JPH0383697A - Memory card - Google Patents

Abstract

PURPOSE:To simplify the assembling process of a memory card by mounting an IC card having the same shape as an electronic part and having no element therein to the part where the electronic part such as a memory IC is not mounted on a printed wiring board. CONSTITUTION:In a memory card equipped with a printed wiring board 1 having electronic parts such as memory ICs 5, the frame 2 mounting and holding the printed wiring board 1 and texterior panels 3, 4 covering the printed wiring board 1, dummy ICs 9 having the same shape as the electronic parts such as the memory ICs 5 and having no elements therein are mounted to the non- mounting part of the memory ICs 5 of the printed wiring board 1. since the dummy ICs 9 are used in place of a spacer as mentioned above, the dummy ICs 9 can be mounted in the same process as the electronic parts such as the memory ICs 5 at the time of the mounting of the dummy ICs to the printed wiring board 1 and an assembling process is shortened. An apparatus mounting the spacer is also unnecessary and a manufacturing process can be simplified and the deformation of the exterior panels 3, 4 due to external force can be also prevented.

Description

[Detailed description of the invention] [Industrial application field] This invention relates to the structure of a memory card.

[Conventional technology]

Depending on the memory card model (specification), the number of memory ICs mounted on the wiring board shared by each model varies depending on the model, such as when it is fully mounted or when it is mounted in a small number. be.

For example, in a model in which a memory IC is not fully mounted, a space is created between a portion of the wiring board where the memory IC is not mounted and the exterior panel, which may easily deform when external force is applied.

Fig. 2 is an exploded perspective view showing a conventional memory card to solve the above problems, and Figs. 3 to 5 show mounting boards for each type of memory card. The front view and figure b are the back views.

In the figure, 1 is a wiring board, 2 is a mold frame for mounting and supporting this wiring board 1, 3 and 4 are front and back exterior panels that cover and protect the wiring board 1, etc., respectively.
5 is an unmounted portion of the memory IC 16 mounted on the wiring board 1, where electronic components such as the memory IC 5 are not mounted;
7 is a spacer made of an insulator attached to this unmounted part 6, 8a to 8c are adhesive sheets coated with adhesive on both sides, 8a is for the spacer, 8b is for the exterior panel (front), and 8c is for the exterior. This is for the panel (back).

Next, a method for attaching the spacer 7 will be explained. Second
As shown in the figure, a wiring board 1 on which electronic components such as a memory IC 5 are already mounted, and a spacer 7 to which an adhesive sheet 8a is pasted in advance are prepared, and the spacer 7 is glued to the unmounted part 6 of the wiring board 1. C) Baste using 8a. After that, apply the adhesive sheet 8 to the exterior panel 3.4 in the same way.
b and 8c, and finally, a certain pressure is applied and heated in a curing furnace to completely bond and fix the wiring board 1, spacer 7, and exterior panel 3.4.

[Problem to be solved by the invention]

As described above, in the conventional memory card structure, after pasting the adhesive sheet 8a on the spacer 7, the memory IC
The mounting on the wiring board 1 can be done by pasting the electronic components such as the memory IC 5 on the wiring board 1 on which the electronic components such as the memory IC 5 are mounted, or by pasting the spacer 7 after pasting the adhesive sheet 8a on the wiring board 1. There was a problem in that component mounting, which requires soldering, and pasting of the spacer 7 were separated, resulting in an increase in the number of assembly steps.

This invention was made to solve the above-mentioned problems, and by eliminating the need for a spacer, it eliminates the spacer manufacturing process, and also eliminates the process of mounting the spacer on the wiring board, making it easier to install memory cards. The purpose is to simplify the assembly process.

[Means to solve the problem]

A memory card according to the present invention includes a wiring board on which electronic components such as a memory IC are mounted, a frame for mounting and holding the wiring board, and an exterior panel covering the wiring board, wherein the wiring board A dummy IC having the same shape as the electronic component such as the memory IC and having no internal elements is mounted on the unmounted portion of the memory IC or the like of No. 1.

[Effect]

In the memory card of the present invention, when mounting the dummy IC on the unmounted portion of the wiring board, it can be mounted in the same process as electronic components such as the memory IC, thereby simplifying the assembly process.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
Figure 6 is an exploded perspective view showing a 128KB single-sided mounting board type memory card.In Figure 6, 1 is a wiring board, 2
3 and 4 are front and back exterior panels that cover and protect the wiring board 1, respectively, and 5 are memory ICs 18b to 8C mounted on the wiring board 1. is an adhesive sheet coated with adhesive on both sides, 8b is for the exterior panel (front), and 8c is for the exterior panel (back). 9 has the same shape as the memory IC 5 which does not have an element inside. It is a dummy IC with
The memory IC 5 is mounted on the unmounted portion of the wiring board 1 using the same device and using the same method.

In the above embodiment, since the dummy IC 9 has the same shape as the memory IC 5, the dummy IC 9 can be mounted on the wiring board 1 in the same process as the memory IC 5 and the like forming the circuit.

In the above embodiment, the dummy IC 9 has the same shape as the memory C5, but it may also have the same shape as other electronic components mounted on the wiring board 1.

〔Effect of the invention〕

As described above, according to the present invention, since a dummy IC having the same shape as an electronic component such as a memory IC is used instead of a spacer, the dummy IC can be mounted on a wiring board in the same process as the electronic component such as a memory IC. can be mounted, and the assembly process is shortened. Furthermore, the conventional device for mounting spacers is no longer required, and the manufacturing line is also simplified. Furthermore, deformation of the exterior panel due to external force can be prevented.

[Brief Description of the Drawings] Fig. 1 is an exploded perspective view showing a memory card according to an embodiment of the present invention, Fig. 2 is an exploded perspective view showing a conventional memory card, and Figs. 3 to 5 are an exploded perspective view showing a memory card according to an embodiment of the present invention. This figure shows the differences in the mounting board depending on the type, with figure a being a front view and figure b being a back view. In the figure, 1 is a wiring board, 2 is a mold frame, 3.4 is a front and back exterior panel, 5 is a memory IC 18b, 8c is an adhesive sheet, and 9 is a dummy IC. Note that the same reference numerals in the figures indicate the same or equivalent parts. Figure 1 Figure 2

Claims (1)

[Claims] a wiring board with electronic components such as a memory IC mounted on at least one surface thereof; and a frame that holds the wiring board;
In a memory card equipped with front and back exterior panels that cover the wiring board, an element having the same shape as an electronic component such as a memory IC is mounted inside the part of the wiring board where an electronic component such as a memory IC is not mounted. A memory card characterized in that a dummy IC is mounted.