JPH038424U - - Google Patents

Info

Publication number
JPH038424U
JPH038424U JP1989067814U JP6781489U JPH038424U JP H038424 U JPH038424 U JP H038424U JP 1989067814 U JP1989067814 U JP 1989067814U JP 6781489 U JP6781489 U JP 6781489U JP H038424 U JPH038424 U JP H038424U
Authority
JP
Japan
Prior art keywords
heat treatment
heat
section
treatment section
buffer storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989067814U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0536269Y2 (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989067814U priority Critical patent/JPH0536269Y2/ja
Priority to KR1019900008438A priority patent/KR930010971B1/ko
Publication of JPH038424U publication Critical patent/JPH038424U/ja
Application granted granted Critical
Publication of JPH0536269Y2 publication Critical patent/JPH0536269Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP1989067814U 1989-06-09 1989-06-09 Expired - Lifetime JPH0536269Y2 (en, 2012)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1989067814U JPH0536269Y2 (en, 2012) 1989-06-09 1989-06-09
KR1019900008438A KR930010971B1 (ko) 1989-06-09 1990-06-08 기판을 열처리하기 위한 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989067814U JPH0536269Y2 (en, 2012) 1989-06-09 1989-06-09

Publications (2)

Publication Number Publication Date
JPH038424U true JPH038424U (en, 2012) 1991-01-28
JPH0536269Y2 JPH0536269Y2 (en, 2012) 1993-09-14

Family

ID=13355791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989067814U Expired - Lifetime JPH0536269Y2 (en, 2012) 1989-06-09 1989-06-09

Country Status (2)

Country Link
JP (1) JPH0536269Y2 (en, 2012)
KR (1) KR930010971B1 (en, 2012)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211243A (ja) * 1983-05-17 1984-11-30 Toshiba Corp 半導体基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211243A (ja) * 1983-05-17 1984-11-30 Toshiba Corp 半導体基板処理装置

Also Published As

Publication number Publication date
KR910001897A (ko) 1991-01-31
JPH0536269Y2 (en, 2012) 1993-09-14
KR930010971B1 (ko) 1993-11-18

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