JPH0380410A - Thin-film magnetic head and production thereof - Google Patents
Thin-film magnetic head and production thereofInfo
- Publication number
- JPH0380410A JPH0380410A JP21766989A JP21766989A JPH0380410A JP H0380410 A JPH0380410 A JP H0380410A JP 21766989 A JP21766989 A JP 21766989A JP 21766989 A JP21766989 A JP 21766989A JP H0380410 A JPH0380410 A JP H0380410A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- layer
- magnetic body
- gap layer
- magnetic gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000000696 magnetic material Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 abstract description 99
- 239000010408 film Substances 0.000 abstract description 20
- 239000011241 protective layer Substances 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000001312 dry etching Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は薄膜磁気ヘッドおよびその製造方法に係り、
特に磁気ギャップ層を所定の厚さに形成するのに好適な
薄膜磁気ヘッドの構造と製造に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thin film magnetic head and a method for manufacturing the same.
In particular, the present invention relates to the structure and manufacture of a thin film magnetic head suitable for forming a magnetic gap layer to a predetermined thickness.
従来の薄膜磁気ヘッドでは、第６図に示す様に基板（１
）上に下地保護層（２）、第１の磁性層（３）を形成し
、この上に磁気ギャップ層（４）を形成した為絶縁層（
５１Ａ導体コイル（６）、絶縁層（５２）、第２の磁性
層（７）及び保護層（８）を形成している。最近は高密
度記録のためにこの磁気ギャップ層厚が減少傾向にあり
、磁気ギャップ層厚のコントロールがますます重要にな
ってきている。In the conventional thin film magnetic head, the substrate (1
), the base protective layer (2) and the first magnetic layer (3) were formed on top of this, and the magnetic gap layer (4) was formed on top of this, so the insulating layer (
A 51A conductor coil (6), an insulating layer (52), a second magnetic layer (7), and a protective layer (8) are formed. Recently, the thickness of this magnetic gap layer has been decreasing due to high-density recording, and control of the thickness of the magnetic gap layer has become increasingly important.
次にこの従来の薄膜磁気へ・ノドの製造過程における磁
気ギャップ層（４）の膜減りについて説明する。例えば
第７図に導体形成過程における磁気ギャップ層の変化の
様子を示す。導体コイル（６）をめっきで形成する場合
９通常（ａ）の様に下地導電膜（６１）をスパッタ等で
形成し、（ｂ）のように所定のパターンにレジスト（９
）で製版した後めっきを行い。Next, the thinning of the magnetic gap layer (4) in the manufacturing process of this conventional thin film magnetic node will be explained. For example, FIG. 7 shows how the magnetic gap layer changes during the conductor formation process. When forming the conductor coil (6) by plating 9 Usually, as shown in (a), a base conductive film (61) is formed by sputtering or the like, and a resist (9) is formed in a predetermined pattern as shown in (b).
) After plate making, plating is performed.
（ａ）のようにレジスト（９）を除去した後、（ｄ）の
ようにＡｒ（アルゴン）等のドライエツチングにより下
地導電膜（６１）を除去する。このドライエツチング時
に下地導電膜（６１）を完全に除去するようオーバーエ
ツチングするため（ｄ）に示すように磁気ギャップ層（
４）に膜減りｄを生ずる。After removing the resist (9) as shown in (a), the underlying conductive film (61) is removed by dry etching using Ar (argon) or the like as shown in (d). During this dry etching, over-etching is performed to completely remove the underlying conductive film (61), so the magnetic gap layer (61) is etched as shown in (d).
In 4), film reduction d occurs.
この他、磁気ギャップ層（４）は第２の磁性層（７）を
形成して覆われるまでの間、各種のウェット及びドライ
プロセスにさらされるために膜減りを生ずる。In addition, the magnetic gap layer (4) is exposed to various wet and dry processes until it is covered with the second magnetic layer (7), resulting in film thinning.
通常、薄膜ヘッドの製造設計ではこの磁気ギャップ層（
４）の膜減りを考慮し、最終的に所定の膜厚になる様に
予想される減少分だけ厚めにギャップ層を形成するよう
にしている。Normally, the manufacturing design of thin-film heads involves this magnetic gap layer (
In consideration of the film thickness reduction in 4), the gap layer is formed thicker by the expected reduction so that the final film thickness becomes a predetermined thickness.
ところが、実際にはドライエツチングではエツチング装
置のレートが微妙に変わり、ウェットプロセスでも液温
等によりエツチング量が異なってきて、必ずしも磁気ギ
ャップ層が予想された量の膜減りにならず、ギャップ厚
にばらつきが生じるという問題点があった。However, in reality, in dry etching, the rate of the etching equipment changes slightly, and even in wet processes, the etching amount varies depending on the liquid temperature, etc., so the magnetic gap layer does not necessarily decrease by the expected amount, and the gap thickness changes. There was a problem that variations occurred.
この発明は上記の様な問題点を解消するためになされた
もので、磁気ギャップ層の膜減りを少なくでき従って所
定量により近いギャップ厚が得られるような薄膜磁気ヘ
ッドを得ることを目的としている。This invention was made to solve the above-mentioned problems, and its purpose is to obtain a thin-film magnetic head that can reduce the thickness loss of the magnetic gap layer and thus obtain a gap thickness closer to a predetermined value. .
この発明に係る薄膜磁気ヘッドは、磁気ギャップ層を第
１と第２の磁性層の間であって、かつ、導体コイルと第
２の磁性層の間に形成する様にしたものである。In the thin film magnetic head according to the present invention, the magnetic gap layer is formed between the first and second magnetic layers and between the conductor coil and the second magnetic layer.
また、この発明に係る薄膜磁気ヘッドの製造方法は、導
体コイル形成工程後に、磁気ギャップ層を形成する様に
したものである。Further, in the method for manufacturing a thin film magnetic head according to the present invention, a magnetic gap layer is formed after the conductor coil forming step.
磁気ギャップ層を第１と第２の磁性層の間であって、か
つ、導体コイルと第２の磁性層の間に形成したため、磁
気ギャップ層が第２の磁性層によって覆われるまでの間
に受ける膜減りが少なく。Since the magnetic gap layer is formed between the first and second magnetic layers and between the conductor coil and the second magnetic layer, the magnetic gap layer is There is less film loss.
所定量のギャップ厚により近い磁気ギャップ層が得られ
る。A magnetic gap layer closer to a given amount of gap thickness is obtained.
また、磁気ギャップ層の形成を導体コイル形成後とした
ので、導体コイル形成工程で行われるエツチング作業に
影響されないで磁気ギャップ層が形成できる。Furthermore, since the magnetic gap layer is formed after the conductor coil is formed, the magnetic gap layer can be formed without being affected by the etching operation performed in the conductor coil forming process.
以下、この発明の一実施例を第１図を用いて説明する。 An embodiment of the present invention will be described below with reference to FIG.
第１図において、基板（１）の上に下地保護層（２）、
第１の磁性層（３）、絶縁層（５１）、導体コイル（６
）、絶縁層（５２）が順次形成され、この上に磁気ギャ
ップ層（４）を設け、さらにこの上に第２の磁性層（７
）、保護層（８）が形成されている。In FIG. 1, a base protective layer (2) on a substrate (1),
First magnetic layer (3), insulating layer (51), conductor coil (6
), an insulating layer (52) is sequentially formed, a magnetic gap layer (4) is provided on this, and a second magnetic layer (7) is further formed on this.
), a protective layer (8) is formed.
次に第２図を用いて、この薄膜磁気ヘッドの製造方法に
ついて説明する。Next, a method for manufacturing this thin film magnetic head will be explained using FIG.
まず基板（１）の上に下地保護層（２）を形成し１次に
、Ｆｅ−Ｎｉ系の合金（パーマロイ等）で第１の磁性層
（３）を形成する。次に、従来ならばここで磁気ギャッ
プ層（４）を形成していたが、この発明では。First, a base protective layer (2) is formed on a substrate (1), and then a first magnetic layer (3) is formed of an Fe-Ni alloy (permalloy, etc.). Next, conventionally, the magnetic gap layer (4) was formed here, but in this invention.
第１の磁性層（３）の上に絶縁層（５１）を形成する。An insulating layer (51) is formed on the first magnetic layer (3).
そして、従来例で述べたように、導体コイル（６）をめ
っきで形成する場合７通常（ａ）の様に下地導電膜（６
１）をスパッタ等で形成し、（ｂ）のように所定のパタ
ニンにレジスト（９）で製版した後めっきを行い（Ｃ）
のようにレジスト（９）を除去した後、（ｄ）のように
Ａｒ（アルゴン）等のドライエツチングにより下地導電
膜（６１）を除去する。このドライエツチング時に下地
導電膜（６１）を完全に除去するようオーバーエツチン
グするため（ｄ）に示すように第１の磁性層（３）に膜
減りｄを生ずる。As described in the conventional example, when the conductor coil (6) is formed by plating, the base conductive film (6) is normally formed as shown in (a).
1) is formed by sputtering or the like, and as shown in (b), a predetermined pattern is plated with resist (9), followed by plating (C).
After removing the resist (9) as shown in (d), the base conductive film (61) is removed by dry etching using Ar (argon) or the like. During this dry etching, the underlying conductive film (61) is over-etched to completely remove it, so that a film loss d occurs in the first magnetic layer (3) as shown in (d).
この他、第１の磁性層（３）は第２の磁性層（７）を形
成して覆われるまでの間、各種のウェット及びドライプ
ロセスにさらされるために膜減りを生ずる。In addition, the first magnetic layer (3) is exposed to various wet and dry processes until it is covered with the second magnetic layer (7), resulting in film thinning.
通常、薄膜ヘッドの製造設計では第１の磁性層（３）の
厚さは磁気ギヤ・１ブ層（４）の厚さに比べて十分大き
な厚さをもっているため、ここで膜減りｄが生じても、
影響はない。大切なことは磁気ヘッドの記録再生の特性
を決定するギャップ幅（すなわち、磁気ギャップ層（４
）の厚さ）が所定の大きさに保たれることである。次に
、（ｅ）に示すように絶縁層（５２）を形成し、（ｆ）
に示すようにＡ（ｔＯｉ（アルミア）からなる磁気ギャ
ップ層（４）を形成する。そして（ｇ）に示すように第
２の磁性層を形成する。そして、最後に保護層を形成す
れば、第１図に示したような薄膜磁気ヘッドが得られる
。Normally, in the manufacturing design of thin-film heads, the thickness of the first magnetic layer (3) is sufficiently larger than the thickness of the magnetic gear/1B layer (4), so film thinning d occurs here. Even though
There is no effect. What is important is the gap width (i.e., the magnetic gap layer (4
) is maintained at a predetermined value. Next, as shown in (e), an insulating layer (52) is formed, and (f)
As shown in (g), a magnetic gap layer (4) made of A (tOi (alumia)) is formed.Then, as shown in (g), a second magnetic layer is formed.Finally, a protective layer is formed. A thin film magnetic head as shown in FIG. 1 is obtained.
以上のように、この実施例では磁気ギャップ層（４）を
形成した直後に第２の磁性層（７）で覆う様にするため
、磁気ギャップ層（４）の膜減りはなく、従って所定量
のギャップ厚さ分だけの磁気ギャップ層を形成すればよ
い。ヘッド形成過程で磁気ギャップ層（４）がエツチン
グされたりすることがないので、目的のギャップ厚をば
らつき少なく得ることができる。As described above, in this example, the magnetic gap layer (4) is covered with the second magnetic layer (7) immediately after it is formed, so there is no reduction in the thickness of the magnetic gap layer (4), and therefore the predetermined amount of the magnetic gap layer (4) is It is sufficient to form a magnetic gap layer corresponding to the gap thickness of . Since the magnetic gap layer (4) is not etched during the head formation process, the desired gap thickness can be obtained with less variation.
このように、上記実施例では、基板上に形成された下地
保護層、第１の磁性層、磁気ギャップ層導体コイル、絶
縁層、第２の磁性層、及び保護層から成る薄膜磁気ヘッ
ドにおいて、前記導体コイルと第２の磁性層の間に前記
磁気ギャップ層を設けたことを特徴とする薄膜磁気ヘッ
ドを説明した。As described above, in the above embodiment, in the thin film magnetic head formed on the substrate, the thin film magnetic head includes the base protective layer, the first magnetic layer, the magnetic gap layer conductor coil, the insulating layer, the second magnetic layer, and the protective layer. A thin film magnetic head characterized in that the magnetic gap layer is provided between the conductor coil and the second magnetic layer has been described.
なお、上記実施例では導体コイル（６）が−層で形成さ
れている場合につい゛て説明したが、第３図のように絶
縁層を挟んで複数の層から成る場合でも最上の導体コイ
ルと第２の磁性層の間に磁気ギャップ層を形成すれば同
様の効果を得る。In addition, in the above embodiment, the case where the conductor coil (6) is formed of two layers has been explained, but even if it is composed of multiple layers with an insulating layer in between as shown in FIG. A similar effect can be obtained by forming a magnetic gap layer between the second magnetic layers.
また、上記実施例では第２の磁性層形成直前に磁気ギャ
ップ層（４）を形成したが、第４図に示すように、導体
コイル形成直後に磁気ギャップ層（４）を形成し、この
後絶縁層（５２）、第２の磁性層（７）保護層（８）を
順次形成しても磁気ギャップ層の膜減りを少なく抑えら
れる。Further, in the above embodiment, the magnetic gap layer (4) was formed immediately before forming the second magnetic layer, but as shown in FIG. 4, the magnetic gap layer (4) was formed immediately after forming the conductor coil, and then Even if the insulating layer (52), the second magnetic layer (7), and the protective layer (8) are formed in this order, the film loss of the magnetic gap layer can be suppressed to a small extent.
また、第５図に示すように、磁気ギャップ層（４）が十
分導体コイル（６）と第２の磁性層（７）との絶縁をは
たすならば、絶縁層（５２）を設ける必要はないまた。Further, as shown in FIG. 5, if the magnetic gap layer (4) sufficiently insulates the conductor coil (6) and the second magnetic layer (7), there is no need to provide the insulating layer (52). Also.
下地保護層（２）、保護層（８）は、保護のために設け
られるものであるため、保護を重視しない場合はなくて
もよい。The base protective layer (2) and the protective layer (8) are provided for protection, so they may be omitted if protection is not important.
また、上記実施例では、各部が層状に形成されているた
め、「層」という言葉を用いたが膜状、板状であっても
よ＜、「層」のかわりに「膜」や「体」という言葉を用
いてもよい。また９発明の名称として「薄膜磁気ヘッド
」という名前を用いたが、ここでいう「薄膜」とは２層
状、膜状、板状になったものを意味しており、この点で
は厚膜で作られたものでも含まれる。In addition, in the above embodiment, since each part is formed in a layered manner, the word "layer" is used, but it may also be in the form of a film or a plate. ” may be used. In addition, the name "thin film magnetic head" was used as the name of the nine inventions, but the "thin film" here means a two-layered, film-like, or plate-like object, and in this respect, a thick film This also includes things that are made.
以上の様に、この発明によれば、磁気ギャップ層を導体
コイルと第２の磁性層の間に形成したので、ヘッド製造
プロセス中の磁気ギャップ層の膜減りを少なくでき、ギ
ャップ厚のばらつきの少ない薄膜磁気ヘッドを得られる
効果がある。As described above, according to the present invention, since the magnetic gap layer is formed between the conductor coil and the second magnetic layer, the film loss of the magnetic gap layer during the head manufacturing process can be reduced, and the variation in gap thickness can be reduced. This has the effect of making it possible to obtain a thin film magnetic head with a smaller number of thin film magnetic heads.
第１図はこの発明の一実施例による薄膜磁気ヘッドを示
す断面側面図、第２図はこの発明の一実施例による薄膜
磁気ヘッドの製造方法を示す図。
第３図、第４図、第５図はこの発明に係る他の薄膜磁気
ヘッドを示す図、第６図は従来の薄膜磁気ヘッドの断面
側面図、第７図は導体コイル形成プロセスを示す図。
（１）・・・基板 （２）・・・下地保護層（３
）・・・第１の磁性層（４）・・・磁気ギャップ層（５
１）・・・絶縁層 （５２）・・・絶縁層（６）・
・・導体コイル （７）・・・第２の磁性層（８）・・
・保護層
なお９図中、同一符号は同−又は相当部分を示す。FIG. 1 is a cross-sectional side view showing a thin film magnetic head according to an embodiment of the present invention, and FIG. 2 is a diagram showing a method of manufacturing the thin film magnetic head according to an embodiment of the invention. 3, 4, and 5 are diagrams showing another thin film magnetic head according to the present invention, FIG. 6 is a cross-sectional side view of a conventional thin film magnetic head, and FIG. 7 is a diagram showing a conductor coil forming process. . (1)...Substrate (2)...Underlying protective layer (3)
)...First magnetic layer (4)...Magnetic gap layer (5
1)...Insulating layer (52)...Insulating layer (6)
...Conductor coil (7)...Second magnetic layer (8)...
・Protective layer In Figure 9, the same reference numerals indicate the same or corresponding parts.
Claims (2)
、 （ｄ）第１の磁性体と第２の磁性体の間に形成された導
体、 （ｅ）第１の磁性体と第２の磁性体の間に形成され、か
つ、導体と第２の磁性体の間に形成され、第１の磁性体
と第２の磁性体の間に所定の磁気ギャップを形成する磁
気ギャップ層。(1) A thin film magnetic head having the following elements: (a) a substrate; (b) a first magnetic body formed along the substrate; (c) a second magnetic body provided opposite to the first magnetic body. (d) a conductor formed between the first magnetic body and the second magnetic body; (e) a conductor formed between the first magnetic body and the second magnetic body, and a conductor and a conductor formed between the first magnetic body and the second magnetic body; A magnetic gap layer is formed between two magnetic bodies and forms a predetermined magnetic gap between the first magnetic body and the second magnetic body.
磁性体に対向して設けられた第２の磁性体と、第１の磁
性体と第２の磁性体の間に導体と磁気ギャップ層を有す
る薄膜磁気ヘッドの製造方法において、以下の工程を有
することを特徴とする薄膜磁気ヘッドの製造方法。 （ａ）基板にそって第１の磁性体を形成する第１の磁性
体形成工程。 （ｂ）導体を所定の形状に形成する導体形成工程、 （ｃ）導体形成工程後、所定の磁気ギャップ層を形成す
る磁気ギャップ層形成工程、 （ｄ）上記の導体と磁気ギャップ層それぞれの少なくと
も一部をはさむように第１の磁性体に対抗して第２の磁
性体を形成する 第２の磁性体形成工程。(2) A first magnetic body formed along the substrate, a second magnetic body provided opposite to the first magnetic body, and a space between the first magnetic body and the second magnetic body. A method for manufacturing a thin film magnetic head having a conductor and a magnetic gap layer, the method comprising the following steps. (a) A first magnetic material forming step of forming a first magnetic material along the substrate. (b) a conductor forming step of forming a conductor into a predetermined shape; (c) a magnetic gap layer forming step of forming a predetermined magnetic gap layer after the conductor forming step; (d) at least one of the above-mentioned conductors and magnetic gap layers. A second magnetic body forming step of forming a second magnetic body opposite to the first magnetic body so as to sandwich a part of the second magnetic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21766989A JPH0380410A (en) | 1989-08-24 | 1989-08-24 | Thin-film magnetic head and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21766989A JPH0380410A (en) | 1989-08-24 | 1989-08-24 | Thin-film magnetic head and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0380410A true JPH0380410A (en) | 1991-04-05 |
Family
ID=16707866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21766989A Pending JPH0380410A (en) | 1989-08-24 | 1989-08-24 | Thin-film magnetic head and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0380410A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787579A1 (en) | 1996-02-05 | 1997-08-06 | Teijin Limited | Biaxially oriented laminate films and magnetic recording media |
| US5965233A (en) * | 1996-06-06 | 1999-10-12 | Teijin Limited | Laminate film and magnetic recording medium using the same |
| US6124021A (en) * | 1997-05-20 | 2000-09-26 | Teijin Limited | Biaxially oriented laminate film of wholly aromatic polyamide and magnetic recording media |
| US6344257B1 (en) | 1998-04-13 | 2002-02-05 | Teijin Limited | Aromatic polyamide film for high-density magnetic recording media |
| US6461726B1 (en) | 1996-11-29 | 2002-10-08 | Teijin Limited | Laminate film with organic particulate for a magnetic recording medium |
-
1989
- 1989-08-24 JP JP21766989A patent/JPH0380410A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787579A1 (en) | 1996-02-05 | 1997-08-06 | Teijin Limited | Biaxially oriented laminate films and magnetic recording media |
| US5912063A (en) * | 1996-02-05 | 1999-06-15 | Teijin Limited | Biaxially oriented laminate films and magnetic recording media |
| US5965233A (en) * | 1996-06-06 | 1999-10-12 | Teijin Limited | Laminate film and magnetic recording medium using the same |
| US6461726B1 (en) | 1996-11-29 | 2002-10-08 | Teijin Limited | Laminate film with organic particulate for a magnetic recording medium |
| US6124021A (en) * | 1997-05-20 | 2000-09-26 | Teijin Limited | Biaxially oriented laminate film of wholly aromatic polyamide and magnetic recording media |
| US6344257B1 (en) | 1998-04-13 | 2002-02-05 | Teijin Limited | Aromatic polyamide film for high-density magnetic recording media |
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