JPH0379880B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] Regarding the heat radiation and sound insulation structure of an electronic device that is equipped with a fan and is easily mounted on a tower, the purpose of this is to improve the heat radiation effect and reduce noise. It is surrounded by the right side plate, the upper top plate, the back plate, the front plate, and the back plate, and a suction hole for introducing outside air is provided in the upper top plate, an exhaust hole is provided in the back plate, and the exhaust hole is a trapezoid that protrudes from the back plate. , a soundproof sheet is attached to the slope of the trapezoidal exhaust hole and the inner surface of each of the plates.

[Industrial application field]

The present invention relates to a heat dissipation and sound insulation structure for an electronic device mounted on a rack, and in particular, a sound insulation sheet is pasted on the inner surface of a board surrounding the outside of the main body, a suction hole for introducing outside air is provided in the upper top board, and an exhaust board is installed. The present invention relates to a heat dissipation and sound insulation structure for an electronic device that exhausts air.

2. Description of the Related Art In recent years, it is well known that with the rapid progress of integrated circuit technology, the electronic devices constituting these circuits are becoming increasingly smaller and more densely packaged. Therefore, higher density packaging of devices also increases the amount of heat generated per unit area, and forced air cooling using a fan is generally used as a means to efficiently dissipate this heat.

In addition, the input/output devices of electronic devices are also becoming faster in order to pursue higher speeds of the main equipment, and this tendency is particularly strong in magnetic tape devices. The amount of noise caused by
The installation environment for central office/private exchanges, etc. is changing to be installed in offices.

Therefore, reducing equipment noise has become a more important issue than in terms of the working environment, and there is an urgent need to improve the heat radiation and sound insulation structure of electronic devices to improve heat radiation efficiency and reduce noise.

[Conventional technology]

There is a trade-off relationship between heat and noise, and although it is possible to reduce noise by sealing the area around the device, it goes without saying that the temperature inside the device will be high, and noise cannot be prevented if heat radiation is prioritized.

FIG. 3 is a diagram illustrating a conventional electronic device, in which figure a is a front perspective view and figure b is a rear perspective view.

In the figure, as a noise countermeasure for this magnetic tape device, a soundproof sheet 13 is attached only to the front panel 5 (door), and for heat dissipation, outside air is introduced from the left and right side panels 1 and 2 in the direction of the arrow, and it is mounted on the back. Forced air cooling is performed by discharging hot air in the direction of the arrow by the fan unit 16.

[Problem that the invention seeks to solve]

In the case of the above-mentioned conventional heat radiation and sound insulation structure for electronic devices, there is a problem that the sound absorption sheet is simply pasted on the front panel (door), so the noise level is higher than the target value, and the heat radiation is performed only when the devices are connected. When used in a vacuum cleaner, there was a problem in that the heat dissipation efficiency was poor due to the thermal influence of adjacent electronic devices.

[Means for solving problems]

The present invention solves the above problems and provides low noise and
The present invention provides a heat dissipation and sound insulation structure for an electronic device with good heat dissipation efficiency.

The purpose of this design is to improve the heat dissipation effect and reduce noise for the heat dissipation and sound insulation structure of electronic equipment that is equipped with a fan and is mounted on a rack. , surrounded by a back plate, a front plate, and a back plate, a suction hole for introducing outside air is provided in the upper top plate, an exhaust hole is provided in the back plate, and the exhaust hole is a trapezoid that protrudes from the back plate. This is achieved by attaching a soundproof sheet to the slope and the inner surface of each of the plates.

[Effect]

The heat dissipation and sound insulation structure of the above-mentioned electronic device has a trapezoidal exhaust hole that narrows the exhaust flow, and a sound-absorbing area is created by pasting a soundproof sheet on the slope of the trapezoidal exhaust hole and on the inner surface of each plate surrounding the outside of the main body. It also reduces noise by dampening wind noise, and by providing suction holes in the upper top plate for introducing outside air and exhausting air from the back plate, it is independent of adjacent equipment and improves heat dissipation efficiency.

〔Example〕

FIG. 1 is an exploded perspective view illustrating an embodiment of the present invention, in which the same parts as in FIG. 3 are designated by the same reference numerals.

In the figure, there are multiple (2 in the figure) on the upper top plate 9.
A suction hole 14 for introducing outside air is bored in the back plate 1.
2, an exhaust hole 15 is provided at a position corresponding to a fan (not shown), which has a slope with a substantially trapezoidal cross section and is suitable for low noise and efficient cooling. In other words, the rear exhaust port is narrowed into a substantially trapezoidal shape, and the slope increases the sound absorption area and improves the effect of silencing wind noise. Surrounding the main body of the device are a left side plate 7, a right side plate 8, an upper top plate 9 (excluding the suction hole 14 for introducing outside air), a back plate 10,
A sound absorbing sheet 13 is attached to the inner surfaces of the front plate 12 and the back plate 12 (excluding the exhaust holes 15).

Therefore, by operating a forced air cooling fan (not shown), the hot air heated by the heat-generating components installed in the device is forcibly discharged from the exhaust hole 15 formed in the back plate 12. Upper top plate 9
The structure is such that relatively low-temperature outside air is introduced into the apparatus through an outside air introduction suction hole 14 provided in the apparatus.

FIG. 2 shows temperature measurement over time of the electronic device according to the present invention, in which a is a perspective view showing measurement points and b is a table of measurement results.

According to the inventor's experimental results, the device starts operating 60
After a few minutes, the temperature at the center of the front plate 10 was 46.7.
℃, sufficient margin was proven against the long-term reliability compensation temperature of 55℃.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, it is possible to reduce noise, improve the working environment, and improve heat dissipation efficiency, which is extremely effective in improving reliability.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view illustrating an embodiment of the present invention, and FIG. 2 is a diagram showing temperature measurement over time of an electronic device according to the present invention.
3 is a measurement result table, and FIG. 3 is a diagram illustrating a conventional electronic device, where a is a front perspective view and b is a rear perspective view. In the figure, 1 and 7 are left side plates, 2 and 8 are right side plates, 3 and 9 are upper top plates, 4 and 10 are back plates,
5 and 11 are front plates, 6 and 12 are back plates, 13 is a soundproof sheet, 14 is a suction hole for introducing outside air, 15 is an exhaust hole, and 16 is a fan unit, respectively.

Claims (1)

[Scope of Claims] 1. In a heat dissipation and sound insulation structure for an electronic device equipped with a fan and mounted on a rack, the main body of the device is connected to a left side plate 7, a right side plate 8, an upper top plate 9, a back plate 10, a front plate 11, and a back plate. Surrounded by a face plate 12, a suction hole 14 for introducing outside air is provided in the upper top plate 9, and an exhaust hole 15 is provided in the back plate 12, and the exhaust hole 15 has a trapezoidal shape projecting to the outside of the back plate 12. A heat dissipation and sound insulation structure for an electronic device, characterized in that a sound insulation sheet 13 is attached to the slope of the trapezoidal exhaust hole 15 and the inner surface of each of the plates 7 to 12.