JPH0384000U - - Google Patents
Info
- Publication number
- JPH0384000U JPH0384000U JP14625389U JP14625389U JPH0384000U JP H0384000 U JPH0384000 U JP H0384000U JP 14625389 U JP14625389 U JP 14625389U JP 14625389 U JP14625389 U JP 14625389U JP H0384000 U JPH0384000 U JP H0384000U
- Authority
- JP
- Japan
- Prior art keywords
- engagement piece
- lead wire
- actuator
- air cylinder
- detection section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 238000012790 confirmation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第１図ａおよびｂは、この考案によるＩＣリー
ド線クリンチ機構を装備したＩＣ装着装置の実施
例に対する断面図および動作説明図、第２図は、
プリント基板に対するＩＣチツプの装着の説明図
、第３図ａおよびｂは、ＩＣ装着装置における従
来のクリンチ機構の断面図および動作説明図であ
る。
１……ＩＣチツプ、１ａ……リード線、２……
プリント基板、２ａ……スルーホール、３……挿
入検出部、３ａ……ベース盤、３ｂ……フレーム
、３ｃ……ピンブロツク、３ｄ……検出ピン、３
ｅ……挿入検出器、４……従来のクリンチ機構、
４ａ……エアシリンダ、４ｂ……シヤフト、４ｃ
……連動ピン、４ｄ……同動軸、４ｅ……クリン
チ具、４ｆ……爪、５……この考案のクリンチ機
構、５ａ……エアシリンダ、５ｂ……アクチユエ
ータ、５ｃ……係合片、５ｄ……回動軸、５ｅ…
…斜面、５ｆ……押圧具。
FIGS. 1a and 1b are sectional views and operation explanatory views of an embodiment of an IC mounting device equipped with an IC lead wire clinch mechanism according to this invention, and FIG.
FIGS. 3A and 3B, which are explanatory diagrams for mounting an IC chip onto a printed circuit board, are a sectional view and an operation explanatory diagram of a conventional clinch mechanism in an IC mounting apparatus. 1...IC chip, 1a...lead wire, 2...
Printed circuit board, 2a... Through hole, 3... Insertion detection section, 3a... Base board, 3b... Frame, 3c... Pin block, 3d... Detection pin, 3
e...Insertion detector, 4...Conventional clinch mechanism,
4a...Air cylinder, 4b...Shaft, 4c
. . . Interlocking pin, 4d . 5d...Rotation axis, 5e...
...Slope, 5f...pressing tool.
Claims (1)
リード線を検出する挿入検出部を有するＩＣ装着
装置において、該挿入検出部によりすべての該リ
ード線が正常に挿入されたことを確認する確認信
号により、エアシリンダにより下降するアクチユ
エータと、上記ＩＣ装着装置のベース盤に固定さ
れたフレームに軸支され、上記アクチユエータの
下降により一端が押圧されて回動する“く”の字
形の係合片と、該係合片の他端に係合し、該係合
片の上記回動により上記フレームに設けられた斜
面に沿つて、上記基板のスルーホールに挿入され
た上記リード線に対して下方より斜め上方向に移
動し、該リード線を押圧して上記基板に対して４
５°以下の鋭角に折り曲げる押圧具とを設けたこ
とを特徴とする、ＩＣリード線クリンチ機構。 IC inserted into a through hole on a printed circuit board
In an IC mounting device that has an insertion detection section that detects lead wires, the actuator is lowered by an air cylinder in response to a confirmation signal from the insertion detection section that confirms that all the lead wires have been inserted normally, and the IC mounting device is moved downward by an air cylinder. a dogleg-shaped engagement piece that is pivotally supported by a frame fixed to the base board of the device, and whose one end is pressed and rotated by the descent of the actuator; and the engagement piece engages with the other end of the engagement piece; The rotation of the engagement piece causes it to move diagonally upward from below with respect to the lead wire inserted into the through hole of the substrate along the slope provided in the frame, and presses the lead wire. 4 for the above board.
An IC lead wire clinch mechanism characterized by being provided with a pressing tool for bending at an acute angle of 5 degrees or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14625389U JPH0384000U (en) | 1989-12-19 | 1989-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14625389U JPH0384000U (en) | 1989-12-19 | 1989-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0384000U true JPH0384000U (en) | 1991-08-26 |
Family
ID=31692852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14625389U Pending JPH0384000U (en) | 1989-12-19 | 1989-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0384000U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041100B2 (en) * | 1982-10-27 | 1985-09-13 | 横浜ゴム株式会社 | thermosetting adhesive composition |
| JPS6120233B2 (en) * | 1976-08-13 | 1986-05-21 | Hitachi Ltd |
-
1989
- 1989-12-19 JP JP14625389U patent/JPH0384000U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120233B2 (en) * | 1976-08-13 | 1986-05-21 | Hitachi Ltd | |
| JPS6041100B2 (en) * | 1982-10-27 | 1985-09-13 | 横浜ゴム株式会社 | thermosetting adhesive composition |
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