JPS583314Y2 - Electronic component mounting device - Google Patents

Description

[Detailed Description of the Invention] This invention relates to an electronic component mounting device for mounting an electronic component into the case of an electronic device such as a tape recorder or a small desktop electronic computer.

Figure 1 shows a conventional electronic component mounting device in which electronic components are mounted inside the case of an electronic device such as a tape recorder. 3 is fixed at one end, and a printed circuit board 5 with an electronic component 4 attached to the other end of this support 3 is attached with screws 6, and each opening edge of the upper case 7 and lower case 8 is attached above and below the frame 1. The electronic component 4 is configured to be mounted in the case 7.8 by fitting the respective parts.

Note that mechanical parts (not shown) are attached to the upper surface side of the chassis 2.

However, with such a configuration, a wasted space 9 is created on the back side of the printed circuit board 5, which causes a problem that the thickness dimension 11 of the case, particularly the lower case 8, increases accordingly.

In addition, the mounting of the printed circuit board 5 to the chassis 2 is also done using the support column 3.
Since this is done through the screws 6 and 6, the number of parts required for attachment is large and the attachment work is also troublesome.

This idea was created in view of these circumstances, and its purpose is to make the case thinner in an electronic component mounting device that mounts electronic components inside the case, reduce the number of parts required for mounting, and The purpose is to make the installation work easier.

The details of this invention will be explained below based on the embodiments shown in the drawings.

Figure 2 shows an embodiment of this invention, and its major feature is that the back surface of the printed circuit board 5 is glued to the inner surface of the lower case 8, which has a horizontal portion and a rising portion rising from the horizontal portion. .

Therefore, there is no wasted space on the back side of the printed circuit board 5 unlike in the conventional device shown in FIG.
The thickness dimension 12 of the lower case 8 can be reduced○
In addition, there are also pillars 3 and screws 6 for attaching the printed circuit board 5.
is no longer necessary, and the installation work is extremely simple since it only requires adhering the back surface of the board 5 to the case 8 with an adhesive or the like.

Note that the printed circuit board 5 may be formed of a flexible sheet.

In this way, even if the flatness of the lower case 8 is somewhat poor, the entire surface of the substrate 5 can be brought into close contact with the inner surface of the case 8.

Furthermore, if a double-sided adhesive tape is used to adhere the substrate 5 to the inner surface of the lower case 8, the substrate 5 can be more easily adhered to the inner surface of the case.

In addition, as shown in FIG. 3, both ends of the printed circuit board 5Q) are bent at almost right angles toward the front side, and each bent portion is aligned along the inner surface of the left and right vertical portions of the lower case 8. If a tall electronic component is attached to the bent portion by gluing it, the longitudinal axis of such component will be aligned horizontally, that is, approximately parallel to the horizontal portion of the inner surface of the lower case 8. This has the advantage that the case can be made even thinner.

As shown in Figure L, according to this invention, in an electronic component mounting device for mounting electronic components in a case, the back surface of the printed circuit board is placed along the inner surface of the case, which has a horizontal portion and a rising portion rising from the horizontal portion. The electronic component with a relatively high height from the above surface is placed on a part of the surface of the printed circuit board corresponding to the vertical part on the inner surface of the case, and the electronic component with a relatively high height from the surface is placed in the longitudinal direction of the case. By making the inner surface horizontal and approximately flat 71, the case can be made thinner.
The number of parts required for installation can be reduced and the installation work can be performed easily.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a conventional example, FIG. 2 is a sectional view showing one embodiment of this invention, and FIG. 3 is a sectional view showing another practical example of this invention. 4...Electronic components, 5...Printed circuit boards, 7, 8...Case.

Claims (3)

[Scope of utility model registration request] (1) In an electronic component mounting device that attaches electronic components to the surface of a printed circuit board and mounts them in a case, the back surface of the printed circuit board is bonded along the inner surface of the case, which has a horizontal portion and a rising portion rising from the horizontal portion. , an electronic component with a relatively high height from the above-mentioned surface is placed on a part of the surface of the printed circuit board corresponding to the rising part of the inner surface of the case, and the longitudinal direction of the electronic component with a relatively high height is placed on a horizontal part of the inner surface of the case. An electronic component mounting device characterized by being substantially parallel to the . (2) The electronic component mounting device according to claim (1), wherein the printed circuit board is flexible. (3) The electronic component mounting device according to claim (1) or (2) of the utility model registration, characterized in that the printed circuit board is adhered to the inner surface of the case using double-sided adhesive tape.