JPH0383951U - - Google Patents
Info
- Publication number
- JPH0383951U JPH0383951U JP14408889U JP14408889U JPH0383951U JP H0383951 U JPH0383951 U JP H0383951U JP 14408889 U JP14408889 U JP 14408889U JP 14408889 U JP14408889 U JP 14408889U JP H0383951 U JPH0383951 U JP H0383951U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- metal plate
- thin metal
- semiconductor device
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１実施例を示す半導体装置
用リードフレームの平面図、第２図はその半導体
装置用リードフレームの断面図、第３図はその半
導体装置用リードフレームを用いた半導体装置を
示す断面図、第４図は本考案の第２実施例を示す
リードフレームの断面図、第５図は本考案の第３
実施例を示すリードフレームの断面図、第６図は
本考案の第４実施例を示すリードフレームの断面
図、第７図は本考案の第５実施例を示すリードフ
レームの断面図、第８図は本考案の第６実施例を
示すリードフレームの断面図、第９図は本考案の
第７実施例を示すリードフレームの断面図、第１
０図は本考案の第８実施例を示すリードフレーム
の断面図、第１１図は本考案の第９実施例を示す
リードフレームの断面図である。
１……リードフレーム、２……アイランド、３
，６，２１，２２，２３……薄い板状のステンレ
ス、３ａ……インナリード、４……ポリイミドテ
ープ、５……半導体素子、７……メツキ、８……
ワイヤ、９……ペースト材、１０……封止材、２
４……支持部材、２４ａ，２７ａ……窪み部、２
５……フイルム、２６……テープ、２７……支持
シート。
Fig. 1 is a plan view of a lead frame for a semiconductor device showing a first embodiment of the present invention, Fig. 2 is a sectional view of the lead frame for a semiconductor device, and Fig. 3 is a semiconductor device using the lead frame for a semiconductor device. 4 is a sectional view of a lead frame showing a second embodiment of the present invention, and FIG. 5 is a sectional view of a third embodiment of the present invention.
6 is a cross-sectional view of a lead frame showing a fourth embodiment of the present invention; FIG. 7 is a cross-sectional view of a lead frame showing a fifth embodiment of the present invention; FIG. The figure is a cross-sectional view of a lead frame showing a sixth embodiment of the present invention, and FIG. 9 is a cross-sectional view of a lead frame showing a seventh embodiment of the present invention.
FIG. 0 is a sectional view of a lead frame showing an eighth embodiment of the present invention, and FIG. 11 is a sectional view of a lead frame showing a ninth embodiment of the present invention. 1...Lead frame, 2...Island, 3
, 6, 21, 22, 23... Thin plate-shaped stainless steel, 3a... Inner lead, 4... Polyimide tape, 5... Semiconductor element, 7... Plating, 8...
Wire, 9... Paste material, 10... Sealing material, 2
4... Support member, 24a, 27a... Hollow portion, 2
5...Film, 26...Tape, 27...Support sheet.
Claims (1)
置用リードフレームにおいて、 (a) 微細パターンを形成可能な薄形金属板と、 (b) 該薄形金属板の裏面に積層される薄形支持
板とを設け、 (c) 前記薄形金属板をパターニングしてリード
を構成してなる半導体装置用リードフレーム。[Claims for Utility Model Registration] In a lead frame for a semiconductor device that is electrically connected to a semiconductor element, (a) a thin metal plate on which a fine pattern can be formed; (b) the back surface of the thin metal plate (c) a lead frame for a semiconductor device comprising: a thin support plate laminated on the thin metal plate; (c) a lead formed by patterning the thin metal plate;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14408889U JPH0383951U (en) | 1989-12-15 | 1989-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14408889U JPH0383951U (en) | 1989-12-15 | 1989-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383951U true JPH0383951U (en) | 1991-08-26 |
Family
ID=31690825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14408889U Pending JPH0383951U (en) | 1989-12-15 | 1989-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383951U (en) |
-
1989
- 1989-12-15 JP JP14408889U patent/JPH0383951U/ja active Pending