mo plate was brought into contact with the brazing material layer of the base material, 10-' to 1
When heat treated for 10 minutes at 875°C, the brazing filler metal layer melted and solidified at $70°C. This results in 72vt% of the bulk with a melting point of 880°C.
Compared to the Cu-Ti alloy, the melting point was lowered by 5°C and the freezing point was lowered by 1°C.
熱処理後、真空炉中で冷却し、炉外にアルミナ基材を取
出したところ、Ｍｏ板はアルミナ基村上に接合され、そ
の引っ張り強度は５ｋｇ／ｃａｂ２以上であった。また
、得られた接合部材を加熱しても接合部の残留応力に起
因する亀裂、破壊等は全く認められなかった。After the heat treatment, the alumina base material was cooled in a vacuum furnace and taken out of the furnace, and the Mo plate was bonded to the alumina base material, and its tensile strength was 5 kg/cab2 or more. Moreover, even when the obtained bonded member was heated, no cracks, destruction, etc. caused by residual stress in the bonded portion were observed.
実施例２
純度９９，９％のα型アルミナ基材の表面をアセトンで
超音波洗浄した後、この基材上にアルゴンイオンスパッ
タリング装置により ５Ｘ １０−’ｔｏｒｒのアルゴ
ン雰囲気中にて途中で真空を破ることなく平均厚さ５０
入のＴｉ１平均厚さ ５００人のｐｂを順次積層して二
層積層構造のろう材層を形成した。次いで、前記α型ア
ルミナ基材を真空炉中に移し、該基材のろう材層上にＭ
ｏ板を当接させた後、１０−ｓ〜１０−１゜ｔｏｒｒ、
５９５℃の条件で１０分間熱処理したところ、ろう
材層は溶融し、５１０℃で凝固した。これにより、融点
が８００℃のバルクのｐｂに比べて融点で５℃、凝固点
で９０℃、低減化することができた。Example 2 After the surface of an α-type alumina base material with a purity of 99.9% was ultrasonically cleaned with acetone, a vacuum was applied to the base material in an argon atmosphere of 5×10-'torr using an argon ion sputtering device. Average thickness 50 without tearing
A brazing filler metal layer having a two-layer laminated structure was formed by sequentially laminating PB having an average thickness of 500. Next, the α-type alumina base material is transferred to a vacuum furnace, and M is applied on the brazing material layer of the base material.
After contacting the o plate, 10-s to 10-1°torr,
When heat treated at 595°C for 10 minutes, the brazing material layer melted and solidified at 510°C. As a result, the melting point was lowered by 5°C and the freezing point was lowered by 90°C compared to bulk Pb, which has a melting point of 800°C.
熱処理後、真空炉中で冷却し、炉外にアルミナ基材を取
出したところ、Ｍｏ板はアルミナ基打上に接合され、そ
の引っ張り強度は６ｋｇ／ｃｍ２以上であった。また、
得られた接合部材を加熱しても接合部の残留応力に起因
する亀裂、破壊等は全く認められなかった。After the heat treatment, it was cooled in a vacuum furnace and the alumina base material was taken out of the furnace. The Mo plate was bonded to the alumina base and its tensile strength was 6 kg/cm2 or more. Also,
Even when the obtained bonded member was heated, no cracks, destruction, etc. caused by residual stress in the bonded portion were observed.
実施例３
純度９９．９％のα型アルミナ基材の表面をアセトンで
超音波洗浄した後、この基材上にアルゴンイオンスパッ
タリング装置により ５Ｘ １Ｏ−３ｔｏｒｒのアルゴ
ン雰囲気中にて途中で真空を破ることなく平均厚さ５０
入のＺｒ、平均厚さ ５００λのｐｂを順次積層して二
層積層構造のろう材層を形成した。次いで、前記α型ア
ルミナ基材を真空炉中に移し、該基材のろう材層上にＭ
ｏ板を当接させた後、１０−８〜１Ｏ−１０ｔｏｒｒ、
８００℃の条件で１０分間熱処理したところ、ろう
材層は溶融し、５３０℃で凝固した。これにより、融点
が８００℃のバルクのｐｂに比べて凝固点で７０℃低減
化することができた。Example 3 After ultrasonically cleaning the surface of an α-type alumina base material with a purity of 99.9% with acetone, the vacuum was broken midway through an argon atmosphere of 5X 1O-3 torr on this base material using an argon ion sputtering device. Average thickness 50 without
A brazing filler metal layer having a two-layer laminated structure was formed by sequentially laminating Zr containing 100% of the aluminum alloy and PB having an average thickness of 500λ. Next, the α-type alumina base material is transferred to a vacuum furnace, and M is applied on the brazing material layer of the base material.
After contacting the o plate, 10-8 to 1O-10 torr,
When heat treated for 10 minutes at 800°C, the brazing material layer melted and solidified at 530°C. As a result, the freezing point could be lowered by 70°C compared to bulk PB, which has a melting point of 800°C.
熱処理後、真空炉中で冷却し、炉外にアルミナ基材を取
出したところ、Ｍｏ板はアルミナ基村上に接合され、そ
の引っ張り強度は８ｋｇ／ｃｍ２以上であった。また、
得られた接合部材を加熱しても接合部の残留応力に起因
する亀裂、破壊等は全く認められなかった。After the heat treatment, the alumina base material was cooled in a vacuum furnace and taken out of the furnace, and the Mo plate was bonded to the alumina base material, and its tensile strength was 8 kg/cm2 or more. Also,
Even when the obtained bonded member was heated, no cracks, destruction, etc. caused by residual stress in the bonded portion were observed.
実施例４
純度９９．９％の窒化アルミニウム基材の表面をアセト
ンで超音波洗浄した後、この基材上にアルゴンイオンス
パッタリング装置により ５Ｘ ｔｏ−３ｔｏｒｒのア
ルゴン雰囲気中にて途中で真空を破ることなく平均厚さ
５０入のＴｉ、平均厚さ ５００人のＢｉを順次積層し
て二層積層構造のろう材層を形成した。Example 4 After ultrasonically cleaning the surface of an aluminum nitride base material with a purity of 99.9% with acetone, the vacuum was broken midway through using an argon ion sputtering device in an argon atmosphere of 5X to 3 torr. A brazing filler metal layer having a two-layer laminated structure was formed by sequentially laminating Ti with an average thickness of 50 mm and Bi with an average thickness of 500 mm.
次いで、前記α型アルミナ基材を真空炉中に移し、該基
材のろう材層上にＭｏ板を当接させた後、１０−’ 〜
１０−” ｔｏｒｒ、 ５４０℃の条件で１０分間熱
処理したところ、ろう材層は溶融し、４５０℃で凝固し
た。これにより、融点が５４４℃のバルクのＢｉに比べ
て融点で４℃、凝固点で９４℃、低減化することができ
た。Next, the α-type alumina base material was transferred to a vacuum furnace, and after a Mo plate was brought into contact with the brazing material layer of the base material, 10-' ~
When heat treated for 10 minutes at 10-" torr and 540°C, the brazing material layer melted and solidified at 450°C. As a result, the melting point was 4°C and the freezing point was lower than that of bulk Bi, which has a melting point of 544°C. It was possible to reduce the temperature by 94°C.
熱処理後、真空炉中で冷却し、炉外に窒化アルミニウム
基材を取出したところ、Ｍｏ板は窒化アルミニウム基材
上に接合され、その引っ張り強度は４ｋｇ／ｃｍ’以上
であった。また、得られた接合部材を加熱しても接合部
の残留応力に起因する亀裂、破壊等は全く認められなか
った。After the heat treatment, the aluminum nitride base material was cooled in a vacuum furnace and taken out of the furnace, and the Mo plate was bonded to the aluminum nitride base material, and its tensile strength was 4 kg/cm' or more. Moreover, even when the obtained bonded member was heated, no cracks, destruction, etc. caused by residual stress in the bonded portion were observed.
実施例５
純度９９．９％の窒化アルミニウム基材の表面をアセト
ンで超音波洗浄した後、この基材上にアルゴンイオンス
パッタリング装置により ５Ｘ １０−’ｔｏｒｒのア
ルゴン雰囲気中にて途中で真空を破ることなく平均厚さ
５０久のＴｉ、平均厚さ ５００大のＳｎを順次積層し
て二層積層構造のろう材層を形成した。Example 5 After ultrasonically cleaning the surface of an aluminum nitride base material with a purity of 99.9% with acetone, the vacuum was broken midway through an argon atmosphere of 5X 10-'torr using an argon ion sputtering device on this base material. Ti with an average thickness of 50 mm and Sn with an average thickness of 500 mm were sequentially laminated to form a brazing filler metal layer with a two-layer laminated structure.
次いで、前記α型アルミナ基材を真空炉中に移し、該基
材のろう材層上にＭｏ板を当接させた後、ＩＦ’〜１０
−” ｔｏｒｒ、 ５００℃の条件で１０分間熱処理
したところ、ろう材層は溶融し、４１０’Ｃで凝固した
。これにより、融点が５０５℃のバルクのＳｎに比べて
融点で５℃、凝固点で９５℃、低減化することができた
。Next, the α-type alumina base material was transferred to a vacuum furnace, a Mo plate was brought into contact with the brazing material layer of the base material, and then IF'~10
When heat treated for 10 minutes at 500°C, the brazing material layer melted and solidified at 410'C.This resulted in a melting point of 5°C and a freezing point of 505°C, compared to bulk Sn, which has a melting point of 505°C. It was possible to reduce the temperature by 95°C.
熱処理後、真空炉中で冷却し、炉外に窒化アルミニウム
基材を取出したところ、ＭＯ板は窒化アルミニウム基村
上に接合され、その引っ張り強度は３ｋｇ／ｃ＋ａ２以
上であった。また、得られた接合部材を加熱しても接合
部の残留応力に起因する亀裂、破壊等は全く認められな
かった。After the heat treatment, the aluminum nitride base material was cooled in a vacuum furnace and taken out of the furnace, and the MO plate was bonded onto the aluminum nitride base material, and its tensile strength was 3 kg/c+a2 or more. Moreover, even when the obtained bonded member was heated, no cracks, destruction, etc. caused by residual stress in the bonded portion were observed.
［発明の効果］
以上詳述した如く、本発明の接合方法によればセラミッ
クス、金属からなる部材間の接合に際して接合温度及び
冷却過程での凝固温度を低減して異種材料からなる部材
間の熱膨張差に起因する残留応力の発生を抑制でき、ひ
いては接合後の熱影響による亀裂、破損を防止した信頼
性の高い接合部材を得ることができる等顕著な効果を奏
する。[Effects of the Invention] As detailed above, according to the joining method of the present invention, when joining members made of ceramics and metals, the joining temperature and the solidification temperature during the cooling process are reduced, and the heat between members made of different materials is reduced. This has remarkable effects such as being able to suppress the generation of residual stress due to the difference in expansion, and thereby making it possible to obtain a highly reliable bonded member that is prevented from cracking or breaking due to thermal effects after bonding.
Claims (2)
面に平均厚さ１０００Å以下のろう材層を形成し、この
ろう材層に前記部材と異なる金属又はセラミックスから
なる他方の部材を当接させた後、加熱して前記ろう材層
を溶融、接合することを特徴とする接合方法。(1) A brazing metal layer with an average thickness of 1000 Å or less is formed on the joint surface of one member made of ceramic or metal, and the other member made of a metal or ceramic different from the above member is brought into contact with this brazing metal layer. A joining method characterized in that the brazing material layer is then heated to melt and join.
面に平均厚さ１０００Å以下の金属薄膜を複数積層した
ろう材層を形成し、このろう材層に前記部材と異なる金
属又はセラミックスからなる他方の部材を当接させた後
、加熱して前記ろう材層を溶融、接合することを特徴と
する接合方法。(2) A brazing filler metal layer consisting of a plurality of laminated metal thin films with an average thickness of 1000 Å or less is formed on the joining surface of one member made of ceramic or metal, and the brazing filler metal layer is formed on the joining surface of one member made of a metal or ceramic different from the said member. A joining method characterized in that after the members are brought into contact, the brazing material layer is melted and joined by heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22539289A JP2854619B2 (en) | 1989-08-31 | 1989-08-31 | Joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22539289A JP2854619B2 (en) | 1989-08-31 | 1989-08-31 | Joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0388780A true JPH0388780A (en) | 1991-04-15 |
| JP2854619B2 JP2854619B2 (en) | 1999-02-03 |
Family
ID=16828642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22539289A Expired - Fee Related JP2854619B2 (en) | 1989-08-31 | 1989-08-31 | Joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2854619B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0632669A (en) * | 1992-07-15 | 1994-02-08 | Toshiba Corp | Joined body, metallized body and production of metallized body |
| CN115302033A (en) * | 2022-08-22 | 2022-11-08 | 哈尔滨工业大学（威海） | Low-temperature indirect brazing method for zirconia ceramic and titanium alloy |
-
1989
- 1989-08-31 JP JP22539289A patent/JP2854619B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0632669A (en) * | 1992-07-15 | 1994-02-08 | Toshiba Corp | Joined body, metallized body and production of metallized body |
| CN115302033A (en) * | 2022-08-22 | 2022-11-08 | 哈尔滨工业大学（威海） | Low-temperature indirect brazing method for zirconia ceramic and titanium alloy |
| CN115302033B (en) * | 2022-08-22 | 2023-11-21 | 哈尔滨工业大学（威海） | Low-temperature indirect brazing method for zirconia ceramic and titanium alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2854619B2 (en) | 1999-02-03 |
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