JPH038114B2 - - Google Patents

Info

Publication number
JPH038114B2
JPH038114B2 JP59160152A JP16015284A JPH038114B2 JP H038114 B2 JPH038114 B2 JP H038114B2 JP 59160152 A JP59160152 A JP 59160152A JP 16015284 A JP16015284 A JP 16015284A JP H038114 B2 JPH038114 B2 JP H038114B2
Authority
JP
Japan
Prior art keywords
lead
brazing material
leads
alloy
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59160152A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6139560A (ja
Inventor
Masao Sekihashi
Taiji Nezu
Tetsuo Myoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16015284A priority Critical patent/JPS6139560A/ja
Publication of JPS6139560A publication Critical patent/JPS6139560A/ja
Publication of JPH038114B2 publication Critical patent/JPH038114B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16015284A 1984-07-30 1984-07-30 リ−ド取付け方法 Granted JPS6139560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16015284A JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16015284A JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Publications (2)

Publication Number Publication Date
JPS6139560A JPS6139560A (ja) 1986-02-25
JPH038114B2 true JPH038114B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-05

Family

ID=15708997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16015284A Granted JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Country Status (1)

Country Link
JP (1) JPS6139560A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0698604A (ja) * 1992-09-18 1994-04-12 Tokai Gokin Kogyo Kk 芝生管理機のエアレーション用タイン
CN107481989A (zh) * 2017-06-26 2017-12-15 中国电子科技集团公司第五十五研究所 一种高弯曲疲劳强度陶瓷封装外引线及制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512518Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-04-17 1976-01-24
JPS553821B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-06-22 1980-01-26
JPS5066573U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-10-19 1975-06-14
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device
JPS5611807A (en) * 1979-07-10 1981-02-05 Nippon Mining Co Ironnbase alloy for lead wire material
JPS58123744A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd リ−ドフレ−ム及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6139560A (ja) 1986-02-25

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