JPH0385700U - - Google Patents
Info
- Publication number
- JPH0385700U JPH0385700U JP14759789U JP14759789U JPH0385700U JP H0385700 U JPH0385700 U JP H0385700U JP 14759789 U JP14759789 U JP 14759789U JP 14759789 U JP14759789 U JP 14759789U JP H0385700 U JPH0385700 U JP H0385700U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- integrated circuit
- hybrid integrated
- circuit component
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 1
Description
第１図は本考案に係るリード付混成集積回路部
品の実施例を示す斜視図、第２図は同リード付混
成集積回路部品を電子回路基板に搭載した状態に
おけるＡ−Ａ′線断面斜視図、第３図は同実施例
におけるリード線挿入前における混成集積回路基
板の平面図、第４図ａ〜ｃはリード線の成型加工
から挿入切断を説明する側面方向断面図、第５図
は同実施例におけるリード付混成集積回路部品の
組立手順を示すフローチヤート、第６図は従来の
リードフレーム付混成集積回路部品の側面図、第
７図は従来のリードフレーム付混成集積回路部品
の成型治具、第８図は従来のリードフレーム付混
成集積回路部品の組立手順を示すフローチヤート
である。
１６……貫通孔、２０……リード付混成集積回
路部品、２１……リード、２２……折曲部。
FIG. 1 is a perspective view showing an embodiment of the leaded hybrid integrated circuit component according to the present invention, and FIG. 2 is a cross-sectional perspective view taken along the line A-A' of the leaded hybrid integrated circuit component mounted on an electronic circuit board. , FIG. 3 is a plan view of the hybrid integrated circuit board before inserting the lead wires in the same embodiment, FIGS. A flow chart showing the assembly procedure of a hybrid integrated circuit component with a lead in an embodiment, FIG. 6 is a side view of a conventional hybrid integrated circuit component with a lead frame, and FIG. 7 is a molding process for a conventional hybrid integrated circuit component with a lead frame. FIG. 8 is a flowchart showing the procedure for assembling a conventional hybrid integrated circuit component with a lead frame. 16...Through hole, 20...Hybrid integrated circuit component with lead, 21...Lead, 22...Bend portion.
Claims (1)
子回路基板に取付られるリード付混成集積回路部
品において、前記基板中央部に貫通孔を形成する
とともに該貫通孔にリードを挿入しさらに該リー
ド先端部を折曲させたことを特徴とするリード付
混成集積回路部品。 In a lead-equipped hybrid integrated circuit component that is attached to an electronic circuit board configured to allow electronic components to be mounted, a through hole is formed in the center of the board, a lead is inserted into the through hole, and the tip of the lead is further inserted. A lead-equipped hybrid integrated circuit component characterized by being bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14759789U JPH0385700U (en) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14759789U JPH0385700U (en) | 1989-12-21 | 1989-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385700U true JPH0385700U (en) | 1991-08-29 |
Family
ID=31694105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14759789U Pending JPH0385700U (en) | 1989-12-21 | 1989-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385700U (en) |
-
1989
- 1989-12-21 JP JP14759789U patent/JPH0385700U/ja active Pending
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