JPH0379099A - Printed capacitor - Google Patents
Printed capacitorInfo
- Publication number
- JPH0379099A JPH0379099A JP21803289A JP21803289A JPH0379099A JP H0379099 A JPH0379099 A JP H0379099A JP 21803289 A JP21803289 A JP 21803289A JP 21803289 A JP21803289 A JP 21803289A JP H0379099 A JPH0379099 A JP H0379099A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed
- capacitor
- dielectric material
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 52
- 239000003989 dielectric material Substances 0.000 claims abstract description 34
- 239000011810 insulating material Substances 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント基板上に設けた印刷コンデンサに関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed capacitor provided on a printed circuit board.
従来この種の技術は、単体部品として製作したコンデン
サを使用して、同コンデンサをプリント基板に載置し、
プリント基板の裏面に施した電気回路を構成する導電性
の銅箔パターンに同コンデンサの電極脚を半田−付して
成るものであった。Conventionally, this type of technology uses a capacitor manufactured as a single component and mounts the same capacitor on a printed circuit board.
The electrode legs of the capacitor were soldered to the conductive copper foil pattern that formed the electrical circuit on the back of the printed circuit board.
上記従来の欠点は、単体部品として製作したコンデンサ
を使用することにより、前記コンデンサを半田付する際
の半田付不完全による不良現象の発生、振動・落下衝撃
による前記コンデンサの電極脚部の損傷の発生、前記コ
ンデンサを[置したプリント5板単体の輸送の際に於い
て、他のプリント基板に載置した部品との接触によって
、同接触同志の部品損傷の発生、高さ制限を必要とする
プリント基板の場所に使用出来ない不利な状態の発生、
プリント基板へ前記コンデンサを載置する際に必要容積
の確保が発生、プリント基板へ前記コンデンサを載置す
る際の実装工数の発生、前記コンデンサの発注、購入、
在庫、製造現場への供給等の部品管理費の発生、アフタ
ーサービスの為に余分な前記コンデンサの確保の発生等
の欠点を有していた。The disadvantages of the above-mentioned conventional methods are that, by using a capacitor manufactured as a single component, defects may occur due to incomplete soldering when the capacitor is soldered, and damage to the electrode legs of the capacitor due to vibration or drop impact may occur. When transporting a single printed circuit board on which the capacitor is placed, contact with components mounted on other printed circuit boards may cause damage to the components that come into contact with them, requiring height restrictions. Occurrence of unfavorable conditions where printed circuit boards cannot be used,
Securing the required volume when mounting the capacitor on a printed circuit board, mounting man-hours when mounting the capacitor on the printed circuit board, ordering and purchasing the capacitor,
This method has drawbacks such as parts management costs such as inventory and supply to manufacturing sites, and the need to secure extra capacitors for after-sales service.
上記課題を解決するために本発明では、プリント基板上
に誘電性材料を印刷し、前記誘電性材料上に電気回路を
構成する櫛歯状の第一のパターンと、同第一のパターン
と相対する第二のパターンを設け、前記櫛歯状のパター
ン各kに間隔を持たせて歯合させ、前記誘電性材料の一
端をトリミングし、前記誘電性材料と前記歯合させた櫛
歯状の第一および第二のパターン全体を絶縁材料で覆い
、更に前記全体を積重する様に導電性材料と絶縁材料で
覆ったことを特徴とする印刷コンデンサを提供するもの
である。In order to solve the above problems, in the present invention, a dielectric material is printed on a printed circuit board, and a comb-shaped first pattern constituting an electric circuit is formed on the dielectric material, and a a second pattern is provided, the comb-like patterns k are interlocked with each other at intervals, one end of the dielectric material is trimmed, and the interdigitated comb-like patterns The present invention provides a printed capacitor characterized in that the entire first and second patterns are covered with an insulating material, and the entire pattern is further covered with a conductive material and an insulating material in a stacked manner.
上記構成によれば、プリント基板上面に誘電性材料を印
刷し、前記誘電性材料の上面に電気回路を構成し、導電
性を有する櫛歯状の第一のパターンと、同第一のパター
ンと相対する第二のパターンを誘電性材料からはみ出さ
ない様に積重し、前記櫛歯状のパターン各々に間隔を持
たせて歯合させ、前記歯合した間隔内の誘電性材料の一
端をレーザー光線で連続的にトリミングし、そして前記
誘電性材料と歯合させた櫛歯状の第一および第二のパタ
ーン全体を絶縁材料で覆い、更に前記櫛歯状の全体を積
重する様に導電性材料で覆ってから、また絶縁材料で前
記導電性材料の全体を覆って所定のコンデンサを構成す
る。According to the above configuration, a dielectric material is printed on the top surface of the printed circuit board, an electric circuit is configured on the top surface of the dielectric material, and a first conductive comb-shaped pattern and a The opposing second patterns are stacked so that they do not protrude from the dielectric material, and each of the comb-like patterns is meshed with a gap, and one end of the dielectric material within the meshed gap is The first and second comb-shaped patterns that are successively trimmed with a laser beam and meshed with the dielectric material are covered with an insulating material, and the entire comb-shaped patterns are stacked and conductive. A predetermined capacitor is constructed by covering the conductive material with a conductive material and then covering the entire conductive material with an insulating material.
以下、本発明の実施例を図面を参照しながら説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第1図は本発明の一実施例を示す要部正面図であり、プ
リント基板1は、例えばテレビジョン受像機に於いては
電気回路を構成するコンデンサ、抵抗、IC、トランジ
スタ、ダイオード、ボリューム、スイッチ、チューナ、
フライバックトランス、電源トランス等各種の電気部品
を搭載し、プリント基板1の裏面にはプリント配線した
電気回路を構成し、通電する複数個の銅箔パターンと、
同パターンに前記各種の電気部品を嵌挿する貫通孔を穿
設し、前記各種の電気部品の電極層を前記パターンの貫
通孔に嵌挿後、貫通孔から突出した各種の、電気部品の
電極層とパターンとをデイツプによる自動半田付または
半田鏝による半田付を行って電気的に接続する。FIG. 1 is a front view of essential parts showing an embodiment of the present invention, and a printed circuit board 1 includes capacitors, resistors, ICs, transistors, diodes, volumes, etc. that constitute an electric circuit in a television receiver, for example. switch, tuner,
Various electrical components such as a flyback transformer and a power transformer are mounted, and the back side of the printed circuit board 1 includes a plurality of copper foil patterns that configure a printed wiring electrical circuit and conduct electricity.
Through-holes into which the various electrical components are inserted are formed in the same pattern, and after the electrode layers of the various electrical components are inserted into the through-holes of the pattern, the electrodes of the various electrical components protrude from the through-holes. The layers and patterns are electrically connected by automatic soldering using a dip or by soldering using a soldering iron.
本発明では、上記説明のコンデンサについての一実施例
を説明する。In the present invention, one embodiment of the above-described capacitor will be described.
プリント基板lの一面に電気回路を構成し、プリント基
板1表面に設ける銅箔等の通電性のある材料で出来た櫛
歯状の第一のパターン2と、同第一のパターン2と相対
する第二のパターン3の櫛歯状の範囲内に誘電性材料4
を印刷し、誘電性材料4とプリント基板1との間で密着
性の強度を持たせる為、誘電性材料4を摂氏300度で
5秒間焼結させ、そして誘電性材料4に積重する様に前
記櫛歯状の第一のパターン2と相対する第二のパターン
3を初期に設定した間隔を持たせて歯合する様に敷設す
る。An electric circuit is configured on one side of the printed circuit board 1, and a comb-like first pattern 2 made of an electrically conductive material such as copper foil is provided on the surface of the printed circuit board 1, and is opposed to the first pattern 2. A dielectric material 4 is placed within the comb-shaped range of the second pattern 3.
The dielectric material 4 is sintered at 300 degrees Celsius for 5 seconds, and then stacked on the dielectric material 4 in order to provide strong adhesion between the dielectric material 4 and the printed circuit board 1. The comb-shaped first pattern 2 and the opposing second pattern 3 are laid so as to mesh with each other with an initially set interval.
第2図は同地の一実施例の要部正面図であり、プリント
基板1の一面に電気回路を構成し、プリント基板1表面
に設ける銅箔等の通電性のある材料で出来たスパイラル
状の第三のパターン10と、同第三のパターン10と絡
み合う第四のパターン11の絡み合ったスパイラル状の
範囲内に誘電性材料4を印刷し、誘電性材料4とプリン
)M板1との間で密着性の強度を持たせる為、誘電性材
料4を摂氏300度で5秒間焼結させ、そして誘電性材
料4に積重する様に前記絡み合ったスパイラル状のパタ
ーン10.11を初期に設定した間隔を持たせて絡み合
せる様に敷設する。FIG. 2 is a front view of the essential parts of one embodiment of the same site, in which an electric circuit is constructed on one side of the printed circuit board 1, and a spiral shape made of conductive material such as copper foil is provided on the surface of the printed circuit board 1. The dielectric material 4 is printed within the intertwined spiral-shaped range of the third pattern 10 and the fourth pattern 11 intertwined with the third pattern 10, and the dielectric material 4 and the pudding) M board 1 are printed. The dielectric material 4 is sintered at 300 degrees Celsius for 5 seconds to provide adhesive strength between the layers, and the intertwined spiral patterns 10 and 11 are initially formed so as to be stacked on the dielectric material 4. Lay them so that they are intertwined with each other at the set intervals.
第3図は同一実施例の要部拡大断面図であり、間隔を持
たせて歯合させた櫛歯状の第一のパターン2と相対する
第二のパターン3の間の全体にあって、焼結した誘電性
材料4を′初期に設定した隙間状部7を形成する為、前
記櫛歯状の間隔部分をレーザ光線で連続的にトリミング
し、それから誘電性材料4とパターン2.3の櫛歯状の
範囲を完全に覆う様に第一の絶縁材料5を積重させ、更
に絶縁材料5の上面で絶縁材料5の範囲内にあって、且
つパターン2.3に接触しない位置に導電性材料6を積
重する様に印刷し、また導電性材料6の範囲を完全に覆
う様に第二の絶縁材料8を積重してコンデンサを構成す
る。FIG. 3 is an enlarged cross-sectional view of the main part of the same embodiment, showing the entire area between the comb-like first pattern 2 and the opposing second pattern 3, which are meshed with a gap, The sintered dielectric material 4 is continuously trimmed with a laser beam in order to form the initially set gap-like portions 7, and then the dielectric material 4 and the pattern 2.3 are trimmed continuously with a laser beam. The first insulating material 5 is stacked so as to completely cover the comb-shaped area, and a conductive material is further placed on the upper surface of the insulating material 5 at a position within the range of the insulating material 5 and not in contact with the pattern 2.3. The conductive material 6 is printed so as to be stacked, and the second insulating material 8 is stacked so as to completely cover the range of the conductive material 6, thereby forming a capacitor.
種々のコンデンサを作成するには、櫛歯状の第一のパタ
ーン2と第二のパターン3の幅と、前記パターン2.3
を間隔を持たせて歯合させたことによるこの間隔の幅と
、同櫛歯状の間隔に印刷されている誘電性材料4をレー
ザ光線で連続的にトリミングした隙間状部7の幅と、前
記各々の幅寸法を変えたり、誘電性材料4の厚さと密度
を変化させ、種々のコンデンサの容量に合わせて、それ
ぞれの必要量を変えることにより、電気回路を構成する
容量の違う種々のコンデンサを自由に作成することがで
きるものである。In order to create various capacitors, the width of the comb-like first pattern 2 and the second pattern 3, and the
The width of this gap resulting from meshing with a gap, and the width of the gap-shaped portion 7 obtained by continuously trimming the dielectric material 4 printed in the same comb-like spacing with a laser beam, By changing the width dimension of each of the above, changing the thickness and density of the dielectric material 4, and changing the required amount of each to match the capacitance of the various capacitors, it is possible to create various capacitors with different capacities that constitute an electric circuit. can be created freely.
第一の絶縁材料5は、櫛歯状の第一のパターン2と第二
のパターン3と、前記パターン2.3の間にある誘電性
材料4の表面が手または空気に触れて化学的変化を起こ
して酸化したり、および各々の表面に傷がつくのを防止
したり、次に行う導電性材料6と前記パターン2.3お
よび誘電性材料4との間で、接触または電気的なリーク
が発生し、初期に設定したコンデンサの容量に変化を来
し、本来の目的が変わるのを防止する役割りを持たせて
いる。The first insulating material 5 undergoes a chemical change when the surface of the dielectric material 4 between the comb-shaped first pattern 2 and the second pattern 3 and the pattern 2.3 comes into contact with hands or air. This prevents contact or electrical leakage between the conductive material 6 and the pattern 2.3 and the dielectric material 4, which will be performed next. occurs, causing a change in the initially set capacitance of the capacitor, which serves to prevent the original purpose from changing.
導電性材料6は、前記パターン2.3と、前記パターン
2.3の間にある誘電性材料4で構成されたコンデンサ
に対して、外部からの電波を受けてコンデンサに悪い影
響を与えるのを防ぎ、または同コンデンサから発する電
波により他の電気回路の電気部品に悪い影響を与えるの
を防止し、更に前記パターン2.3と、前記パターン2
.3の間にある誘電性材料4および第一の絶縁材料5に
傷がつき、初期に設定したコンデンサの容量に変化を来
し、本来の目的であるシールド効果が変わるのを防止す
る働きを担っている。The conductive material 6 protects the capacitor made of the pattern 2.3 and the dielectric material 4 between the patterns 2.3 from receiving radio waves from the outside and having a negative effect on the capacitor. or prevent the radio waves emitted from the capacitor from having a bad influence on electrical components of other electrical circuits, and furthermore, the above-mentioned pattern 2.3 and the above-mentioned pattern 2
.. This serves to prevent the dielectric material 4 and the first insulating material 5 between the capacitors 3 and 3 from being scratched, causing a change in the initially set capacitance of the capacitor, and changing the original purpose of the shielding effect. ing.
第二の絶縁材料8は、前記導電性材料6の表面が手また
は空気に触れて化学的変化を起こして酸化したり、およ
び表面に傷がつき前記パターン2.3と、前記パターン
2.3の間にある誘電性材料4で構成され゛たコンデン
サに対して、外部からの電波を受けてコンデンサに悪い
影響を与えるのを防ぎ、または同コンデンサから発する
電波により他の電気回路の電気部品に悪い影響を与える
のを防止し、更に前記パターン2.3と、前記パターン
2.30間にある誘電性材料4および第一の絶縁材料5
に傷がつき、初期に設定したコンデンサの容量に変化を
来し、本来の目的が変わるのを防止する働きを担ってい
る。The second insulating material 8 may undergo a chemical change when the surface of the conductive material 6 comes into contact with hands or air, causing oxidation, or the surface may be scratched, causing the pattern 2.3 and the pattern 2.3 to be damaged. It prevents the capacitor made of dielectric material 4 between the capacitors from receiving radio waves from the outside and having a negative effect on the capacitors, or prevents the radio waves emitted from the capacitors from affecting electrical components in other electrical circuits. The dielectric material 4 and the first insulating material 5 between the pattern 2.3 and the pattern 2.30
It is responsible for preventing damage to the capacitor, which would change the capacitor's initially set capacity and change its original purpose.
プリント基板1の材料は主としてセラミック製、ガラス
布基材エポキシ製を用い、セラミック製は焼結加工から
成り、ガラス布基材エポキシ製は定尺板からの切断加工
で形成されている。The printed circuit board 1 is mainly made of ceramic or glass cloth-based epoxy. The ceramic is formed by sintering, and the glass cloth-based epoxy is formed by cutting from a fixed-length plate.
誘電性材料4の材料は主としてペースト状セラミックか
ら成るものである。The material of the dielectric material 4 is mainly composed of paste ceramic.
導電性材料6の材料は主として銅ペーストから成るもの
である。The material of the conductive material 6 is mainly made of copper paste.
絶縁材料5の材料は主としてエポキシ樹脂、ポリイミド
フィルムから成るものである。The material of the insulating material 5 is mainly composed of epoxy resin and polyimide film.
本発明は、上述のとおり構成されているので、以下に記
載する効果を奏する。Since the present invention is configured as described above, it produces the effects described below.
プリント基板上に容量の蓬う各種印刷コンデンサを設け
たことにより、単体部品として製作したコンデンサを使
用する必要が無くなり、前記コンデンサを半田付する際
の半田付不完全による不良現象が無くなり、そして振動
・落下衝撃による前記コンデンサの電極脚部の損傷の発
生と、前記コンデンサを載置したプリント基板単体の輸
送の際に於いて、他のプリント基板に載置した部品との
接触によって、同接触した部品同志の損傷の発生を防止
でき、更に高さ制限を必要とするプリント基板の場所に
使用出来ないという不利な状態を解決し、プリント基板
へ前記コンデンサを載置する際に必要容積の確保が不要
となり、プリント基板へ前記コンデンサを載置する際の
実装工数と、前記コンデンサの発注、購入、在庫、製造
現場への供給等の部品管理費の削減ができ、アフターサ
ービスの為の余分な前記コンデンサの在庫を削減できる
利点を有している。By providing various printed capacitors with variable capacitance on the printed circuit board, there is no need to use capacitors manufactured as single components, there is no need to use a capacitor manufactured as a single component, there are no defects caused by incomplete soldering when soldering the capacitor, and there is no vibration.・Damage occurred on the electrode legs of the capacitor due to a drop impact, and during transportation of the printed circuit board on which the capacitor was mounted, the same contact occurred due to contact with parts mounted on other printed circuit boards. It is possible to prevent the occurrence of damage between components, and it also solves the disadvantageous situation of not being able to be used in a place where the printed circuit board requires height restrictions, and it is possible to secure the necessary volume when mounting the capacitor on the printed circuit board. This eliminates the need for mounting the capacitor on a printed circuit board, as well as component management costs such as ordering, purchasing, inventorying, and supplying the capacitor to the manufacturing site. This has the advantage of reducing capacitor inventory.
第1図は本発明の一実施例を示す要部正面図、第2図は
同地の一実施例の要部正面図、第3図は同一実施例の要
部拡大断面図である。
図中、1はプリント基板、2は第一のパターン、3は第
二のパターン、4は誘電性材料、5は第一の絶縁材料、
6は導電性材料、7は隙間状部、8は第二の絶縁材料、
10は第三のパターン、11は第四のパターンである。FIG. 1 is a front view of a main part showing an embodiment of the present invention, FIG. 2 is a front view of a main part of an embodiment of the same location, and FIG. 3 is an enlarged sectional view of a main part of the same embodiment. In the figure, 1 is a printed circuit board, 2 is a first pattern, 3 is a second pattern, 4 is a dielectric material, 5 is a first insulating material,
6 is a conductive material, 7 is a gap, 8 is a second insulating material,
10 is the third pattern, and 11 is the fourth pattern.
Claims (7)
性材料上に電気回路を構成する櫛歯状の第一のパターン
と、同第一のパターンと相対する第二のパターンを設け
、前記櫛歯状のパターン各々に間隔を持たせて歯合させ
、前記誘電性材料の一端をトリミングし、前記誘電性材
料と前記歯合させた櫛歯状の第一および第二のパターン
全体を絶縁材料で覆い、更に前記全体を積重する様に導
電性材料と絶縁材料で覆ったことを特徴とする印刷コン
デンサ。(1) printing a dielectric material on a printed circuit board, and providing a first comb-shaped pattern constituting an electric circuit on the dielectric material and a second pattern opposite to the first pattern; The comb-like patterns are interlocked at intervals, one end of the dielectric material is trimmed, and the entire first and second comb-like patterns interlocked with the dielectric material are A printed capacitor characterized by being covered with an insulating material, and further covered with a conductive material and an insulating material in a stacked manner.
項(1)記載の印刷コンデンサー。(2) The printed capacitor according to claim (1), wherein the comb-like pattern has a spiral shape.
(1)又は(2)記載の印刷コンデンサ。(3) The printed capacitor according to claim 1 or 2, wherein the printed circuit board is made of ceramic.
成る請求項(1)又は(2)記載の印刷コンデンサ。(4) The printed capacitor according to claim 1 or 2, wherein the printed circuit board is made of glass cloth-based epoxy.
請求項(1)、(2)、(3)又は(4)記載の印刷コ
ンデンサ。(5) The printed capacitor according to claim (1), (2), (3) or (4), wherein the dielectric material comprises a paste-like ceramic.
)、(2)、(3)、(4)又は(5)記載の印刷コン
デンサ。(6) Claim (1) wherein the conductive material is made of copper paste.
), (2), (3), (4) or (5).
シ樹脂から成る請求項(1)、(2)、(3)、(4)
、(5)又は(6)記載の印刷コンデンサ。(7) Claims (1), (2), (3), (4) in which the insulating material is made of polyimide film or epoxy resin.
, (5) or (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21803289A JPH0379099A (en) | 1989-08-22 | 1989-08-22 | Printed capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21803289A JPH0379099A (en) | 1989-08-22 | 1989-08-22 | Printed capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0379099A true JPH0379099A (en) | 1991-04-04 |
Family
ID=16713572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21803289A Pending JPH0379099A (en) | 1989-08-22 | 1989-08-22 | Printed capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0379099A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008166590A (en) * | 2006-12-28 | 2008-07-17 | Japan Aviation Electronics Industry Ltd | Manufacturing method of wiring and conductive ink for use therein |
-
1989
- 1989-08-22 JP JP21803289A patent/JPH0379099A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008166590A (en) * | 2006-12-28 | 2008-07-17 | Japan Aviation Electronics Industry Ltd | Manufacturing method of wiring and conductive ink for use therein |
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