JPH04130789A - Mounting structure for electronic component - Google Patents
Mounting structure for electronic componentInfo
- Publication number
- JPH04130789A JPH04130789A JP25225190A JP25225190A JPH04130789A JP H04130789 A JPH04130789 A JP H04130789A JP 25225190 A JP25225190 A JP 25225190A JP 25225190 A JP25225190 A JP 25225190A JP H04130789 A JPH04130789 A JP H04130789A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic component
- component
- board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は回路基板への電子部品の取付構造に係り、特
に回路基板の小型化を図るものに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a structure for mounting electronic components onto a circuit board, and particularly relates to a structure for reducing the size of the circuit board.
［従来の技術］
第２図は従来の電子部品の取付構造を示す断面図である
。図において、１は回路基板、２は回路基板１の一表面
に設けられた電極パターン、３は回路基板１に取付けら
れる例えばモールド抵抗、コンデンサ等の電子部品、４
は半田等の導電性接続材である。[Prior Art] FIG. 2 is a sectional view showing a conventional electronic component mounting structure. In the figure, 1 is a circuit board, 2 is an electrode pattern provided on one surface of the circuit board 1, 3 is an electronic component attached to the circuit board 1, such as a molded resistor, a capacitor, etc., and 4 is a circuit board.
is a conductive connecting material such as solder.
回路基板１への電子部品３の取付けは、回路基板１の電
極パターン２上に電子部品３の導電部３ａを設置し、電
極パターン２と電子部品３の導電部３ａとを導電性接続
材４により接続固定して回路基板１に電子部品３を取り
付けていた。To attach the electronic component 3 to the circuit board 1, the conductive part 3a of the electronic component 3 is installed on the electrode pattern 2 of the circuit board 1, and the electrode pattern 2 and the conductive part 3a of the electronic component 3 are connected with a conductive connecting material 4. The electronic component 3 was attached to the circuit board 1 by fixing the connection.
［発明が解決しようとする課題］
上記のような従来の電子部品の取付構造では、回路基板
１の一表面に設けられた電極パターン２上に電子部品３
を取り付けるために回路基板１上に電子部品３全体が位
置し、回路基板１上の電子部品３の占める面積が大きく
なり、回路基板１を小型化できないという問題点があっ
た。[Problems to be Solved by the Invention] In the conventional electronic component mounting structure as described above, the electronic component 3 is mounted on the electrode pattern 2 provided on one surface of the circuit board 1.
The entire electronic component 3 is located on the circuit board 1 in order to attach the electronic component 3, which increases the area occupied by the electronic component 3 on the circuit board 1, resulting in a problem that the circuit board 1 cannot be miniaturized.
この発明は上記の課題を解決すべくなされたもので、回
路基板上に占める電子部品の取付面積を減少させ、回路
基板の小型化を図ることを目的としたものである。The present invention has been made to solve the above-mentioned problems, and aims to reduce the mounting area of electronic components on a circuit board, thereby making the circuit board smaller.
［課題を解決するための手段］
この発明に係る電子部品の取付構造は回路基板に電子部
品挿入用の貫通孔を形成し、前記貫通孔内に両端に導電
部を有する電子部品を挿入配置し、前記電子部品の導電
部と前記回路基板の表面に配置される電子部品の導電部
とを導電性接続材により接続固定するようにしたもので
ある。[Means for Solving the Problems] An electronic component mounting structure according to the present invention includes forming a through hole for inserting an electronic component in a circuit board, and inserting and disposing an electronic component having conductive parts at both ends into the through hole. The conductive portion of the electronic component and the conductive portion of the electronic component disposed on the surface of the circuit board are connected and fixed by a conductive connecting material.
［実施例］
第１図はこの発明の一実施例を示す断面図である。図に
おいて、ｌＯは紙フエノール、ガラスエポキシ等で形成
された回路基板、１１は回路基板１０に形成された電子
部品挿入用の貫通孔、１２は回路基板ＩＯの内部に取り
付けられる両端に導電部１２１１を有する筒状の電子部
品、１３は回路基板ＩＯの表面に取り付けられる両端に
導電部１３ａを有する筒状の電子部品、１４は半田或は
導電性接着剤等の導電性接続材である。[Embodiment] FIG. 1 is a sectional view showing an embodiment of the present invention. In the figure, IO is a circuit board made of paper phenol, glass epoxy, etc., 11 is a through hole formed in the circuit board 10 for inserting electronic components, and 12 is a conductive part 1211 at both ends to be attached inside the circuit board IO. 13 is a cylindrical electronic component having conductive parts 13a at both ends attached to the surface of the circuit board IO, and 14 is a conductive connecting material such as solder or conductive adhesive.
回路基板１０への電子部品１２の取付は、まず、回路基
板１０に形成された貫通孔１１に電子部品１２を圧入し
て貫通孔１１内に電子部品１２を挿入配置する。To attach the electronic component 12 to the circuit board 10 , first, the electronic component 12 is press-fitted into the through hole 11 formed in the circuit board 10 , and the electronic component 12 is inserted into the through hole 11 .
次に、電子部品１２の導電部＋２ａ上に導電性接続材１
４を塗布し、その上に電子部品１３の導電部＋３ａを配
置接続固定して、回路基板１０に電子部品１２を取り付
けている。このとき、電子部品１２が回路基板１０の貫
通孔１１内に位置して回路基板１０に内蔵された形とな
り、回路基板１０上の電子部品１２の占有面積は電子部
品１２の両端の導電部１２ａだけとなり、回路基板１０
上の電子部品１２の占有面積が減少する。Next, the conductive connecting material 1 is placed on the conductive part +2a of the electronic component 12.
The electronic component 12 is attached to the circuit board 10 by coating the conductive portion +3a of the electronic component 13 thereon and fixing it thereon. At this time, the electronic component 12 is located in the through hole 11 of the circuit board 10 and is built into the circuit board 10, and the area occupied by the electronic component 12 on the circuit board 10 is the conductive portion 12a at both ends of the electronic component 12. Only the circuit board 10
The area occupied by the upper electronic component 12 is reduced.
また、電子部品１２の両端の導電部１２ａは回路基板１
０の表面に取り付けられる電子部品１３の導電部１３ａ
に電気的に接続されているから、従来例のように回路基
板の表面に取り付けられた電子部品の導電部を回路基板
にスルーホールを設けて回路基板の裏面に接続しなくて
も渣み、接続コストが安価となる。Further, the conductive parts 12a at both ends of the electronic component 12 are connected to the circuit board 1.
Conductive part 13a of electronic component 13 attached to the surface of
Because it is electrically connected to the circuit board, the conductive parts of the electronic components attached to the front surface of the circuit board can be connected to the back surface of the circuit board without creating a through hole in the circuit board as in the conventional example. Connection costs are low.
［発明の効果］
この発明は以上の説明から明かなように、回路基板に電
子部品挿入用の貫通孔を形成し、その貫通孔内に両端に
導電部を有する電子部品を挿入配置し、電子部品の導電
部と回路基板の表面に配置される電子部品の導電部とを
導電性接続材により接続固定して回路基板に電子部品を
取り付けるようにしたので、回路基板上の電子部品の占
有面積が減少し、回路基板面積を小さくして回路基板の
小型化を図ることができるという効果を有する。[Effects of the Invention] As is clear from the above description, the present invention forms a through hole for inserting an electronic component in a circuit board, inserts an electronic component having conductive parts at both ends into the through hole, and inserts an electronic component into the through hole. Since the electronic components are attached to the circuit board by connecting and fixing the conductive parts of the components and the conductive parts of the electronic components placed on the surface of the circuit board using a conductive connecting material, the area occupied by the electronic components on the circuit board can be reduced. This has the effect that the area of the circuit board can be reduced and the size of the circuit board can be reduced.
第１図はこの発明の一実施例を示す断面図、第２図は従
来の電子部品の取付構造を示す断面図である。
１０・・・回路基板、１１・・・貫通孔、１２・・・電
子部品、１２ｇ・・・導電部、１３・・・電子部品、１
３ａ・・・導電部、１４・・・導電性接続材。
以上
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴木喜三部（他１名）第２図
４・導電性接続材FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional electronic component mounting structure. DESCRIPTION OF SYMBOLS 10... Circuit board, 11... Through hole, 12... Electronic component, 12g... Conductive part, 13... Electronic component, 1
3a... Conductive part, 14... Conductive connecting material. Applicant Seiko Epson Co., Ltd. Agent Patent Attorney Kizobe Suzuki (and 1 other person) Figure 2 4 Conductive connecting material
Claims (1)
孔内に両端に導電部を有する電子部品を挿入配置し、前
記電子部品の導電部と前記回路基板の表面に配置される
電子部品の導電部とを導電性接続材により接続固定する
ことを特徴とする電子部品の取付構造。A through hole for inserting an electronic component is formed in a circuit board, an electronic component having a conductive part at both ends is inserted into the through hole, and the electronic component is arranged on the conductive part of the electronic component and a surface of the circuit board. An electronic component mounting structure characterized in that a conductive part of the electronic component is connected and fixed by a conductive connecting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25225190A JPH04130789A (en) | 1990-09-21 | 1990-09-21 | Mounting structure for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25225190A JPH04130789A (en) | 1990-09-21 | 1990-09-21 | Mounting structure for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04130789A true JPH04130789A (en) | 1992-05-01 |
Family
ID=17234629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25225190A Pending JPH04130789A (en) | 1990-09-21 | 1990-09-21 | Mounting structure for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04130789A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001298274A (en) * | 2001-03-13 | 2001-10-26 | Matsushita Electric Ind Co Ltd | Electronic circuit arrangement |
| US8134841B2 (en) | 2006-12-22 | 2012-03-13 | Kabushiki Kaisha Toshiba | Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment |
| US8284562B2 (en) | 2010-03-05 | 2012-10-09 | Samsung Electro-Mechanics Co., Ltd. | Electro device embedded printed circuit board and manufacturing method thereof |
| KR101301373B1 (en) * | 2010-10-25 | 2013-08-29 | 삼성전기주식회사 | Printed circuit board with capacitor embedded therein |
-
1990
- 1990-09-21 JP JP25225190A patent/JPH04130789A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001298274A (en) * | 2001-03-13 | 2001-10-26 | Matsushita Electric Ind Co Ltd | Electronic circuit arrangement |
| US8134841B2 (en) | 2006-12-22 | 2012-03-13 | Kabushiki Kaisha Toshiba | Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment |
| US8284562B2 (en) | 2010-03-05 | 2012-10-09 | Samsung Electro-Mechanics Co., Ltd. | Electro device embedded printed circuit board and manufacturing method thereof |
| KR101301373B1 (en) * | 2010-10-25 | 2013-08-29 | 삼성전기주식회사 | Printed circuit board with capacitor embedded therein |
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