JPH0388174U - - Google Patents
Info
- Publication number
- JPH0388174U JPH0388174U JP15030489U JP15030489U JPH0388174U JP H0388174 U JPH0388174 U JP H0388174U JP 15030489 U JP15030489 U JP 15030489U JP 15030489 U JP15030489 U JP 15030489U JP H0388174 U JPH0388174 U JP H0388174U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- holding plate
- press plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
第１図は本考案に係るフレキシブルプリント配
線板用通電検査装置の通電検査前の状態を示した
正面斜視図であつて、第２図は通電検査時の状態
を示した正断面図である。
２……固定台、３と４……コンタクトプローブ
、６……バネ、７……押え板、７ａ，７ｂ……挿
通穴、８……プレス板、ＦＰ……フレキシブルプ
リント配線板。
FIG. 1 is a front perspective view showing the state of the energization testing device for a flexible printed wiring board according to the present invention before the energization test, and FIG. 2 is a front sectional view showing the state during the energization test. 2... Fixing base, 3 and 4... Contact probe, 6... Spring, 7... Holding plate, 7a, 7b... Insertion hole, 8... Press board, FP... Flexible printed wiring board.
Claims (1)
た固定台の上面に、コンタクトプローブ用の挿通
穴を穿設した押え板をバネによつて上下作動自在
に弾支する一方、この押え板の上方には、降下す
ると押え板を押圧降下して押え板との間でフレキ
シブルプリント配線板を平面状に挾持し、且つ、
上記コンタクトプローブの先端部を挿通穴を通し
て上記のフレキシブルプリント配線板に接触させ
ることができるプレス板を設けたことを特徴とす
るフレキシブルプリント配線板用通電検査装置。 (2) プレス板の降下によつて押え板との間でフ
レキシブルプリント配線板を平面状に伸ばして挾
持した後、更に上記プレス板を降下させることに
よつて、コンタクトプローブの先端部を押え板の
挿通穴を通して上記のフレキシブルプリント配線
板に接触させるように構成したことを特徴とする
請求項(1)記載のフレキシブルプリント配線板用
通電検査装置。[Scope of Claim for Utility Model Registration] (1) A holding plate with a through hole for the contact probe is elastically supported by a spring so as to be able to move up and down on the top surface of a fixed base on which a contact probe for electrical testing is protruded. On the other hand, above the holding plate, when the holding plate is lowered, the holding plate is pressed down and the flexible printed wiring board is held in a flat shape between the holding plate, and
A current testing device for a flexible printed wiring board, comprising a press plate that allows the tip of the contact probe to come into contact with the flexible printed wiring board through an insertion hole. (2) After the flexible printed wiring board is stretched flat and clamped between the press plate and the press plate by lowering, the tip of the contact probe is held between the press plate and the press plate by further lowering. 2. The electrical conductivity testing device for a flexible printed wiring board according to claim 1, wherein the device is configured to be brought into contact with the flexible printed wiring board through the insertion hole of the flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15030489U JPH0388174U (en) | 1989-12-27 | 1989-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15030489U JPH0388174U (en) | 1989-12-27 | 1989-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388174U true JPH0388174U (en) | 1991-09-09 |
Family
ID=31696656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15030489U Pending JPH0388174U (en) | 1989-12-27 | 1989-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388174U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010237061A (en) * | 2009-03-31 | 2010-10-21 | Tdk Corp | Substrate-holding implement, electronic component inspection apparatus and electronic component inspection method |
| KR101943750B1 (en) * | 2017-09-14 | 2019-01-30 | 매그나칩 반도체 유한회사 | Bending test socket of flexible semiconductor chip package and bending test method using the same |
-
1989
- 1989-12-27 JP JP15030489U patent/JPH0388174U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010237061A (en) * | 2009-03-31 | 2010-10-21 | Tdk Corp | Substrate-holding implement, electronic component inspection apparatus and electronic component inspection method |
| KR101943750B1 (en) * | 2017-09-14 | 2019-01-30 | 매그나칩 반도체 유한회사 | Bending test socket of flexible semiconductor chip package and bending test method using the same |
| US10705116B2 (en) | 2017-09-14 | 2020-07-07 | Magnachip Semiconductor, Ltd. | Test socket of flexible semiconductor chip package and bending test method using the same |
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